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    Asymmetric High Voltage Capacitor
    2.
    发明申请
    Asymmetric High Voltage Capacitor 有权
    非对称高压电容器

    公开(公告)号：US20130250473A1

    公开(公告)日：2013-09-26

    申请号：US13849806

    申请日：2013-03-25

    Applicant: KEMET ELECTRONICS CORPORATION

    Inventor： John Bultitude ,  Lonnie G. Jones ,  James R. Magee ,  Kitae Park

    IPC: H01G4/30

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  Y10T29/435

    Abstract: An improved multi-layered ceramic capacitor, and method of making the multi-layered ceramic capacitor, is described. The capacitor has an active area comprising first layers and second layers in alternating parallel arrangement with dielectric there between. The first layer comprises a first active electrode and a first floating electrode in a common plane and the second layer comprises a second active electrode and a second floating electrode in a second common plane. At least one shield layer is adjacent to an outermost first layer of the first layers wherein the shield layer has a first projection and the first layers have a second projection wherein the first projection and the second projection are different.

    Abstract translation: 描述了改进的多层陶瓷电容器以及制造多层陶瓷电容器的方法。 电容器具有包括第一层和第二层的有源区域，其间以电介质交替并行布置。 第一层包括公共平面中的第一有源电极和第一浮动电极，第二层包括第二共用平面中的第二有源电极和第二浮动电极。 至少一个屏蔽层与第一层的最外面的第一层相邻，其中屏蔽层具有第一突起，并且第一层具有第二突起，其中第一突起和第二突起不同。

    Asymmetric high voltage capacitor
    4.
    发明授权
    Asymmetric high voltage capacitor 有权
    不对称高压电容器

    公开(公告)号：US09087648B2

    公开(公告)日：2015-07-21

    申请号：US13849806

    申请日：2013-03-25

    Applicant: Kemet Electronics Corporation

    Inventor： John Bultitude ,  Lonnie G. Jones ,  James R. Magee ,  Kitae Park

    IPC: H01G4/30 ,  H01G4/005 ,  H01G4/012 ,  H01G4/232

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  Y10T29/435

    Abstract: An improved multi-layered ceramic capacitor, and method of making the multi-layered ceramic capacitor, is described. The capacitor has an active area comprising first layers and second layers in alternating parallel arrangement with dielectric there between. The first layer comprises a first active electrode and a first floating electrode in a common plane and the second layer comprises a second active electrode and a second floating electrode in a second common plane. At least one shield layer is adjacent to an outermost first layer of the first layers wherein the shield layer has a first projection and the first layers have a second projection wherein the first projection and the second projection are different.

    Abstract translation: 描述了改进的多层陶瓷电容器以及制造多层陶瓷电容器的方法。 电容器具有包括第一层和第二层的有源区域，其间以电介质交替并行布置。 第一层包括公共平面中的第一有源电极和第一浮动电极，第二层包括第二共用平面中的第二有源电极和第二浮动电极。 至少一个屏蔽层与第一层的最外面的第一层相邻，其中屏蔽层具有第一突起，并且第一层具有第二突起，其中第一突起和第二突起不同。

    Integrated EMI filter and surge protection component
    5.
    发明授权
    Integrated EMI filter and surge protection component 有权
    集成EMI滤波器和浪涌保护元件

    公开(公告)号：US08947852B2

    公开(公告)日：2015-02-03

    申请号：US13905247

    申请日：2013-05-30

    Applicant: Kemet Electronics Corporation

    Inventor： Lonnie G. Jones ,  John Bultitude ,  Mark R. Laps ,  James R. Magee ,  Jeffrey W. Bell

    IPC: H01G4/02 ,  H01G5/013 ,  H02H7/00 ,  H01G4/30 ,  H01C1/14 ,  H01C7/12 ,  H01G2/14 ,  H01G4/005

    CPC classification number: H02H7/00 ,  H01C1/14 ,  H01C7/12 ,  H01G2/14 ,  H01G4/005 ,  H01G4/30

    Abstract: An improved electronic component is described. The electronic component has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer electrodes and the second planer internal electrodes. The electronic component further comprises at least one of: an inductor comprising a conductive trace wherein said conductive trace is between the first termination and a third termination; and an overvoltage protection component comprising: a third internal electrode contained within the dielectric and wherein the third internal electrode is electrically connected to the first termination; a fourth internal electrode contained within the ceramic and electrically connected to a fourth termination; and a gap between the third internal electrode and the fourth internal electrode.

