公开(公告)号：US20210305731A1

公开(公告)日：2021-09-30

申请号：US16833221

申请日：2020-03-27

Applicant: Intel Corporation

Inventor： Steven A. KLEIN ,  Kuang LIU ,  Srikant NEKKANTY ,  Feroz MOHAMMAD ,  Donald Tiendung TRAN ,  Srinivasa ARAVAMUDHAN ,  Hemant Mahesh SHAH ,  Alexander W. HUETTIS

IPC: H01R12/70 ,  H01R43/04

Abstract: Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

公开(公告)号：US20230309220A1

公开(公告)日：2023-09-28

申请号：US17703704

申请日：2022-03-24

Applicant: Intel Corporation

Inventor： Yang JIAO ,  Kyle DAVIDSON ,  Srinivasa ARAVAMUDHAN ,  Jerry T. HARRIS

IPC: H05K1/03 ,  C08J5/24 ,  C08K5/56

CPC classification number: H05K1/0373 ,  C08J5/244 ,  C08J5/249 ,  C08K5/56 ,  H05K1/181

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a printed circuit board (PCB), where the PCB comprises a glass weave, a resin, and metal organic frameworks (MOFs) disposed within the resin. In an embodiment, a package substrate is coupled to the PCB, and a die is coupled to the package substrate.