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    LOW POWER OSCILLATOR SYSTEM
    1.
    发明申请
    LOW POWER OSCILLATOR SYSTEM 审中-公开
    低功率振荡器系统

    公开(公告)号：US20160134237A1

    公开(公告)日：2016-05-12

    申请号：US14538299

    申请日：2014-11-11

    Applicant: InvenSense, Inc.

    Inventor： Stephen LLOYD ,  Derek SHAEFFER

    IPC: H03B5/30

    CPC classification number: H03B5/30

    Abstract: In a first aspect, an oscillator is disclosed. The oscillator comprises a digital circuit; and at least one Microelectromechanical system (MEMS) resonator. The oscillator includes a non-volatile memory, the non-volatile memory (NVM) storing a frequency value related to a resonant frequency of the at least one MEMS resonator. The digital circuit utilizes the frequency value stored in the NVM to provide a measure of real time from the MEMS resonator. In a second aspect, a system is disclosed. The system includes a processor and at least one Microelectromechanical system (MEMS) resonator operating at first frequency. The system also includes a memory. The memory storing a frequency value related to a resonant frequency of the at least one MEMS resonator. The frequency value is measured by an outside source. The processor utilizes the frequency value stored in the memory to provide a measure of real time from the MEMS resonator.

    Abstract translation: 在第一方面，公开了一种振荡器。 振荡器包括数字电路; 和至少一个微机电系统（MEMS）谐振器。 振荡器包括非易失性存储器，非易失性存储器（NVM）存储与至少一个MEMS谐振器的谐振频率相关的频率值。 数字电路利用存储在NVM中的频率值来提供来自MEMS谐振器的实时测量。 在第二方面，公开了一种系统。 该系统包括处理器和至少一个以第一频率工作的微机电系统（MEMS）谐振器。 该系统还包括一个内存。 所述存储器存储与所述至少一个MEMS谐振器的谐振频率相关的频率值。 频率值由外部源测量。 处理器利用存储在存储器中的频率值来提供来自MEMS谐振器的实时测量。

    MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY
    2.
    发明申请
    MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY 有权
    具有集成背腔的MEMS声学传感器

    公开(公告)号：US20140264656A1

    公开(公告)日：2014-09-18

    申请号：US14174639

    申请日：2014-02-06

    Applicant: InvenSense, Inc.

    Inventor： Erhan Polatkan ATA ,  Martin LIM ,  Xiang LI ,  Stephen LLOYD ,  Michael Julian DANEMAN

    IPC: B81B7/00

    CPC classification number: B81B7/0061 ,  B81B3/001 ,  B81B2201/0257 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2207/012 ,  H04R19/005

    Abstract: A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.

    Abstract translation: 公开了MEMS器件。 MEMS器件包括具有第一表面和第二表面的第一板; 以及附接到第一基板的锚。 MEMS器件还包括具有附接到第一板的第三表面和第四表面的第二板。 连杆将锚固件连接到第一板，其中第一板和第二板在第一板的第一和第二表面之间存在声压差的情况下移位。 第一板，第二板，连杆和锚固件都包含在由第一基板和第二基板形成的外壳中，其中第一和第二基板中的一个包含通孔，以将第一板的第一表面暴露于 环境。

    DEVICE AND SYSTEM FOR INTEGRATED SENSOR SYSTEM (ISS)
    3.
    发明申请
    DEVICE AND SYSTEM FOR INTEGRATED SENSOR SYSTEM (ISS) 审中-公开
    集成传感器系统（ISS）装置和系统

    公开(公告)号：US20140260704A1

    公开(公告)日：2014-09-18

    申请号：US14201729

    申请日：2014-03-07

    Applicant: InvenSense, Inc.

    Inventor： Stephen LLOYD ,  James LIM

    IPC: B81B7/00

    CPC classification number: B81C1/0023 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/15184 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: The present invention is directed toward a device and system having a sensor hub capable of receiving measurement outputs from a plurality of sensors and processing the measurements for output to other devices, from a single chip arrangement. The sensor hub provides for facilitating efficient communication among the sensors for improved high-level features, such as interpreting gestures or actions according to the context.

