公开(公告)号：US08125782B2

公开(公告)日：2012-02-28

申请号：US12510874

申请日：2009-07-28

Applicant: Kaveh Azar ,  Joseph P. Mennucci ,  Carlo Mandrone

Inventor： Kaveh Azar ,  Joseph P. Mennucci ,  Carlo Mandrone

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract translation: 提供散热器组件安装座。 通常本发明具有框架夹和弹簧夹。 框架夹具具有一个或多个向内延伸的突出部和两个或更多个垂直延伸的侧部。 一个或多个突片的尺寸设置成适合于可移除地耦合到发热装置。 两个或更多个垂直延伸的侧部之间的距离被设计成保持散热器的基部并防止散热器的水平运动。 弹簧夹耦合到框架夹子并且具有尺寸适于产生将散热器压靠在发热装置上的垂直力的弹簧偏压。

公开(公告)号：US06510053B1

公开(公告)日：2003-01-21

申请号：US09663736

申请日：2000-09-15

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K720

CPC classification number: H05K7/20636 ,  H05K1/0203 ,  H05K1/144 ,  H05K2201/043 ,  H05K2201/09745 ,  H05K2201/1056

Abstract: A circuit board cooling system includes a thermally conductive element sandwiched between two circuit boards. The thermally conductive element of this thermal sandwich conducts heat away from both of the attached circuit cards. The thermally conductive element may be a solid slab of thermally conductive material, such as copper, it may be a hollow, substantially planar thermal conductor with an internally circulating cooling fluid, or it may be a substantially planar heat pipe, for example.

Abstract translation: 电路板冷却系统包括夹在两个电路板之间的导热元件。 该热夹层的导热元件将热量从两个连接的电路卡导出。 导热元件可以是诸如铜的导热材料的实心板，它可以是具有内部循环冷却流体的中空的，基本上平面的热导体，或者它可以是例如基本上平面的热管。

公开(公告)号：US06263955B1

公开(公告)日：2001-07-24

申请号：US09357562

申请日：1999-07-23

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K720

CPC classification number: H01L23/467 ,  F28F3/02 ,  F28F13/06 ,  F28F2215/08 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49915 ,  H01L2924/00

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. Fluid flow enters the fin field at an inlet region and flows through the channels to an outlet region, i.e. from left to right across the figures illustrated. The heat exchanger of the present invention comprises a fin field having an open region formed by the novel configuration and layout of the individual fins forming the fin field. The open region may be formed in various sections of the heat exchanger for achieving the desired results. The open region reduces friction on fluid passing through the channels of the fin field. In an alternative embodiment, the heat exchanger may comprise a flow guide extending across a top portion of the heat exchanger, wherein the flow guide has a plurality of turbulators for disturbing the fluid flow above the fin field and removing stagnation of fluid from the top region of the fin field.

Abstract translation: 公开了一种用于从发热部件散热的热交换器。 热交换器包括与部件热连通的导热基座，固定到基座的多个导热板翅片，其中板翅片限定翅片场和通道，以及用于控制翅片场内的流体流动的流体控制。 流体流入入口区域的翅片场，并且通过通道流过出口区域，即从左到右穿过所示图示。 本发明的热交换器包括具有通过形成翅片场的各个翅片的新颖构造和布局形成的开口区域的翅片场。 开放区域可以形成在热交换器的各个部分中以实现期望的结果。 开放区域减少通过翅片场通道的流体的摩擦。 在替代实施例中，热交换器可以包括横跨热交换器的顶部延伸的流动引导件，其中流动引导件具有多个扰流器，用于扰乱在翅片区域上方的流体流动并且消除流体从顶部区域的停滞 的翅膀领域。