    Abstract translation: 描述了改进的电子部件。 电子部件具有电容器，其具有与第一端接电接触的第一平面内部电极和与第二端接电接触的第二平面内部电极。 电介质位于第一平面电极和第二平面内部电极之间。 电子部件还包括以下至少一个：包括导电迹线的电感器，其中所述导电迹线在第一端接和第三端接之间; 以及过电压保护部件，包括：包含在所述电介质内的第三内部电极，并且其中所述第三内部电极电连接到所述第一端子; 第四内部电极，其包含在陶瓷内并电连接到第四端子; 以及第三内部电极和第四内部电极之间的间隙。

    Integrated EMI Filter and Surge Protection Component
    6.
    发明申请
    Integrated EMI Filter and Surge Protection Component 有权
    集成EMI滤波器和浪涌保护元件

    公开(公告)号：US20140198422A1

    公开(公告)日：2014-07-17

    申请号：US13905247

    申请日：2013-05-30

    Applicant: Kemet Electronics Corporation

    Inventor： Lonnie G. Jones ,  John Bultitude ,  Mark R. Laps ,  James R. Magee ,  Jeffrey W. Ball

    IPC: H02H7/00

    CPC classification number: H02H7/00 ,  H01C1/14 ,  H01C7/12 ,  H01G2/14 ,  H01G4/005 ,  H01G4/30

    Abstract: An improved electronic component is described. The electronic component has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer electrodes and the second planer internal electrodes. The electronic component further comprises at least one of: an inductor comprising a conductive trace wherein said conductive trace is between the first termination and a third termination; and an overvoltage protection component comprising: a third internal electrode contained within the dielectric and wherein the third internal electrode is electrically connected to the first termination; a fourth internal electrode contained within the ceramic and electrically connected to a fourth termination; and a gap between the third internal electrode and the fourth internal electrode.

    Abstract translation: 描述了改进的电子部件。 电子部件具有电容器，其具有与第一端接电接触的第一平面内部电极和与第二端接电接触的第二平面内部电极。 电介质位于第一平面电极和第二平面内部电极之间。 电子部件还包括以下至少一个：包括导电迹线的电感器，其中所述导电迹线在第一端接和第三端接之间; 以及过电压保护部件，包括：包含在所述电介质内的第三内部电极，并且其中所述第三内部电极电连接到所述第一端子; 第四内部电极，其包含在陶瓷内并电连接到第四端子; 以及第三内部电极和第四内部电极之间的间隙。

    Method of making a high capacitance multilayer capacitor with high voltage capability
    8.
    发明授权
    Method of making a high capacitance multilayer capacitor with high voltage capability 有权
    制造具有高电压能力的高容量多层电容器的方法

    公开(公告)号：US09490072B2

    公开(公告)日：2016-11-08

    申请号：US14266364

    申请日：2014-04-30

    Applicant: Kemet Electronics Corporation

    Inventor： John Bultitude ,  James R. Magee ,  Lonnie G. Jones

    IPC: H01G4/30 ,  H01G4/005 ,  H01G4/232

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/232 ,  Y10T29/435

    Abstract: A method for making multilayer ceramic capacitors is described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area and subsequently capacitance is lowered in this case.

    Abstract translation: 以高电压能力描述制造多层陶瓷电容器的方法，而不需要涂覆部件来抵抗表面电弧。 一个设计结合了高重叠面积，用于更高的电容，同时保持高电压能力。 这种设计的变化在这种设计中增加了电压能力，而且在现有技术中描述了另一种，尽管在这种情况下重叠区域和随后的电容降低。

    High Capacitance Multilayer with High Voltage Capability
    10.
    发明申请
    High Capacitance Multilayer with High Voltage Capability 有权
    具有高电压能力的高电容多层

    公开(公告)号：US20140230210A1

    公开(公告)日：2014-08-21

    申请号：US14266364

    申请日：2014-04-30

    Applicant: Kemet Electronics Corporation

    Inventor： John Bultitude ,  James R. Magee ,  Lonnie G. Jones

    IPC: H01G4/30

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/232 ,  Y10T29/435

    Abstract: New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area and subsequently capacitance is lowered in this case. These designs are compared to the prior art in examples below.

    Abstract translation: 描述了具有高电压能力的多层陶瓷电容器的新设计，而不需要涂覆部件来抵抗表面电弧。 一个设计结合了高重叠面积，用于更高的电容，同时保持高电压能力。 这种设计的变化在这种设计中增加了电压能力，而且在现有技术中描述了另一种，尽管在这种情况下重叠区域和随后的电容降低。 这些设计在下面的实施例中与现有技术进行比较。

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