Micromachined cutting blade formed from {211}-oriented silicon
    1.
    发明授权
    Micromachined cutting blade formed from {211}-oriented silicon 有权
    由{211}取向的硅形成的微加工切割刀片

    公开(公告)号:US07992309B2

    公开(公告)日:2011-08-09

    申请号:US10421025

    申请日:2003-04-21

    Abstract: A cutting blade is disclosed fabricated of micromachined silicon. The cutting blade utilizes a monocrystalline silicon substrate having a {211} crystalline orientation to form one or more cutting edges that are defined by the intersection of {211} crystalline planes of silicon with {111} crystalline planes of silicon. This results in a cutting blade which has a shallow cutting-edge angle θ of 19.5°. The micromachined cutting blade can be formed using an anisotropic wet etching process which substantially terminates etching upon reaching the {111} crystalline planes of silicon. This allows multiple blades to be batch fabricated on a common substrate and separated for packaging and use. The micromachined cutting blade, which can be mounted to a handle in tension and optionally coated for increased wear resistance and biocompatibility, has multiple applications including eye surgery (LASIK procedure).

    Abstract translation: 公开了一种用微加工硅制造的切割刀片。 切割刀片利用具有{211}晶体取向的单晶硅衬底形成一个或多个切割边缘,其由硅的{211}晶面与硅的{111}晶面相交。 这产生了具有浅切割角度的切割刀片; 为19.5°。 可以使用各向异性湿法蚀刻工艺来形成微机械加工的切割刀片,其在达到硅的{111}晶面时基本上终止蚀刻。 这允许在共同的基板上批量制造多个叶片,并分离以用于包装和使用。 可以安装在手柄上的微加工切割刀片可以多次应用,包括眼科手术(LASIK手术),其手柄处于拉伸状态并可任选地涂覆以增加耐磨性和生物相容性。

    Photodetectors with passive thermal radiation control
    2.
    发明授权
    Photodetectors with passive thermal radiation control 有权
    具有被动热辐射控制的光电探测器

    公开(公告)号:US06297496B1

    公开(公告)日:2001-10-02

    申请号:US09447535

    申请日:1999-11-23

    CPC classification number: H01L31/09 C09D5/32 H01L31/02164

    Abstract: A new class of photodetectors which include means for passive shielding against undesired thermal radiation is disclosed. Such devices can substitute in applications currently requiring cooled optical sensors, such as IR detection and imaging. This description is included for purposes of searching, and is not intended to limit or otherwise influence the interpretation of the present invention.

    Abstract translation: 公开了一类新的光电探测器,其包括用于被动屏蔽以防止不期望的热辐射的装置。 这样的设备可以替代目前需要冷却的光学传感器的应用,例如IR检测和成像。 为了搜索而包含该描述,并不意图限制或以其它方式影响本发明的解释。

    Tensile-stressed microelectromechanical apparatus and tiltable micromirrors formed therefrom
    3.
    发明授权
    Tensile-stressed microelectromechanical apparatus and tiltable micromirrors formed therefrom 有权
    拉伸应力微机电装置和由其形成的可倾斜的微反射镜

    公开(公告)号:US07159397B1

    公开(公告)日:2007-01-09

    申请号:US11146811

    申请日:2005-06-07

    Inventor: James G. Fleming

    CPC classification number: G02B26/0866 F03G7/06

    Abstract: A microelectromechanical (MEM) apparatus is disclosed which includes a pair of tensile-stressed actuators suspending a platform above a substrate to tilt the platform relative to the substrate. A tensile stress built into the actuators initially tilts the platform when a sacrificial material used in fabrication of the MEM apparatus is removed. Further tilting of the platform can occur with a change in the ambient temperature about the MEM apparatus, or by applying a voltage to one or both of the tensile-stressed actuators. The MEM apparatus can be used to form a tiltable micromirror or an array of such devices, and also has applications for thermal management within satellites.

