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公开(公告)号：US09980412B2
公开(公告)日：2018-05-22
申请号：US15280746
申请日：2016-09-29
Applicant: Intel Corporation
Inventor： Bo Qiu , Xi Guo , James C. Raupp , Michael Ahrens , David Pidwerbecki , Steven J. Lofland , George H. Daskalakis , Stacy L. Yee , Mark MacDonald
CPC classification number: H05K7/20509 , G06F1/1681 , G06F1/203 , H05K1/0203 , H05K1/0204 , H05K1/0209 , H05K1/181 , H05K5/0017 , H05K5/0226 , H05K7/20409 , H05K7/20963 , H05K2201/066
Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.
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公开(公告)号：US09971382B2
公开(公告)日：2018-05-15
申请号：US15201097
申请日：2016-07-01
Applicant: Intel Corporation
Inventor： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
CPC classification number: G06F1/1652 , E05D3/022 , E05Y2900/606 , G06F1/1616 , G06F1/1641 , G06F1/1681 , H04M1/0214 , H04M1/0247 , H04M1/0268 , H04M2250/16 , H05K5/0226
Abstract: Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.
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公开(公告)号：US10152100B2
公开(公告)日：2018-12-11
申请号：US15200614
申请日：2016-07-01
Applicant: Intel Corporation
Inventor： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
IPC: G06F1/20 , H05K7/20 , H01L23/367 , G06F1/32 , G06F1/16
Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.
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公开(公告)号：US20180004261A1
公开(公告)日：2018-01-04
申请号：US15200614
申请日：2016-07-01
Applicant: Intel Corporation
Inventor： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
CPC classification number: G06F1/206 , G06F1/1632 , G06F1/203 , G06F1/3203 , G06F1/3234 , H01L23/367 , H05K7/20127 , H05K7/20154 , H05K7/2039
Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.
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