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Patent Agency Ranking
公开(公告)号：US20250004222A1
公开(公告)日：2025-01-02
申请号：US18345044
申请日：2023-06-30
Applicant: Intel Corporation
Inventor： Debabani Choudhury , Huimin Chen , Eric Gantner , Stephen Hall , Cooper Levy , Shawn Mceuen , Luis Paniagua Acuna , Peter Sagazio , Harry Skinner , Kerry Stevens , Ana Yepes
Abstract: A rotatable circular waveguide structure is described that may comprise circular waveguide sections configured to propagate electromagnetic radiation. The circular waveguide sections may enable data signals to be transmitted between portions of an electronic device, such as a chassis and display portion, which may be rotatable with respect to one another. The rotatable circular waveguide structure may comprise one or more circular waveguide sections that are routed through a hinge of the electronic device, as well as one or more rotatable junctions. The rotatable junctions enable a rotation of circular waveguide sections with respect to one another as the coupled portions of the electronic device are also rotated. The rotatable circular waveguide structure may replace the use of data cables that are conventionally used to carry data signals between portions of an electronic device.
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公开(公告)号：US10003218B2
公开(公告)日：2018-06-19
申请号：US14578422
申请日：2014-12-20
Applicant: Intel Corporation
Inventor： Songnan Yang , Janardhan Narayan , Jonathan Rosenfeld , Kerry Stevens , Patrick Chewning
CPC classification number: H02J50/10 , G06F1/1613 , G06F1/1616 , G06F1/1635 , G06F1/1656 , G06F1/1698 , G06F1/263 , H01F27/02 , H01F27/362 , H01F27/365 , H01F38/14 , H02J7/0042 , H02J7/025
Abstract: This disclosure pertains to wireless power transfer systems, and in particular (but not exclusively), to techniques to improve the coupling efficiency between a power transmitting unit and a power receiving unit within a computing device. The present disclosure includes a system which comprises a computing unit which includes a power receiving unit and a conductive surface. The conductive surface has an opening that is adjacent to the power receiving unit and a slot extending from the opening towards the perimeter of the conductive surface. The computing unit further includes a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base. The system also includes a power transmitting unit adjacent to the computing unit.
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公开(公告)号：US20230016486A1
公开(公告)日：2023-01-19
申请号：US17956486
申请日：2022-09-29
Applicant: Intel Corporation
Inventor： Dong-Ho Han , Bala Subramanya , Greeshmaja Govind , Sun Ye E , Boon Ping Koh , Juha Paavola , Kerry Stevens , Neil Delaplane , Quek Liang Wee
IPC: H01L23/552 , H01L25/065 , H01L23/367 , H01L21/48
Abstract: Electrically conductive compressible gaskets can be employed to ground a heat solution and provide electromagnetic interference (EMI) shielding. A plurality of gaskets may be arranged around the perimeter of an integrated circuit package such as a processor or system on a chip. Each of the gaskets is in contact with a ground plane in the package, and upon contact with a heat sink or cold plate, creates an electrical path that grounds the heat sink or cold plate and thereby minimizes the emission of spurious radio signals. Other embodiments may be described and/or claimed.
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4.发明申请公开(公告)号：US20160204656A1
公开(公告)日：2016-07-14
申请号：US14578422
申请日：2014-12-20
Applicant: Intel Corporation
Inventor： Songnan Yang , Janardhan Narayan , Jonathan Rosenfeld , Kerry Stevens , Patrick Chewning
CPC classification number: H02J50/10 , G06F1/1613 , G06F1/1616 , G06F1/1635 , G06F1/1656 , G06F1/1698 , G06F1/263 , H01F27/02 , H01F27/362 , H01F27/365 , H01F38/14 , H02J7/0042 , H02J7/025
Abstract: This disclosure pertains to wireless power transfer systems, and in particular (but not exclusively), to techniques to improve the coupling efficiency between a power transmitting unit and a power receiving unit within a computing device. The present disclosure includes a system which comprises a computing unit which includes a power receiving unit and a conductive surface. The conductive surface has an opening that is adjacent to the power receiving unit and a slot extending from the opening towards the perimeter of the conductive surface. The computing unit further includes a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base. The system also includes a power transmitting unit adjacent to the computing unit.
Abstract translation: 本公开涉及无线功率传输系统，并且特别地（但不排他地）涉及用于提高计算设备内的功率发射单元和功率接收单元之间的耦合效率的技术。 本公开包括一种包括计算单元的系统，该计算单元包括受电单元和导电表面。 导电表面具有与电力接收单元相邻的开口和从开口向导电表面的周边延伸的槽。 计算单元还包括耦合到电力接收单元的系统基座，其中电力接收单元向系统基础提供电力。 该系统还包括与计算单元相邻的功率发送单元。
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5.发明申请Chassis Design for Wireless-Charging Coil Integration for Computing Systems 审中-公开用于计算系统的无线充电线圈集成的机箱设计公开(公告)号：US20160179140A1
公开(公告)日：2016-06-23
申请号：US14672169
申请日：2015-03-28
Applicant: Intel Corporation
Inventor： Songnan Yang , Janardhan Narayan , Jonathan Rosenfeld , Kerry Stevens , Patrick Chewning
IPC: G06F1/16
CPC classification number: G06F1/1656 , G06F1/1635 , G06F1/26
Abstract: This disclosure pertains to wireless-power transfer systems, and in particular (but not exclusively), to techniques to improve the coupling efficiency between a power transmitting unit and a power receiving unit within a computing system. The present disclosure includes a system which comprises a computing unit and a power transmitting unit adjacent thereto. The computing unit includes a system base, a conductive surface, and a power receiving unit. The conductive surface may have an opening that is adjacent to the power receiving unit and a slot extending from the opening towards the perimeter of the conductive surface. The system base may be coupled to the power receiving unit. The power receiving unit provides power to the system base.
Abstract translation: 本公开涉及无线功率传输系统，特别是（但不排他地）涉及提高计算系统内的功率发射单元和功率接收单元之间的耦合效率的技术。 本公开包括一个包括计算单元和与其相邻的功率发送单元的系统。 计算单元包括系统基座，导电表面和电力接收单元。 导电表面可以具有与电力接收单元相邻的开口和从开口朝向导电表面的周边延伸的狭槽。 系统基座可以耦合到电力接收单元。 电力接收单元为系统基础提供电力。
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