    Abstract translation: 本发明涉及一种具有传感器集线器的装置和系统，传感器集线器能够从单个芯片装置接收来自多个传感器的测量输出并且处理测量值以输出到其它装置。 传感器集线器用于促进传感器之间的有效通信，以改善高级特征，例如根据上下文解释手势或动作。

    CHIP SCALE PACKAGE
    5.
    发明申请
    CHIP SCALE PACKAGE 审中-公开
    芯片尺码包

    公开(公告)号：US20160325984A1

    公开(公告)日：2016-11-10

    申请号：US14705616

    申请日：2015-05-06

    Applicant: InvenSense, Inc.

    Inventor： Michael DUEWEKE ,  Stephen LLOYD

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0051 ,  B81B2207/093

    Abstract: A system and method for providing a chip scale package of a MEMS device are disclosed. The system is a chip scale package (CSP) that comprises a substrate, a cap substrate, a MEMS device substrate bonded to and located between both the substrate and the cap substrate, at least one solder ball, and a via support structure coupled to both the at least one solder ball and the substrate, wherein the MEMS device substrate and the cap substrate are mechanically isolated from the at least one solder ball. The method comprises coupling a MEMS device substrate to a cap substrate, forming at least one insulated via through both the MEMS device substrate and the cap substrate, providing singulation of the cap substrate to provide a via support structure that surrounds the at least one insulated via, and coupling at least one solder ball to the via support structure.

    Abstract translation: 公开了一种用于提供MEMS器件的芯片级封装的系统和方法。 该系统是芯片级封装（CSP），其包括基板，盖基板，粘合到基板和盖基板之间并位于其之间的MEMS器件基板，至少一个焊球，以及耦合到两者的通孔支撑结构 所述至少一个焊球和所述衬底，其中所述MEMS器件衬底和所述帽衬底与所述至少一个焊球机械隔离。 该方法包括将MEMS器件衬底耦合到帽衬底，通过MEMS器件衬底和盖衬底两者形成至少一个绝缘通孔，提供帽衬底的单一化以提供通孔支撑结构，该通孔支撑结构围绕至少一个绝缘通孔 并且将至少一个焊球耦合到通孔支撑结构。

    AN ULTRASONIC SENSING DEVICE
    6.
    发明申请
    AN ULTRASONIC SENSING DEVICE 审中-公开

    公开(公告)号：US20190043920A1

    公开(公告)日：2019-02-07

    申请号：US15670976

    申请日：2017-08-07

    Applicant: InvenSense, Inc.

    Inventor： Renata Melamud BERGER ,  Julius Ming-Lin TSAI ,  Stephen LLOYD

    IPC: H01L27/20 ,  G01N29/24 ,  G01N29/28 ,  H01L41/113 ,  B81C1/00 ,  G06K9/00

    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

    MEMS-CMOS-MEMS PLATFORM
    7.
    发明申请
    MEMS-CMOS-MEMS PLATFORM 有权
    MEMS-CMOS-MEMS平台

    公开(公告)号：US20170008760A1

    公开(公告)日：2017-01-12

    申请号：US14797013

    申请日：2015-07-10

    Applicant: InvenSense, Inc.

    Inventor： Stephen LLOYD ,  Ilya GURIN

    IPC: B81B7/00

    CPC classification number: B81B7/0074 ,  B81B7/0054 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00238 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of the second MEMS substrate is attached to the second surface of the CMOS substrate and the second surface of the second MEMS substrate is attached to a packaging substrate. The first MEMS substrate, the CMOS substrate, the second MEMS substrate and the packaging substrate are provided with electrical inter-connects.

    Abstract translation: 公开了一种在垂直堆叠的一个封装中组合MEMS衬底，CMOS衬底和另一个MEMS衬底的封装。 该封装包括传感器芯片，其还包括第一MEMS衬底和具有第一表面和第二表面的CMOS衬底，并且其中第一MEMS衬底附接到CMOS衬底的第一表面。 封装还包括具有第一表面和第二表面的第二MEMS衬底，其中第二MEMS衬底的第一表面附接到CMOS衬底的第二表面，并且第二MEMS衬底的第二表面附接到封装 基质。 第一MEMS基板，CMOS基板，第二MEMS基板和封装基板设有电连接。

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