公开(公告)号：US11313596B2

公开(公告)日：2022-04-26

申请号：US16332443

申请日：2017-08-07

Applicant: LG ELECTRONICS INC.

Inventor： Minjae Jeong ,  Seungyoun Kim ,  Geunhyung Lee ,  Hyunwoo Cho

IPC: F25D21/06 ,  F25B39/00 ,  F25D21/08 ,  F25D21/12 ,  F25B39/02

Abstract: Disclosed is an evaporator, comprising: a heating tube left as an empty space between first and second case sheets, which form an evaporator case, so as not to be overlapped with a cooling tube, and forming a heating passage in which a working liquid for defrosting flows; and a heater attached to the outer surface, which corresponds to the heating tube, of the evaporator case so as to heat the working liquid inside the heating tube. The heating tube can have a structure which an inlet and an outlet are respectively formed at both sides of a heater attachment part in the longitudinal direction and both end portions of a passage part are respectively connected to the inlet and the outlet, or can have a structure in which an opening is formed at one side of the heater attachment part, the working liquid heated by the heater is discharged through the opening, and the cooled working liquid is returned. The structures can form the heating passage, enabling the working liquid to circulate therethrough, without forming the inlet and the outlet, which are respectively connected to both end portions of the passage part, to be parallel at one side of the heater attachment part.

公开(公告)号：US10825702B2

公开(公告)日：2020-11-03

申请号：US16388394

申请日：2019-04-18

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu Shim ,  Dohee Kim ,  Changseo Park ,  Hyunwoo Cho

IPC: H01L21/67 ,  H01L21/44 ,  H01L25/075 ,  H01L33/62 ,  B65G47/92 ,  B65G47/14 ,  B65G47/49 ,  H01L29/82 ,  H01L33/00

Abstract: The present invention relates to a device and method for self-assembling semiconductor light-emitting diodes. Particularly, a method for manufacturing a display device according to the present invention includes: feeding a substrate to an assembly site and putting semiconductor light-emitting diodes having a magnetic material into a fluid chamber; applying a magnetic force to the semiconductor light-emitting diodes so that the semiconductor light-emitting diodes move in one direction within the fluid chamber; and guiding the semiconductor light-emitting diodes to preset positions on the substrate by applying an electric field, so that the semiconductor light-emitting diodes are mounted at the preset positions while in the process of being moved.

公开(公告)号：US10607515B2

公开(公告)日：2020-03-31

申请号：US16415770

申请日：2019-05-17

Applicant: LG ELECTRONICS INC.

Inventor： Changseo Park ,  Seongmin Moon ,  Bongchu Shim ,  Kiseong Jeon ,  Hyunwoo Cho

IPC: G09F9/33 ,  H01L27/15 ,  H01L33/62 ,  H01L33/44

Abstract: The present disclosure relates to a display device using semiconductor light emitting devices and a fabrication method thereof, and the display device according to the present disclosure can include a plurality of semiconductor light emitting devices, a first wiring electrode and a second wiring electrode respectively extended from the semiconductor light emitting devices to supply an electric signal to the semiconductor light emitting devices, a plurality of pair electrodes disposed on the substrate, and provided with a first electrode and a second electrode configured to generate an electric field when an electric current is supplied, and a dielectric layer formed to cover the pair electrodes, wherein the first wiring electrode and the second wiring electrode are formed on an opposite side to the plurality of the pair electrodes with respect to the semiconductor light emitting devices.

公开(公告)号：US10520240B2

公开(公告)日：2019-12-31

申请号：US15518502

申请日：2016-08-01

Applicant: LG ELECTRONICS INC.

Inventor： Kwangsoo Jung ,  Woocheol Kang ,  Yonggap Park ,  Geunhyung Lee ,  Jongmin Lee ,  Hyunwoo Cho

IPC: F25D21/08 ,  F28F1/40 ,  F25B39/02 ,  F25B47/02 ,  F28F1/12 ,  F28D15/02 ,  F28F19/00 ,  F25D21/12 ,  F28D7/00 ,  F25D21/04 ,  F28D1/047 ,  F28F1/24

Abstract: The present disclosure discloses a defrosting device, including a heating unit provided in an evaporator; and a heat pipe, both end portions of which are connected to an inlet and an outlet of the heating unit, respectively, and at least part of which is disposed adjacent to a cooling tube to dissipate heat to the cooling tube of the evaporator due to high-temperature working fluid heated and transferred by the heating unit, wherein the heating unit includes a heater case provided with a vacant space therein, and provided with the inlet and the outlet at positions separated from each other, respectively, along a length direction; and a heater attached to an outer surface of the heater case to heat working fluid within the heater case.

公开(公告)号：US12255187B2

公开(公告)日：2025-03-18

申请号：US17623853

申请日：2019-08-01

Applicant: LG ELECTRONICS INC.

Inventor： Jisoo Ko ,  Hyeyoung Yang ,  Wonjae Chang ,  Hyunwoo Cho

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/62

Abstract: The present invention may be applied to display device-related technical fields and relates to a display device using a semiconductor light-emitting element, such as a micro light-emitting diode (LED), and a manufacturing method therefor. The present invention, according to one embodiment, may comprise: a substrate; a stepped film positioned on at least some pixel regions, among a plurality of individual pixel regions positioned on the substrate; an assembly electrode positioned on the substrate or the stepped film; an insulation layer positioned on the assembly electrode; a partition wall positioned on the insulation layer and defining an assembly groove having mounted therein a semiconductor light-emitting element forming the individual pixel; the semiconductor light-emitting element mounted in an assembly surface of the assembly groove; and a lighting electrode electrically connected to the semiconductor light-emitting element.

