公开(公告)号：US20170278762A1

公开(公告)日：2017-09-28

申请号：US15468045

申请日：2017-03-23

Applicant: Infineon Technologies AG

Inventor： Angela KESSLER ,  Oliver HAEBERLEN ,  Matteo-Alessandro KUTSCHAK ,  Ralf OTREMBA ,  Petteri PALM ,  Boris PLIKAT ,  Thorsten SCHARF ,  Klaus SCHIESS ,  Fabian SCHNOY ,  Erich SYRI

IPC: H01L21/66 ,  H01L23/498 ,  G01N21/84 ,  H01L23/31

CPC classification number: H01L22/32 ,  G01N21/84 ,  G01N21/95684 ,  G01N2201/12 ,  H01L22/12 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/49866 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24246 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/052 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/1033

Abstract: A package comprising an electronic chip, a laminate type encapsulant in and/or on which the electronic chip is mounted, a solderable electric contact on a solder surface of the package, and a solder flow path on and/or in the package which is configured so that, upon soldering the electric contact with a mounting base, part of solder material flows along the solder flow path towards a surface of the package at which the solder material is optically inspectable after completion of the solder connection between the mounting base and the electric contact.