    Abstract translation: 公开了一种微机电(MEM)装置,其包括一对拉伸应力致动器,其将平台悬挂在基板上方以使平台相对于基板倾斜。 当除去用于制造MEM装置的牺牲材料时,内置在致动器中的拉伸应力最初倾斜平台。 平台的进一步倾斜可以随着围绕MEM装置的环境温度的变化或通过向一个或两个拉伸应力致动器施加电压而发生。 MEM装置可用于形成可倾斜微镜或这种装置的阵列,并且还具有用于卫星内的热管理的应用。

    Method to fabricate layered material compositions
    4.
    发明授权
    Method to fabricate layered material compositions 有权
    制造分层材料组合物的方法

    公开(公告)号:US06812482B2

    公开(公告)日:2004-11-02

    申请号:US09941820

    申请日:2001-08-28

    CPC classification number: G02B6/1225 B82Y20/00

    Abstract: A new class of processes suited to the fabrication of layered material compositions is disclosed. Layered material compositions are typically three-dimensional structures which can be decomposed into a stack of structured layers. The best known examples are the photonic lattices. The present invention combines the characteristic features of photolithography and chemical-mechanical polishing to permit the direct and facile fabrication of, e.g., photonic lattices having photonic bandgaps in the 0.1-20&mgr; spectral range.

    Abstract translation: 公开了一类适用于分层材料组合物制造的工艺。 分层材料组合物通常是三维结构,其可以分解成一堆结构化层。 最着名的例子是光子晶格。 本发明组合了光刻和化学 - 机械抛光的特征,以允许直接和容易地制造例如在0.1-20mu光谱范围内具有光子带隙的光子晶格。

    Micromachined cutting blade formed from {211}-oriented silicon
    5.
    发明授权
    Micromachined cutting blade formed from {211}-oriented silicon 有权
    由{211}取向的硅形成的微加工切割刀片

    公开(公告)号:US06615496B1

    公开(公告)日:2003-09-09

    申请号:US09564246

    申请日:2000-05-04

    Abstract: A cutting blade is disclosed fabricated of micromachined silicon. The cutting blade utilizes a monocrystalline silicon substrate having a {211} crystalline orientation to form one or more cutting edges that are defined by the intersection of {211} crystalline planes of silicon with {111} crystalline planes of silicon. This results in a cutting blade which has a shallow cutting-edge angle &thgr; of 19.5°. The micromachined cutting blade can be formed using an anisotropic wet etching process which substantially terminates etching upon reaching the {111} crystalline planes of silicon. This allows multiple blades to be batch fabricated on a common substrate and separated for packaging and use. The micromachined cutting blade, which can be mounted to a handle in tension and optionally coated for increased wear resistance and biocompatibility, has multiple applications including eye surgery (LASIK procedure).

    Abstract translation: 公开了一种用微加工硅制造的切割刀片。 切割刀片利用具有{211}晶体取向的单晶硅衬底形成一个或多个切割边缘,其由硅的{211}晶面与硅的{111}晶面相交。 这导致切割刀片具有19.5°的浅切割角度θ。 可以使用各向异性湿法蚀刻工艺来形成微机械加工的切割刀片,其在达到硅的{111}晶面时基本上终止蚀刻。 这允许在共同的基板上批量制造多个叶片,并分离以用于包装和使用。 可以安装在手柄上的微加工切割刀片可以多次应用,包括眼科手术(LASIK手术),其手柄处于拉伸状态并可任选地涂覆以增加耐磨性和生物相容性。

    Use of chemical-mechanical polishing for fabricating photonic bandgap
structures
    6.
    发明授权
    Use of chemical-mechanical polishing for fabricating photonic bandgap structures 失效
    使用化学机械抛光制造光子带隙结构