公开(公告)号：US5940780A

公开(公告)日：1999-08-17

申请号：US536516

申请日：1995-09-29

Applicant: Kaveh Azar ,  Mehmet Mustafa

Inventor： Kaveh Azar ,  Mehmet Mustafa

IPC: G01D1/00 ,  G01D11/00

CPC classification number: G01D1/00

Abstract: A device is disclosed for interfacing with a variety of transducer types to generate a measurement value of a certain property. The device has at least one sensor block that in turn has at least one sensor channel containing sensor circuitry. The sensor circuitry is configured to cooperate with a particular transducer to generate an electrical signal representing the property. Connected to the sensor block is a control block. The control block has configuration circuitry for enabling the sensor circuitry. Additionally, the control block contains conversion circuitry for converting the signal to the measurement value using a conversion equation. A user interface provides the means for inputting configuration information and outputting the measurement value. In one embodiment, the sensor block also contains a multiplicity of sensor channels and multiplexing circuitry for enabling the control block to address each sensor channel individually. The device may also have a plurality of circuits in each sensor circuit. The configuration circuitry enables a selection of these circuits according to the transducer used and the measurement desired. This embodiment may also have conversion circuitry that is responsive to the configuration circuitry such that the conversion equation relates to the selection.

Abstract translation: 公开了用于与各种换能器类型接口以产生某一特性的测量值的装置。 该装置具有至少一个传感器块，该传感器块又具有包含传感器电路的至少一个传感器通道。 传感器电路被配置为与特定换能器协作以产生表示该特性的电信号。 连接到传感器块是一个控制块。 控制块具有用于启用传感器电路的配置电路。 此外，控制块包含用于使用转换方程将信号转换为测量值的转换电路。 用户接口提供用于输入配置信息并输出测量值的装置。 在一个实施例中，传感器块还包含多个传感器通道和多路复用电路，用于使控制块能够单独寻址每个传感器通道。 该装置还可以在每个传感器电路中具有多个电路。 配置电路使得能够根据所使用的换能器和所需的测量来选择这些电路。 该实施例还可以具有响应于配置电路的转换电路，使得转换方程与选择有关。

公开(公告)号：US5304846A

公开(公告)日：1994-04-19

申请号：US69683

申请日：1993-06-01

Applicant: Kaveh Azar ,  Richard E. Caron

Inventor： Kaveh Azar ,  Richard E. Caron

IPC: F28F3/02 ,  H01L23/367 ,  H01L23/373 ,  H01L23/467 ,  H05K7/20 ,  H01L23/02 ,  H01L25/04

CPC classification number: F28F3/02 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/3738 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011

Abstract: Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels into which coolant flow is directed. The thermal resistance of the heat sink is optimized by setting fin thickness and channel width parameters to appropriate values. The heat sink may be attached in a heat conductive manner to a heat producing electronic component. One or more of these heat sinked components may be laid out in an in-line or staggered arrangement on a support in the form of a circuit pack. Cooling fluid is delivered to the circuit pack in a variety of ways to cool the heat sinked components. A method of determining the optimum fin thickness and channel width parameters involves determining a relationship between total thermal resistance of the heat sink and combinations of fin thickness and channel width parameters. A contour plot is produced in accordance with the relationship referred to above. The contour plot shows regions of optimum heat dissipation for heat sinks in accordance with the geometry identified here.

Abstract translation: 通过电子电路操作产生的热量的消散可以通过散热器来改善，该散热器包括一个平底座，多个垂直散热片从该基座延伸。 散热片彼此平行并且限定冷却剂流被引向其中的多个平行通道。 通过将翅片厚度和通道宽度参数设置为适当的值来优化散热器的热阻。 散热器可以以导热的方式附接到发热电子部件。 这些散热部件中的一个或多个可以以线性或交错布置布置在电路板形式的支撑件上。 冷却液以各种方式输送到电路板，以冷却散热部件。 确定最佳翅片厚度和通道宽度参数的方法包括确定散热器的总热阻与翅片厚度和通道宽度参数的组合之间的关系。 根据上述关系产生等高线图。 轮廓图显示了根据此处所标识的几何形状，散热片的最佳散热区域。

公开(公告)号：US5121290A

公开(公告)日：1992-06-09

申请号：US542613

申请日：1990-06-25

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H01L23/467 ,  H05K1/14 ,  H05K7/20

CPC classification number: H05K1/144 ,  H01L23/467 ,  H01L2924/0002

Abstract: Disclosed is an apparatus for providing forced air cooling of components mounted on circuit boards in a stacked configuration. A plurality of perforations is provided in the circuit boards so that air flow in the channel between boards causes air to be sucked through the perforations to eliminate stagnant areas between components and provide local jet impingement cooling.

