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公开(公告)号：US12255382B2
公开(公告)日：2025-03-18
申请号：US18504376
申请日：2023-11-08
Applicant: Intel Corporation
Inventor： Sidharth Dalmia , Jonathan Jensen , Ozgur Inac , Trang Thai , William J. Lambert , Benjamin Jann
Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
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公开(公告)号：US20240322775A1
公开(公告)日：2024-09-26
申请号：US18187001
申请日：2023-03-21
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Peter Baumgartner , Steven Callender , Richard Geiger , Harald Gossner , Jonathan Jensen
CPC classification number: H03F3/602 , H01L23/66 , H03F3/195 , H03F3/245 , H01L2223/6677 , H03F2200/294 , H03F2200/451
Abstract: Disclosed herein are electronic assemblies, integrated circuit (IC) packages, and communication devices implementing three-dimensional power combiners. An electronic assembly may include a first die, comprising a first transmission line, and a second die, comprising a second transmission line. Each die includes a first face and an opposing second face, and the second die is stacked above the first die so that the first face of the second die is coupled to the second face of the first die. The electronic assembly further includes a first conductive pathway between one end of the first transmission line and a first connection point at the first face of the first die, a second conductive pathway between one end of the second transmission line and a second connection point at the first face of the first die, and a third conductive pathway between the other ends of the first and second transmission lines.
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公开(公告)号：US11870132B2
公开(公告)日：2024-01-09
申请号：US17739880
申请日：2022-05-09
Applicant: Intel Corporation
Inventor： Sidharth Dalmia , Jonathan Jensen , Ozgur Inac , Trang Thai , William J. Lambert , Benjamin Jann
CPC classification number: H01Q1/243 , H01Q1/2283 , H01Q9/0414 , H01L23/66 , H01L2223/6677 , H01L2924/1421 , H01Q1/38
Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
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公开(公告)号：US20190260110A1
公开(公告)日：2019-08-22
申请号：US15939139
申请日：2018-03-28
Applicant: Intel Corporation
Inventor： Trang Thai , Raanan Sover , Noam Kogan , Jonathan Jensen , Richard Perry , William James Lambert , Omer Asaf , Ralph Winzenburg , Daniel R. Cox , Josef Hagn , Sidharth Dalmia
Abstract: Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.
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公开(公告)号：US20250006668A1
公开(公告)日：2025-01-02
申请号：US18342112
申请日：2023-06-27
Applicant: Intel Corporation
Inventor： Carla Moran Guizan , Peter Baumgartner , Michael Langenbuch , Mamatha Yakkegondi Virupakshappa , Jonathan Jensen , Roshini Sachithanandan , Philipp Riess
IPC: H01L23/66 , H01L23/528
Abstract: Waveguide structures are built into integrated circuit devices using standard processing steps for semiconductor device fabrication. A waveguide may include a base, a top, and two side walls. At least one of the walls (e.g., the base or the top) may be formed in a metal layer. The base or top may be patterned to provide a transition to a planar transmission line, such as a coplanar waveguide. The side walls may be formed using vias.
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Patent Agency Ranking
公开(公告)号：US20240387353A1
公开(公告)日：2024-11-21
申请号：US18320763
申请日：2023-05-19
Applicant: Intel Corporation
Inventor： Michael Langenbuch , Carla Moran Guizan , Mamatha Yakkegondi Virupakshappa , Roshini Sachithanandan , Philipp Riess , Jonathan Jensen , Peter Baumgartner , Georg Seidemann
IPC: H01L23/522 , H01L23/66
Abstract: Methods and apparatus are disclosed for implementing capacitors in semiconductor devices. An example semiconductor die includes a first dielectric material disposed between a first metal interconnect and a second metal interconnect; and a capacitor positioned within a via extending through the first dielectric material between the first and second metal interconnects, the capacitor including a second dielectric material disposed in the via between the first and second metal interconnects.
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公开(公告)号：US20220278439A1
公开(公告)日：2022-09-01
申请号：US17739880
申请日：2022-05-09
Applicant: Intel Corporation
Inventor： Sidharth Dalmia , Jonathan Jensen , Ozgur Inac , Trang Thai , William J. Lambert , Benjamin Jann
Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
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公开(公告)号：US20210391853A1
公开(公告)日：2021-12-16
申请号：US17255291
申请日：2018-12-28
Applicant: Intel Corporation
Inventor： Benjamin Jann , Ashoke Ravi , Satwik Patnaik , Elan Banin , Ofir Degani , Nebil Tanzi , Brandon Davis , Igal Kushnir , Jonathan Jensen , Sidharth Dalmia , Peter Pawliuk
Abstract: Techniques are described related to digital radio control, partitioning, and operation. The various techniques described herein enable high-frequency local oscillator signal generation and frequency multiplication using radio-frequency (RF) digital to analog converters (RFDACs). The use of these components and others described throughout this disclosure allow for the realization of various improvements. For example, digital, analog, and hybrid beamforming control are implemented and the newly-enabled digital radio architecture partitioning enables radio components to be pushed to the radio head, allowing for the omission of high frequency cables and/or connectors.
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公开(公告)号：US20250006630A1
公开(公告)日：2025-01-02
申请号：US18342130
申请日：2023-06-27
Applicant: Intel Corporation
Inventor： Carla Moran Guizan , Peter Baumgartner , Thomas Wagner , Georg Seidemann , Michael Langenbuch , Mamatha Yakkegondi Virupakshappa , Jonathan Jensen , Roshini Sachithanandan , Philipp Riess
IPC: H01L23/522 , H01L23/00 , H01L23/528 , H01L25/065
Abstract: Described herein are integrated circuit devices that include conductive structures formed by direct bonding of different components, e.g., direct bonding of two dies, or of a die to a wafer. The conductive structures are formed from a top metallization layer of each of the components. For example, elongated conductive structures at the top metallization layer may be patterned and bonded to form large interconnects for high-frequency and/or high-power signals. In another example, the bonded conductive structures may form radio frequency passive devices, such as inductors or transformers.
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公开(公告)号：US20240072419A1
公开(公告)日：2024-02-29
申请号：US18504376
申请日：2023-11-08
Applicant: Intel Corporation
Inventor： Sidharth Dalmia , Jonathan Jensen , Ozgur Inac , Trang Thai , William J. Lambert , Benjamin Jann
CPC classification number: H01Q1/243 , H01Q1/2283 , H01Q9/0414 , H01Q1/38
Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
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