公开(公告)号：US10269695B2

公开(公告)日：2019-04-23

申请号：US15607352

申请日：2017-05-26

Applicant: Intel Corporation

Inventor： Robert F. Cheney ,  Ashish Dhall ,  Suriyakala Ramalingam

IPC: H01L23/04 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.

公开(公告)号：US11935799B2

公开(公告)日：2024-03-19

申请号：US16451973

申请日：2019-06-25

Applicant: Intel Corporation

Inventor： Elah Bozorg-Grayeli ,  Taylor William Gaines ,  Frederick W. Atadana ,  Sergio Antonio Chan Arguedas ,  Robert F. Cheney

IPC: H01L23/06 ,  H01L23/053 ,  H01L23/498 ,  H01L23/367 ,  H01L23/42 ,  H01L25/065

CPC classification number: H01L23/06 ,  H01L23/053 ,  H01L23/49816 ,  H01L23/3672 ,  H01L23/42 ,  H01L25/0655

Abstract: Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.

公开(公告)号：US20170263517A1

公开(公告)日：2017-09-14

申请号：US15607352

申请日：2017-05-26

Applicant: Intel Corporation

Inventor： Robert F. Cheney ,  Ashish Dhall ,  Suriyakala Ramalingam

IPC: H01L23/24 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83007 ,  H01L2224/83051 ,  H01L2224/83104 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.