公开(公告)号：US20240029539A1

公开(公告)日：2024-01-25

申请号：US18476069

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Viktor Polyanko ,  Vishnu Prasadh Sugumar ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Sandeep Ahuja ,  Tejas Shah

IPC: G08B21/18 ,  H05K7/20

CPC classification number: G08B21/182 ,  H05K7/20263 ,  H05K7/20763 ,  H05K7/20236

Abstract: Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirs are disclosed. An example apparatus includes programmable circuitry to detect, based on outputs of a sensor associated with a first reservoir, a coolant level of the first reservoir, the first reservoir removably coupled to a second reservoir, the first reservoir to supply coolant to the second reservoir, predict, based on the coolant level, a characteristic associated with operation of a cooling device fluidly coupled to the second reservoir, and cause an output to be presented at a user device based on the predicted characteristic.

公开(公告)号：US20240224463A1

公开(公告)日：2024-07-04

申请号：US18147522

申请日：2022-12-28

Applicant: Intel Corporation

Inventor： Ali Kalantarian ,  Saanjali Maharaj ,  Tejas Shah ,  Tamara Low Foon ,  Mirui Wang

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20209 ,  G06F1/206 ,  H05K7/20154 ,  H05K7/20172

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed. An example system includes interface circuitry; first programmable circuitry; and instructions to cause the first programmable circuitry to: determine, based on a first signal output by a first sensor, a first temperature at a first location that is associated with second programmable circuitry; determine, based on a second signal output by a second sensor, a second temperature at a second location that is different than the first location; set a first thermal setpoint for the second programmable circuitry in response to the second temperature failing to satisfy a threshold value; and set a second thermal setpoint for the second programmable circuitry in response to the second temperature satisfying the threshold value, wherein the second thermal setpoint is higher than the first thermal setpoint.

公开(公告)号：US20230345677A1

公开(公告)日：2023-10-26

申请号：US18344620

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Shaorong Zhou ,  Prabhakar Subrahmanyam ,  Guocheng Zhang ,  Tejas Shah ,  Dongrui Xue

IPC: H05K7/20 ,  F28F9/007

CPC classification number: H05K7/20709 ,  F28F9/007

Abstract: Compact rear mounted modular heat exchangers and related methods are disclosed herein. An example apparatus disclosed herein includes a heat exchanger having an air flow inlet and an air flow outlet, a holder frame to receive a component of a server chassis, and a bracket coupled to the holder frame, the bracket to retain the heat exchanger adjacent a rear of the server chassis.