公开(公告)号：US5107397A

公开(公告)日：1992-04-21

申请号：US629913

申请日：1990-12-19

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K1/18 ,  H05K7/20

CPC classification number: H05K7/20145 ,  H05K1/18 ,  H05K2201/064 ,  H05K2201/10651 ,  H05K2201/10689

Abstract: A method for arranging components to be mounted on circuit packs to achieve improved cooling is disclosed. In accordance with one aspect of the invention, components are arranged such that the longer dimension of each component is substantially parallel to the flow of a heat carrier as it streams from an inlet to an outlet. In accordance with another aspect of the invention, those components having larger aspect ratios are substantially placed near the outlet via which the heat carrier is removed.

Abstract translation: 公开了一种用于布置要安装在电路板上的部件以实现改进的冷却的方法。 根据本发明的一个方面，组件被布置成使得当每个部件从入口到出口流动时，每个部件的较长尺寸基本上平行于热载体的流动。 根据本发明的另一方面，具有较大纵横比的那些部件基本上放置在靠近热交换器的出口附近。

公开(公告)号：US06538885B1

公开(公告)日：2003-03-25

申请号：US09662995

申请日：2000-09-15

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K720

CPC classification number: H05K7/20563 ,  H05K7/1424

Abstract: One or more impingement plates, each of which includes one or more apertures, is located within an card cage running from top to bottom and from back to front of the card cage. Each impingement plate is located adjacent to one or more electronic components to be cooled. Channels formed on either side of the impingement plate allow for the ingress of a cooling fluid, the forcing of the cooling fluid through the one or more apertures within the impingement plate toward the electronics to be cooled, and the egress of the cooling fluid after it's contact with the electronics.

Abstract translation: 一个或多个冲击板，每个冲击板包括一个或多个孔，位于从卡盒的顶部到底部以及从后到后的卡笼中。 每个冲击板位于与待冷却的一个或多个电子部件相邻的位置。 在冲击板的任一侧上形成的通道允许冷却流体进入，迫使冷却流体通过冲击板内的一个或多个孔朝向要冷却的电子器件，以及冷却液在其被冷却后的出口 与电子产品接触。

公开(公告)号：US06452799B1

公开(公告)日：2002-09-17

申请号：US09662423

申请日：2000-09-15

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K720

CPC classification number: H01L23/36 ,  H01L23/427 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A integrated circuit cooling system includes a thermally conductive element sandwiched between two integrated circuits. The thermally conductive element of this thermal sandwich conducts heat away from both of the attached integrated circuits. The thermally conductive element may be a solid slab of thermally conductive material, such as copper, it may be a hollow, substantially planar thermal conductor with an internally circulating cooling fluid, or it may be a substantially planar heat pipe for example.

Abstract translation: 集成电路冷却系统包括夹在两个集成电路之间的导热元件。 该热夹层的导热元件将热量远离两个附接的集成电路。 导热元件可以是诸如铜的导热材料的实心板，它可以是具有内部循环的冷却流体的中空的，基本上平面的热导体，或者它可以是例如基本上平面的热管。

公开(公告)号：US06240371B1

公开(公告)日：2001-05-29

申请号：US09327820

申请日：1999-06-08

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: G01F168

CPC classification number: G01D1/00

Abstract: A sensor comprising a substantially planer base having a substantially-flat bottom surface to facilitate adhesive mounting, and at least one transducer mounted to said base.

Abstract translation: 传感器包括具有基本上平坦的底部表面以便于粘合剂安装的基本上平的基座，以及安装到所述底座的至少一个换能器。