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公开(公告)号:US20180298206A1
公开(公告)日:2018-10-18
申请号:US15920261
申请日:2018-03-13
Inventor: KyoungWook Paik , DalJin Yoon , SangHoon Lee
IPC: C09D5/24 , H05K1/14 , H05K3/36 , C09D127/14 , C09D109/00 , C09D133/20 , C09D177/06 , C09J7/24 , C09J7/25
Abstract: Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.
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公开(公告)号:US11021616B2
公开(公告)日:2021-06-01
申请号:US16057582
申请日:2018-08-07
Inventor: KyoungWook Paik , Dal Jin Yoon
IPC: C09D5/24 , B05D1/28 , C09D133/20 , C09J9/02 , C09J7/24 , H01L21/00 , C08K9/04 , C09J7/22 , H01B1/20
Abstract: Disclosed are a self-exposure method for a surface of conductive particles anchored in a polymer layer, a method of fabricating an anisotropic conductive film using the self-exposure method, and the anisotropic conductive film. A self-exposure method for a surface of conductive particles within a polymer layer may include controlling surface energy of multiple conductive particles so that a difference between surface energy of polymer to be used to fabricate the polymer layer and surface energy of the multiple conductive particles to be included in the polymer layer is a preset difference or more, forming a polymer solution by dissolving the polymer into a solvent in which the conductive particles having controlled surface energy have been mixed, and generating the polymer layer from which at least part of a surface of the multiple conductive particles has been externally exposed due to a difference in the surface energy by drying the polymer solution.
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公开(公告)号:US11732162B2
公开(公告)日:2023-08-22
申请号:US16951466
申请日:2020-11-18
Inventor: KyoungWook Paik , Jae Hyeong Park
CPC classification number: C09J9/02 , C09J7/35 , C09J7/385 , C09J11/04 , C09J11/06 , C08K3/10 , C08K5/42 , C08K5/55 , C08K2201/003 , C09J2203/326 , C09J2301/314 , C09J2301/408 , C09J2433/00 , C09J2463/00
Abstract: Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thermo-compression bonding may include a flux activator, solder particles and polymer resin.
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公开(公告)号:US11161988B2
公开(公告)日:2021-11-02
申请号:US15920261
申请日:2018-03-13
Inventor: KyoungWook Paik , DalJin Yoon , SangHoon Lee
IPC: H05K3/32 , C09D5/24 , H05K3/36 , C09D127/14 , C09D109/00 , C09D133/20 , C09D177/06 , C09J7/24 , C09J7/25 , H05K1/14 , C09D177/02 , C09D7/65
Abstract: Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.
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