    公开(公告)号:US5998298A

    公开(公告)日:1999-12-07

    申请号:US67614

    申请日:1998-04-28

    CPC classification number: G02B6/1225 B82Y20/00 G02B6/132 G02B2006/12176

    Abstract: A method is disclosed for fabricating a two- or three-dimensional photonic bandgap structure (also termed a photonic crystal, photonic lattice, or photonic dielectric structure). The method uses microelectronic integrated circuit (IC) processes to fabricate the photonic bandgap structure directly upon a silicon substrate. One or more layers of arrayed elements used to form the structure are deposited and patterned, with chemical-mechanical polishing being used to planarize each layer for uniformity and a precise vertical tolerancing of the layer. The use of chemical-mechanical planarization allows the photonic bandgap structure to be formed over a large area with a layer uniformity of about two-percent. Air-gap photonic bandgap structures can also be formed by removing a spacer material separating the arrayed elements by selective etching. The method is useful for fabricating photonic bandgap structures including Fabry-Perot resonators and optical filters for use at wavelengths in the range of about 0.2-20 .mu.m.

    Abstract translation: 公开了一种用于制造二维或三维光子带隙结构(也称为光子晶体,光子晶格或光子介质结构)的方法。 该方法使用微电子集成电路(IC)工艺在硅衬底上直接制造光子带隙结构。 用于形成结构的一层或多层阵列元件被沉积和图案化,其中使用化学机械抛光来平整每层以获得均匀性和层的精确垂直公差。 使用化学机械平面化可以使光子带隙结构形成在大面积上,层间均匀度约为2%。 气隙光子带隙结构也可以通过去除通过选择性蚀刻分离排列元件的间隔物材料来形成。 该方法可用于制造光子带隙结构,包括法布里 - 珀罗谐振器和用于波长在0.2-20μm范围内的滤光器。

    Bistable microelectromechanical actuator
    7.
    发明授权
    Bistable microelectromechanical actuator 失效
    双稳态微机电致动器

    公开(公告)号:US5867302A

    公开(公告)日:1999-02-02

    申请号:US908639

    申请日:1997-08-07

    Inventor: James G. Fleming

    Abstract: A bistable microelectromechanical (MEM) actuator is formed on a substrate and includes a stressed membrane of generally rectangular shape that upon release assumes a curvilinear cross-sectional shape due to attachment at a midpoint to a resilient member and at opposing edges to a pair of elongate supports. The stressed membrane can be electrostatically switched between a pair of mechanical states having mirror-image symmetry, with the MEM actuator remaining in a quiescent state after a programming voltage is removed. The bistable MEM actuator according to various embodiments of the present invention can be used to form a nonvolatile memory element, an optical modulator (with a pair of mirrors supported above the membrane and moving in synchronism as the membrane is switched), a switchable mirror (with a single mirror supported above the membrane at the midpoint thereof) and a latching relay (with a pair of contacts that open and close as the membrane is switched). Arrays of bistable MEM actuators can be formed for applications including nonvolatile memories, optical displays and optical computing.

    Abstract translation: 双稳态微机电(MEM)致动器形成在基板上并且包括大致矩形形状的应力膜,其在释放时呈现曲线形横截面形状,这是由于在中间点附接到弹性构件,并且在相对的边缘处与一对细长 支持。 应力膜可以在具有镜像对称性的一对机械状态之间静电切换,在执行编程电压之后,MEM致动器保持静止状态。 根据本发明的各种实施例的双稳态MEM致动器可以用于形成非易失性存储元件,光学调制器(在膜上方支撑并且当膜被切换时同步地移动的一对反射镜),可切换镜 具有在其中间点处支撑在膜上方的单个反射镜)和闭锁继电器(具有一对在膜被切换时打开和关闭的触点)。 双稳态MEM致动器的阵列可以形成用于包括非易失性存储器,光学显示器和光学计算的应用。

    Microfabricated bulk wave acoustic bandgap device
    8.
    发明授权
    Microfabricated bulk wave acoustic bandgap device 有权
    微型体声波带隙设备

