公开(公告)号：US20230352412A1

公开(公告)日：2023-11-02

申请号：US18221184

申请日：2023-07-12

Applicant: Intel Corporation

Inventor： Yidnekachew S. MEKONNEN ,  Kemel AYGUN ,  Ravindranath V. MAHAJAN ,  Christopher S. BALDWIN ,  Rajasekaran SWAMINATHAN

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/14 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/5381 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/145 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/16235

Abstract: A multiple die package is described that has an embedded bridge to connect the dies. One example is a microelectronic package that includes a package substrate, a silicon bridge embedded in the substrate, a first interconnect having a first plurality of contacts at a first location of the silicon bridge, a second interconnect having a second plurality of contacts at a second location of the silicon bridge, a third interconnect having a third plurality of contacts at a third location of the silicon bridge, and an electrically conductive line in the silicon bridge connecting a contact of the first interconnect, a contact of the second interconnect, and a contact of the third interconnect each to each other.