公开(公告)号：US11923151B2

公开(公告)日：2024-03-05

申请号：US17148038

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： Galen W. Miller ,  John Bultitude ,  Lonnie G. Jones

IPC: H01G4/38 ,  H01G2/04 ,  H01G2/08 ,  H01G2/10 ,  H01G4/30 ,  H01G13/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H01L25/07 ,  H01L29/16 ,  H01L29/20

CPC classification number: H01G4/38 ,  H01G2/04 ,  H01G2/08 ,  H01G2/10 ,  H01G4/30 ,  H01G13/00 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10424 ,  H05K2201/10545

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

公开(公告)号：US11621126B2

公开(公告)日：2023-04-04

申请号：US17467841

申请日：2021-09-07

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Nathan A. Reed ,  Allen Templeton ,  James R. Magee ,  James Davis ,  Abhijit Gurav ,  Hunter Hayes ,  Hanzheng Guo

IPC: H01G4/12 ,  C04B35/465 ,  H01G4/30 ,  C04B35/50 ,  C04B35/495 ,  H01G4/40

Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.

公开(公告)号：US11432448B2

公开(公告)日：2022-08-30

申请号：US16903979

申请日：2020-06-17

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  John Bultitude

IPC: H05K13/04 ,  H05K3/30 ,  H05K7/12 ,  H01G4/232 ,  H01C1/01 ,  H01G2/06 ,  H01C13/02 ,  H01G4/38 ,  H01C1/14 ,  H05K3/34 ,  H05K1/02 ,  H01G4/30 ,  H01C7/00

Abstract: A method of forming an electronic device is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

公开(公告)号：US11081882B2

公开(公告)日：2021-08-03

申请号：US16513349

申请日：2019-07-16

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Lonnie G. Jones ,  Iain D. Kinnon ,  Nathan A. Reed ,  Jeffrey W. Bell

IPC: H02H9/04

Abstract: A protected electric circuit, and method of protecting a protected circuit is provided. The circuit comprises at least one sensitive device wherein the sensitive device operates at a device voltage and has a maximum voltage capability. At least one light emitting diode electrically connected with the sensitive device wherein the light emitting diode has a first trigger voltage wherein the first trigger voltage is above the device voltage and below the maximum voltage capability. When any said extraneous energy above the first trigger energy is experienced the light emitting diode emits photons thereby converting at least some of the extraneous energy to photon energy.

公开(公告)号：US20190157009A1

公开(公告)日：2019-05-23

申请号：US16259278

申请日：2019-01-28

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude

IPC: H01G4/33 ,  H01G4/005 ,  H01G4/12 ,  H01G4/008 ,  H01G4/30 ,  H01G4/002 ,  H01G4/248 ,  H01G4/232 ,  H01G4/012

Abstract: An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.

公开(公告)号：US10224149B2

公开(公告)日：2019-03-05

申请号：US15264305

申请日：2016-09-13

Applicant: KEMET Electronics Corporation

Inventor： Galen W. Miller ,  John E. McConnell ,  John Bultitude ,  Garry L. Renner

IPC: H01G4/38 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40 ,  H01L23/48 ,  H01L23/52 ,  H05K1/18

Abstract: Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.

公开(公告)号：US10147544B1

公开(公告)日：2018-12-04

申请号：US15601323

申请日：2017-05-22

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Philip M. Lessner ,  Abhijit Gurav

IPC: H01G4/30 ,  H01G2/08 ,  H01G4/258 ,  H01G4/38 ,  H01G4/012 ,  H01G4/12

Abstract: An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.

公开(公告)号：US10068707B2

公开(公告)日：2018-09-04

申请号：US14925056

申请日：2015-10-28

Applicant: Kemet Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  Allen Hill

IPC: H01G4/228 ,  H01G4/30 ,  B23K1/00 ,  B23K1/005 ,  B23K1/008 ,  B23K1/20 ,  B23K35/36 ,  B23K35/02 ,  H01G4/232 ,  H01G4/008 ,  H01G4/12 ,  H01G4/38 ,  B23K101/42 ,  B23K101/40

Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

公开(公告)号：US20170169956A1

公开(公告)日：2017-06-15

申请号：US15264305

申请日：2016-09-13

Applicant: KEMET Electronics Corporation

Inventor： Galen W. Miller ,  John E. McConnell ,  John Bultitude ,  Garry L. Renner

IPC: H01G4/38 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/40 ,  H01L23/48 ,  H01L23/52

Abstract: Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.

公开(公告)号：US09490072B2

公开(公告)日：2016-11-08

申请号：US14266364

申请日：2014-04-30

Applicant: Kemet Electronics Corporation

Inventor： John Bultitude ,  James R. Magee ,  Lonnie G. Jones

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/232 ,  Y10T29/435

Abstract: A method for making multilayer ceramic capacitors is described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area and subsequently capacitance is lowered in this case.

Abstract translation: 以高电压能力描述制造多层陶瓷电容器的方法，而不需要涂覆部件来抵抗表面电弧。 一个设计结合了高重叠面积，用于更高的电容，同时保持高电压能力。 这种设计的变化在这种设计中增加了电压能力，而且在现有技术中描述了另一种，尽管在这种情况下重叠区域和随后的电容降低。