公开(公告)号：US10605744B2

公开(公告)日：2020-03-31

申请号：US15865130

申请日：2018-01-08

Applicant: KLA-Tencor Corporation

Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

公开(公告)号：US09523646B2

公开(公告)日：2016-12-20

申请号：US15158413

申请日：2016-05-18

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Rudolf Brunner ,  Lisheng Gao ,  Robert M. Danen ,  Lu Chen

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/95676 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/068 ,  G01N2201/12

Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

公开(公告)号：US20130250287A1

公开(公告)日：2013-09-26

申请号：US13900465

申请日：2013-05-22

Applicant: KLA-Tencor Corporation

Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

公开(公告)号：US09347891B2

公开(公告)日：2016-05-24

申请号：US14381315

申请日：2013-03-01

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Rudolf Brunner ,  Lisheng Gao ,  Robert M. Danen ,  Lu Chen

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/95676 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/068 ,  G01N2201/12

Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

Abstract translation: 在光学检查工具中，照明光圈在照明光瞳区域的多个孔径位置中的每一个处打开，一次一个地穿过照明瞳孔区域。 对于每个光圈打开位置，入射光束被引向照明光瞳区域，以便选择性地将照射光束的相应光束束以对应于一个或多个入射角的一组对应于样品的输出光束和输出光束 检测来自样品的响应于在相应的一个或多个入射角度的入射光束入射到样品上的相应射线束。 基于针对每个孔径位置检测的输出光束来确定每个光圈位置的缺陷检测特性。 基于针对每个孔位置确定的缺陷检测特性来确定最佳孔径配置。

公开(公告)号：US20160266047A1

公开(公告)日：2016-09-15

申请号：US15158413

申请日：2016-05-18

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Rudolf Brunner ,  Lisheng Gao ,  Robert M. Danen ,  Lu Chen

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/95676 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/068 ,  G01N2201/12

Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

公开(公告)号：US20180202943A1

公开(公告)日：2018-07-19

申请号：US15865130

申请日：2018-01-08

Applicant: KLA-Tencor Corporation

Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

公开(公告)号：US09880107B2

公开(公告)日：2018-01-30

申请号：US13900465

申请日：2013-05-22

Applicant: KLA-Tencor Corporation

Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

IPC: G01N21/00 ,  G01N21/95 ,  H01L21/66 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

公开(公告)号：US20150015874A1

公开(公告)日：2015-01-15

申请号：US14381315

申请日：2013-03-01

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Rudolf Brunner ,  Lisheng Gao ,  Robert M. Danen ,  Lu Chen

IPC: G01N21/88

CPC classification number: G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/95676 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/068 ,  G01N2201/12

Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

Abstract translation: 在光学检查工具中，照明光圈在照明光瞳区域的多个孔径位置中的每一个处打开，一次一个地穿过照明瞳孔区域。 对于每个光圈打开位置，入射光束被引向照明光瞳区域，以便选择性地将照射光束的相应光束束以对应于一个或多个入射角的一组对应于样品的输出光束和输出光束 检测来自样品的响应于在相应的一个或多个入射角度的入射光束入射到样品上的相应射线束。 基于针对每个孔径位置检测的输出光束来确定每个光圈位置的缺陷检测特性。 基于针对每个孔位置确定的缺陷检测特性来确定最佳孔径配置。