公开(公告)号：US11502055B2

公开(公告)日：2022-11-15

申请号：US16689810

申请日：2019-11-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo Cho ,  Bongchu Shim ,  Dohee Kim

IPC: H01L23/00 ,  H01L25/075 ,  H01L33/00

Abstract: Discussed is an assembly apparatus for assembling a semiconductor light emitting diode to a display panel, the assembly apparatus including an assembly module including at least one magnetic member and a magnetic member accommodator having at least one magnetic member accommodation hole, and a rotary module connected to the assembly module to rotate the assembly module along an orbit.

公开(公告)号：US11079148B2

公开(公告)日：2021-08-03

申请号：US16544667

申请日：2019-08-19

Applicant: LG Electronics Inc.

Inventor： Geunhyung Lee ,  Jongryul Kim ,  Kwangsoo Jung ,  Woocheol Kang ,  Jongmin Lee ,  Hyunwoo Cho

IPC: F25B47/02 ,  F25D21/08 ,  F28D15/02 ,  F25D21/12

Abstract: A defrosting device includes a heating unit filled with a working fluid and including an active heating part heated to a first temperature that can evaporate the working fluid, and a passive heating part positioned at a rear side of the active heating part and heated to a lower temperature than the first temperature. The defrosting device also includes a heat pipe disposed adjacent to an evaporator to transfer heat to the evaporator while circulating working fluid heated by the active heating part, the heat pipe including an entrance portion configured to receive working fluid evaporated by the active heating part, and a return portion connected adjacent to the passive heating part and configured to receive working fluid that has condensed after circulating through the heat pipe. Condensed working fluid received at the heating unit first passes through the passive heating part before being reheated at the active heating part.

公开(公告)号：US10386102B2

公开(公告)日：2019-08-20

申请号：US15312772

申请日：2015-10-21

Applicant: LG ELECTRONICS INC.

Inventor： Geunhyung Lee ,  Jongryul Kim ,  Kwangsoo Jung ,  Woocheol Kang ,  Jongmin Lee ,  Hyunwoo Cho

IPC: F25B47/02 ,  F25D21/08 ,  F28D15/02 ,  F25D21/12

Abstract: A defrosting device includes a heating unit filled with a working fluid and including an active heating part heated to a first temperature that can evaporate the working fluid, and a passive heating part positioned at a rear side of the active heating part and heated to a lower temperature than the first temperature. The defrosting device also includes a heat pipe disposed adjacent to an evaporator to transfer heat to the evaporator while circulating working fluid heated by the active heating part, the heat pipe including an entrance portion configured to receive working fluid evaporated by the active heating part, and a return portion connected adjacent to the passive heating part and configured to receive working fluid that has condensed after circulating through the heat pipe. Condensed working fluid received at the heating unit first passes through the passive heating part before being reheated at the active heating part.

公开(公告)号：US12080580B2

公开(公告)日：2024-09-03

申请号：US17628776

申请日：2020-02-11

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo Cho ,  Bongchu Shim ,  Hyeyoung Yang ,  Jisoo Ko ,  Wonjae Chang

IPC: H01L21/68 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L21/68 ,  H01L21/6833 ,  H01L21/6835 ,  H01L25/0753 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0093 ,  H01L2221/68354 ,  H01L2221/68368

Abstract: The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field. Specifically, the assembly substrate is characterized by comprising: a base part; a plurality of assembly electrodes formed extending in one direction and disposed on the base part; a dielectric layer laminated on the base part so as to cover the assembly electrodes; a partition wall formed on the base part and including a plurality of grooves for guiding the semiconductor light emitting devices to a predetermined position; and a metal shielding layer formed on the base part, wherein each of the plurality of grooves penetrates the partition wall so as to form a seating surface on which the guided light emitting devices are seated, and the metal shielding layer overlaps with a part of the seating surface such that an electric field formed on a part of the seating surface is shielded.

公开(公告)号：US11869871B2

公开(公告)日：2024-01-09

申请号：US17286844

申请日：2019-10-08

Applicant: LG ELECTRONICS INC.

Inventor： Juchan Choi ,  Jideok Kim ,  Bongchu Shim ,  Seulbitna Lee ,  Kiseong Jeon ,  Hyunwoo Cho

IPC: H01L23/00 ,  H01L21/67 ,  H01L25/075

CPC classification number: H01L24/95 ,  H01L21/67121 ,  H01L25/0753 ,  H01L2224/95101

Abstract: Discussed is an apparatus for self-assembling semiconductor light-emitting devices, the apparatus including a fluid chamber to accommodate the semiconductor light-emitting devices, each semiconductor light-emitting device having a magnetic body; a magnet to apply a magnetic force to the semiconductor light-emitting devices while an assembly substrate is disposed at an assembly position of the self-assembly apparatus; a power supply to induce formation of an electric field on the assembly substrate to allow the semiconductor light-emitting devices to be seated at a preset positions on the assembly substrate in a process of moving the semiconductor light-emitting devices due to a change in a position of the magnet; and a fluid injector to shoot a fluid to some of the semiconductor light-emitting devices to allow the some of the semiconductor light-emitting devices seated on the assembly substrate to be separated from the assembly substrate.