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1.发明申请公开(公告)号：US20170193680A1
公开(公告)日：2017-07-06
申请号：US15396800
申请日：2017-01-02
Applicant: KLA-Tencor Corporation
Inventor： Jing Zhang , Grace Hsiu-Ling Chen , Kris Bhaskar , Keith Wells , Nan Bai , Ping Gu , Lisheng Gao
CPC classification number: G01N21/9501 , G01N2201/12 , G06K9/4628 , G06K9/6273 , G06K9/6857 , G06K2209/19 , G06T3/4053
Abstract: Methods and systems for generating a high resolution image for a specimen from one or more low resolution images of the specimen are provided. One system includes one or more computer subsystems configured for acquiring one or more low resolution images of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a model that includes one or more first layers configured for generating a representation of the one or more low resolution images. The model also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the one or more low resolution images.
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公开(公告)号：US20160290934A1
公开(公告)日：2016-10-06
申请号：US15088081
申请日：2016-03-31
Applicant: KLA-Tencor Corporation
Inventor： Keith Wells , Xiaochun Li , Lisheng Gao , Tao Luo , Markus Huber
CPC classification number: G01N21/9501 , G01N2201/061 , G01N2201/06113 , G01N2201/068 , G06T7/0006 , G06T7/0008 , G06T7/001 , G06T2207/30148 , H01L21/67288 , H01L22/12
Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.
Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一个系统包括被配置为基于印刷在晶片上的设计的信息来生成渲染图像的一个或多个计算机子系统。 渲染图像是由光学检查子系统为印刷在晶片上的设计产生的图像的模拟。 计算机子系统还被配置为将渲染图像与由光学检查子系统产生的晶片的光学图像进行比较。 该设计使用标线印在晶片上。 此外，计算机子系统被配置为基于比较的结果来检测晶片上的缺陷。
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公开(公告)号：US10012599B2
公开(公告)日：2018-07-03
申请号：US15088081
申请日：2016-03-31
Applicant: KLA-Tencor Corporation
Inventor： Keith Wells , Xiaochun Li , Lisheng Gao , Tao Luo , Markus Huber
CPC classification number: G01N21/9501 , G01N2201/061 , G01N2201/06113 , G01N2201/068 , G06T7/0006 , G06T7/0008 , G06T7/001 , G06T2207/30148 , H01L21/67288 , H01L22/12
Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.
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Patent Agency Ranking
4.发明授权公开(公告)号：US10648924B2
公开(公告)日：2020-05-12
申请号：US15396800
申请日：2017-01-02
Applicant: KLA-Tencor Corporation
Inventor： Jing Zhang , Grace Hsiu-Ling Chen , Kris Bhaskar , Keith Wells , Nan Bai , Ping Gu , Lisheng Gao
Abstract: Methods and systems for generating a high resolution image for a specimen from one or more low resolution images of the specimen are provided. One system includes one or more computer subsystems configured for acquiring one or more low resolution images of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a model that includes one or more first layers configured for generating a representation of the one or more low resolution images. The model also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the one or more low resolution images.
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公开(公告)号：US20170194126A1
公开(公告)日：2017-07-06
申请号：US15394792
申请日：2016-12-29
Applicant: KLA-Tencor Corporation
Inventor： Kris Bhaskar , Grace Hsiu-Ling Chen , Keith Wells , Wayne McMillan , Jing Zhang , Scott Young , Brian Duffy
IPC: H01J37/22 , G01N23/225 , G01N21/95 , H01J37/06 , H01J37/28
CPC classification number: H01J37/222 , G01N21/9501 , G01N23/2251 , G01N2201/12 , G01N2223/304 , G01N2223/401 , G01N2223/418 , G01N2223/6116 , G01N2223/646 , G03F7/7065 , H01J37/06 , H01J37/226 , H01J37/28 , H01J2237/24475 , H01J2237/24495 , H01J2237/2817 , H01L22/20
Abstract: Hybrid inspectors are provided. One system includes computer subsystems) configured for receiving optical based output and electron beam based output generated for a specimen. The computer subsystem(s) include one or more virtual systems configured for performing one or more functions using at least some of the optical based output and the electron beam based output generated for the specimen. The system also includes one or more components executed by the computer subsystem(s), which include one or more models configured for performing one or more simulations for the specimen. The computer subsystem(s) are configured for detecting defects on the specimen based on at least two of the optical based output, the electron beam based output, results of the one or more functions, and results of the one or more simulations.
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公开(公告)号：US20170191948A1
公开(公告)日：2017-07-06
申请号：US15391753
申请日：2016-12-27
Applicant: KLA-Tencor Corporation
Inventor： Lisheng Gao , Tao Luo , Keith Wells , Xiaochun Li
IPC: G01N21/956 , G06T7/00 , G01N21/95
CPC classification number: G01N21/95607 , G01N21/9501 , G01N2201/12 , G06T7/001 , G06T2207/20084 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.
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公开(公告)号：US09916965B2
公开(公告)日：2018-03-13
申请号：US15394792
申请日：2016-12-29
Applicant: KLA-Tencor Corporation
Inventor： Kris Bhaskar , Grace Hsiu-Ling Chen , Keith Wells , Wayne McMillan , Jing Zhang , Scott Young , Brian Duffy
CPC classification number: H01J37/222 , G01N21/9501 , G01N23/2251 , G01N2201/12 , G01N2223/304 , G01N2223/401 , G01N2223/418 , G01N2223/6116 , G01N2223/646 , G03F7/7065 , H01J37/06 , H01J37/226 , H01J37/28 , H01J2237/24475 , H01J2237/24495 , H01J2237/2817 , H01L22/20
Abstract: Hybrid inspectors are provided. One system includes computer subsystem(s) configured for receiving optical based output and electron beam based output generated for a specimen. The computer subsystem(s) include one or more virtual systems configured for performing one or more functions using at least some of the optical based output and the electron beam based output generated for the specimen. The system also includes one or more components executed by the computer subsystem(s), which include one or more models configured for performing one or more simulations for the specimen. The computer subsystem(s) are configured for detecting defects on the specimen based on at least two of the optical based output, the electron beam based output, results of the one or more functions, and results of the one or more simulations.
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公开(公告)号：US09915625B2
公开(公告)日：2018-03-13
申请号：US15391753
申请日：2016-12-27
Applicant: KLA-Tencor Corporation
Inventor： Lisheng Gao , Tao Luo , Keith Wells , Xiaochun Li
IPC: G01N21/95 , G01N21/956 , G06T7/00
CPC classification number: G01N21/95607 , G01N21/9501 , G01N2201/12 , G06T7/001 , G06T2207/20084 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.
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