公开(公告)号：US09859255B1

公开(公告)日：2018-01-02

申请号：US15283342

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Jh Yoon ,  Yong She ,  Mao Guo ,  Richard Patten

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L25/18 ,  H01L21/56 ,  H01L25/00 ,  H01L21/768

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/0239 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06551 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/0665 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311

Abstract: Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a package substrate, an electronic component, a mold compound encapsulating the electronic component, and a redistribution layer disposed such that the mold compound is between the package substrate and the redistribution layer. The redistribution layer and the package substrate can be electrically coupled. In addition, the redistribution layer and the electronic component can be electrically coupled to electrically couple the electronic component and the package substrate. Associated systems and methods are also disclosed.