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公开(公告)号：US20160020538A1
公开(公告)日：2016-01-21
申请号：US14333828
申请日：2014-07-17
Applicant: Intel Corporation
Inventor： Ralph W. Jensen , Wesley B. Morgan , James T. Goulding
CPC classification number: H05K7/142 , H05K1/0215 , H05K9/0039
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例涉及可安装到计算机机箱的印刷电路板（PCB）组件的技术和配置。 在一个实例中，PCB组件可以包括具有两个通孔的PCB和PCB安装装置，PCB安装装置可以包括具有非线性部分的U形部件和从非线性部分延伸的两个杆和具有基部的壳体 具有从基部的端部延伸的突起。 杆可以延伸穿过突起，使得U形部件的基部和非直线部分形成开口以接合底盘的安装元件。 杆的延伸部分可以插入并焊接到PCB的通孔，以将PCB电连接到PCB安装装置和底盘以将PCB接地。 可以描述和/或要求保护其他实施例。
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公开(公告)号：US10455731B2
公开(公告)日：2019-10-22
申请号：US15457446
申请日：2017-03-13
Applicant: Intel Corporation
Inventor： Ralph W. Jensen , Jeffory L. Smalley , Kevin J. Ceurter , Devdatta P. Kulkarni , Casey Winkel
IPC: H05K7/20 , G06F1/20 , H01L23/473 , H01L25/10 , H01L23/40
Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.
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Patent Agency Ranking
公开(公告)号：US10021814B2
公开(公告)日：2018-07-10
申请号：US15254535
申请日：2016-09-01
Applicant: Intel Corporation
Inventor： Russell S. Aoki , Alan W. Tate , Ralph W. Jensen
CPC classification number: H05K7/20763 , G06F1/20 , G06F1/203 , H05K7/2039
Abstract: Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.
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公开(公告)号：US12191230B2
公开(公告)日：2025-01-07
申请号：US17213347
申请日：2021-03-26
Applicant: Intel Corporation
Inventor： Ralph W. Jensen , Michael Thomas Crocker , Wesley B. Morgan
IPC: H01L23/433 , H01L25/18
Abstract: Techniques for liquid cooling systems are disclosed. In one embodiment, jet holes in a water block create jets of liquid coolant to be applied to a surface to be cooled, such as a surface of an integrated circuit component. The jets of liquid coolant may disrupt surface boundary layers through turbulence and/or microcavitation, increasing the cooling effect of the liquid coolant. In the illustrative embodiment, negative pressure is applied to a coolant loop of the liquid coolant, which provides several advantages such as being resistant to leaks. In another embodiments, jet holes in a water block create jets of liquid coolant that are directed toward other jets of liquid coolant, which also increases the cooling effect of the liquid coolant.
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公开(公告)号：US20210242108A1
公开(公告)日：2021-08-05
申请号：US17213347
申请日：2021-03-26
Applicant: Intel Corporation
Inventor： Ralph W. Jensen , Michael Thomas Crocker , Wesley B. Morgan
IPC: H01L23/433
Abstract: Techniques for liquid cooling systems are disclosed. In one embodiment, jet holes in a water block create jets of liquid coolant to be applied to a surface to be cooled, such as a surface of an integrated circuit component. The jets of liquid coolant may disrupt surface boundary layers through turbulence and/or microcavitation, increasing the cooling effect of the liquid coolant. In the illustrative embodiment, negative pressure is applied to a coolant loop of the liquid coolant, which provides several advantages such as being resistant to leaks. In another embodiments, jet holes in a water block create jets of liquid coolant that are directed toward other jets of liquid coolant, which also increases the cooling effect of the liquid coolant.
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公开(公告)号：US10168749B2
公开(公告)日：2019-01-01
申请号：US15366799
申请日：2016-12-01
Applicant: Intel Corporation
Inventor： Russell S. Aoki , Devdatta P. Kulkarni , Alan W. Tate , Robin A. Steinbrecher , Ralph W. Jensen
Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.
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公开(公告)号：US09832901B2
公开(公告)日：2017-11-28
申请号：US14333828
申请日：2014-07-17
Applicant: Intel Corporation
Inventor： Ralph W. Jensen , Wesley B. Morgan , James T. Goulding
CPC classification number: H05K7/142 , H05K1/0215 , H05K9/0039
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.
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