公开(公告)号：US09110020B2

公开(公告)日：2015-08-18

申请号：US14450018

申请日：2014-08-01

Applicant: KLA-Tencor Corporation

Inventor： Hidong Kwak ,  Ward Dixon ,  Torsten R. Kaack ,  Ning-Yi Neil Wang ,  Jagjit Sandhu

IPC: G01B11/28 ,  G01N21/55 ,  G01B11/06 ,  H01L21/67 ,  B08B5/02 ,  G01N21/21 ,  H01L21/66

CPC classification number: G01N21/55 ,  B08B5/02 ,  G01B11/06 ,  G01B11/0641 ,  G01B2210/56 ,  G01N21/21 ,  H01L21/67017 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.

Abstract translation: 公开了一种用清洗气体清洗晶片表面的一部分的局部清洗工具。 清洗工具包括净化室，其构造成在清洗室的空腔内容纳清洗气体，清洗室的表面的可渗透部分构造成将清洗气体从腔的腔扩散到晶片表面的一部分 以及被配置为将从照明源接收的照明传送到晶片表面的该部分的测量位置并且还被配置为将从测量位置反射的照射传输到检测器的孔。

公开(公告)号：US11378451B2

公开(公告)日：2022-07-05

申请号：US15672120

申请日：2017-08-08

Applicant: KLA-Tencor Corporation

Inventor： Tianhan Wang ,  Aaron Rosenberg ,  Dawei Hu ,  Alexander Kuznetsov ,  Manh Dang Nguyen ,  Stilian Pandev ,  John Lesoine ,  Qiang Zhao ,  Liequan Lee ,  Houssam Chouaib ,  Ming Di ,  Torsten R. Kaack ,  Andrei V. Shchegrov ,  Zhengquan Tan

IPC: G01J3/18 ,  G01J3/28 ,  G01N21/55 ,  G01N21/956 ,  G01N21/21 ,  G01N21/25 ,  G01N21/88 ,  G01N21/84

Abstract: A spectroscopic metrology system includes a spectroscopic metrology tool and a controller. The controller generates a model of a multilayer grating including two or more layers, the model including geometric parameters indicative of a geometry of a test layer of the multilayer grating and dispersion parameters indicative of a dispersion of the test layer. The controller further receives a spectroscopic signal of a fabricated multilayer grating corresponding to the modeled multilayer grating from the spectroscopic metrology tool. The controller further determines values of the one or more parameters of the modeled multilayer grating providing a simulated spectroscopic signal corresponding to the measured spectroscopic signal within a selected tolerance. The controller further predicts a bandgap of the test layer of the fabricated multilayer grating based on the determined values of the one or more parameters of the test layer of the fabricated structure.

公开(公告)号：US20190041266A1

公开(公告)日：2019-02-07

申请号：US15672120

申请日：2017-08-08

Applicant: KLA-Tencor Corporation

Inventor： Tianhan Wang ,  Aaron Rosenberg ,  Dawei Hu ,  Alexander Kuznetsov ,  Manh Dang Nguyen ,  Stilian Pandev ,  John Lesoine ,  Qiang Zhao ,  Liequan Lee ,  Houssam Chouaib ,  Ming Di ,  Torsten R. Kaack ,  Andrei V. Shchegrov ,  Zhengquan Tan

IPC: G01J3/18 ,  G01J3/28

Abstract: A spectroscopic metrology system includes a spectroscopic metrology tool and a controller. The controller generates a model of a multilayer grating including two or more layers, the model including geometric parameters indicative of a geometry of a test layer of the multilayer grating and dispersion parameters indicative of a dispersion of the test layer. The controller further receives a spectroscopic signal of a fabricated multilayer grating corresponding to the modeled multilayer grating from the spectroscopic metrology tool. The controller further determines values of the one or more parameters of the modeled multilayer grating providing a simulated spectroscopic signal corresponding to the measured spectroscopic signal within a selected tolerance. The controller further predicts a bandgap of the test layer of the fabricated multilayer grating based on the determined values of the one or more parameters of the test layer of the fabricated structure.

公开(公告)号：US20150029494A1

公开(公告)日：2015-01-29

申请号：US14450018

申请日：2014-08-01

Applicant: KLA-Tencor Corporation

Inventor： Hidong Kwak ,  Ward Dixon ,  Torsten R. Kaack ,  Ning-Yi Neil Wang ,  Jagjit Sandhu

IPC: G01N21/55 ,  G01B11/06 ,  G01N21/21

CPC classification number: G01N21/55 ,  B08B5/02 ,  G01B11/06 ,  G01B11/0641 ,  G01B2210/56 ,  G01N21/21 ,  H01L21/67017 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.

Abstract translation: 公开了一种用清洗气体清洗晶片表面的一部分的局部清洗工具。 清洗工具包括净化室，其构造成在清洗室的空腔内容纳清洗气体，清洗室的表面的可渗透部分构造成将清洗气体从腔的腔扩散到晶片表面的一部分 以及被配置为将从照明源接收的照明传送到晶片表面的该部分的测量位置并且还被配置为将从测量位置反射的照射传输到检测器的孔。