    公开(公告)号:US07836566B1

    公开(公告)日:2010-11-23

    申请号:US12764700

    申请日:2010-04-21

    CPC classification number: G10K11/20 Y10T29/42

    Abstract: A microfabricated bulk wave acoustic bandgap device comprises a periodic two-dimensional array of scatterers embedded within the matrix material membrane, wherein the scatterer material has a density and/or elastic constant that is different than the matrix material and wherein the periodicity of the array causes destructive interference of the acoustic wave within an acoustic bandgap. The membrane can be suspended above a substrate by an air or vacuum gap to provide acoustic isolation from the substrate. The device can be fabricated using microelectromechanical systems (MEMS) technologies. Such microfabricated bulk wave phononic bandgap devices are useful for acoustic isolation in the ultrasonic, VHF, or UHF regime (i.e., frequencies of order 1 MHz to 10 GHz and higher, and lattice constants of order 100 μm or less).

    Abstract translation: 微制造体声波带隙装置包括嵌入在基质材料膜内的散射体的周期性二维阵列,其中散射体材料具有与基质材料不同的密度和/或弹性常数,并且其中阵列的周期性引起 声波在声带隙内的破坏性干扰。 膜可以通过空气或真空间隙悬浮在基底上方,以提供与基底的声学隔离。 该器件可以使用微机电系统(MEMS)技术制造。 这样的微制造体声波带隙设备可用于超声波,VHF或UHF方式(即1MHz至10GHz及更高​​等级的频率和等级为100μm以下的晶格常数)的声学隔离。

    Microelectromechanical tunable inductor
    9.
    发明授权
    Microelectromechanical tunable inductor 有权
    微机电可调电感

    公开(公告)号:US07710232B1

    公开(公告)日:2010-05-04

    申请号:US11746147

    申请日:2007-05-09

    CPC classification number: H01F21/04 H01F21/005

    Abstract: A microelectromechanical tunable inductor is formed from a pair of substantially-identically-sized coils arranged side by side and coiled up about a central axis which is parallel to a supporting substrate. An in-plane stress gradient is responsible for coiling up the coils which. The inductance provided by the tunable inductor can be electrostatically changed either continuously or in discrete steps using electrodes on the substrate and on each coil. The tunable inductor can be formed with processes which are compatible with conventional IC fabrication so that, in some cases, the tunable inductor can be formed on a semiconductor substrate alongside or on top of an IC.

    Abstract translation: 微电子机械可调电感器由一对并排布置的大致相同尺寸的一对线圈形成,并围绕平行于支撑衬底的中心轴卷绕起来。 面内应力梯度负责卷绕线圈。 由可调电感器提供的电感可以使用基板和每个线圈上的电极以连续或分立的方式静电地改变。 可调电感器可以由与常规IC制造兼容的工艺形成,使得在一些情况下,可调谐电感器可以形成在IC旁边或顶部上的半导体衬底上。

    Method for fabricating a photonic crystal
    10.
    发明授权
    Method for fabricating a photonic crystal 有权
    制造光子晶体的方法

    公开(公告)号:US06869330B2

    公开(公告)日:2005-03-22

    申请号:US10350711

    申请日:2003-01-23

    CPC classification number: H01K1/50 H01K1/04 H01K3/02 H01L33/02

    Abstract: A photonically engineered incandescence is disclosed. The emitter materials and photonic crystal structure can be chosen to modify or suppress thermal radiation above a cutoff wavelength, causing the emitter to selectively emit in the visible and near-infrared portions of the spectrum. An efficient incandescent lamp is enabled thereby. A method for fabricating a three-dimensional photonic crystal of a structural material, suitable for the incandescent emitter, is also disclosed.

    Abstract translation: 公开了一种光子学设计的白炽灯。 可以选择发射极材料和光子晶体结构来修改或抑制高于截止波长的热辐射,使得发射极选择性地发射在光谱的可见光和近红外部分。 因此能够实现高效的白炽灯。 还公开了一种用于制造适用于白炽发射体的结构材料的三维光子晶体的方法。

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