公开(公告)号：US20210343677A1

公开(公告)日：2021-11-04

申请号：US16862287

申请日：2020-04-29

Applicant: Intel Corporation

Inventor： Frederick W. Atadana ,  Taylor William Gaines ,  Edvin Cetegen ,  Wei Li ,  Hsin-Yu Li ,  Tony Dambrauskas

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29

Abstract: Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.

公开(公告)号：US11710672B2

公开(公告)日：2023-07-25

申请号：US16504734

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Taylor William Gaines ,  Ken Hackenberg ,  Frederick W. Atadana ,  Elah Bozorg-Grayeli

IPC: H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L21/50 ,  H01L21/56 ,  H01L23/42

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/42 ,  H01L2924/16152

Abstract: Embodiments may relate to a method of forming a microelectronic package with an integrated heat spreader (IHS). The method may include placing a solder thermal interface material (STIM) layer on a face of a die that is coupled with a package substrate; coupling the IHS with the STIM layer and the package substrate such that the STIM is between the IHS and the die; performing formic acid fluxing of the IHS, STIM layer, and die; and dispensing, subsequent to the formic acid fluxing, sealant on the package substrate around a periphery of the IHS.

公开(公告)号：US20210013115A1

公开(公告)日：2021-01-14

申请号：US16504734

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Taylor William Gaines ,  Ken Hackenberg ,  Frederick W. Atadana ,  Elah Bozorg-Grayeli

IPC: H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L21/50

Abstract: Embodiments may relate to a microelectronic package comprising an integrated heat spreader (IHS) coupled with a package substrate. A sealant may be positioned between, and physically coupled to, the IHS and the package substrate. The sealant may at least partially extend from a footprint of the IHS. Other embodiments may be described or claimed.

公开(公告)号：US11935861B2

公开(公告)日：2024-03-19

申请号：US16862287

申请日：2020-04-29

Applicant: Intel Corporation

Inventor： Frederick W. Atadana ,  Taylor William Gaines ,  Edvin Cetegen ,  Wei Li ,  Hsin-Yu Li ,  Tony Dambrauskas

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L23/293 ,  H01L23/3157 ,  H01L24/29 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0675 ,  H01L2924/0715

Abstract: Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.

公开(公告)号：US11935799B2

公开(公告)日：2024-03-19

申请号：US16451973

申请日：2019-06-25

Applicant: Intel Corporation

Inventor： Elah Bozorg-Grayeli ,  Taylor William Gaines ,  Frederick W. Atadana ,  Sergio Antonio Chan Arguedas ,  Robert F. Cheney

IPC: H01L23/06 ,  H01L23/053 ,  H01L23/498 ,  H01L23/367 ,  H01L23/42 ,  H01L25/065

CPC classification number: H01L23/06 ,  H01L23/053 ,  H01L23/49816 ,  H01L23/3672 ,  H01L23/42 ,  H01L25/0655

Abstract: Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.