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公开(公告)号:US20230292472A1
公开(公告)日:2023-09-14
申请号:US18019766
申请日:2021-08-05
Applicant: LG INNOTEK CO., LTD.
Inventor: Mi Sun LEE , Sang Hun AN , Ji Hwan JEON
IPC: H05K7/20
CPC classification number: H05K7/209 , H05K7/20445 , H05K7/205
Abstract: A heat dissipation module comprises: a heating element; a heat dissipation member disposed on one side of the heating element and including a first plate and a second plate; a third plate disposed on one side of the heating element; and a heat transfer path for transferring the heat generated from the heating element to the heat dissipation member. The heat transfer path comprises: a first path disposed between the first plate and the second plate; a third path disposed within the third plate; and a plurality of unit heat transfer paths having a second path connecting the first path and the third path, wherein the respective second paths of the plurality of unit heat transfer paths are spaced apart from each other.
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公开(公告)号:US20230328937A1
公开(公告)日:2023-10-12
申请号:US18020508
申请日:2021-08-12
Applicant: LG INNOTEK CO., LTD.
Inventor: Sang Hun AN , Mi Sun LEE , Ji Hwan JEON
IPC: H05K7/20
CPC classification number: H05K7/20909 , H05K7/20145 , H05K7/20172 , H05K7/2039
Abstract: A power conversion device comprises: a housing having a space therein, and including a first opening and a second opening; an electronic component arranged in the space; a duct having one end coupled to the first opening and the other end coupled to the second opening, and having a flow path through which air flows and which is divided from the space; and a fan which is arranged on one end of the duct and which allows air to flow in the flow path, wherein the electronic component includes a radiation fin protruding from the side surface thereof, and a coupling groove to which the radiation fin is coupled is arranged on the side surface of the duct.
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公开(公告)号:US20240036436A1
公开(公告)日:2024-02-01
申请号:US18022310
申请日:2021-08-20
Applicant: LG INNOTEK CO., LTD.
Inventor: Mi Sun LEE , Kyung Won KIM , Kyung Sung CHU
CPC classification number: G03B3/10 , G03B5/00 , G03B17/12 , G03B2205/0023 , G03B2205/0046 , G03B2205/0061
Abstract: A camera actuator according to an embodiment includes a housing; a prism part disposed in the housing; and a driving part disposed in the housing and tilting the prism part; wherein the driving part includes: a first piezoelectric element disposed in a region overlapping in a first direction with respect to a center of the prism part; and a second piezoelectric element disposed in a region overlapping in a second direction different from the first direction with respect to the center of the prism part, wherein the prism part is provided to be tiltable in the second direction by the first piezoelectric element, and is provided to be tiltable in the first direction by the second piezoelectric element.
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公开(公告)号:US20230247808A1
公开(公告)日:2023-08-03
申请号:US18019005
申请日:2021-08-02
Applicant: LG INNOTEK CO., LTD.
Inventor: Mi Sun LEE , Sang Hun AN , Ji Hwan JEON
CPC classification number: H05K7/20927 , H02M7/003 , H05K7/20263
Abstract: A power converter comprises: a housing which has an inner space part formed therein; an electronic component which is disposed in the space part and generates heat due to the operation thereof; and a heat dissipating member a part of which is disposed on the electronic component and the other part of which is disposed at the inner surface of the housing, wherein the heat dissipating member comprises: a frame; a heat dissipating pipe disposed at one surface of the frame; and a thermal pad disposed between the heat dissipating pipe and the electronic component or between the heat dissipating pipe and the inner surface of the housing.
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公开(公告)号:US20230156964A1
公开(公告)日:2023-05-18
申请号:US17919321
申请日:2021-04-16
Applicant: LG INNOTEK CO., LTD.
Inventor: Yong Joo LEE , Mi Sun LEE , Ju Young JANG
CPC classification number: H05K7/20336 , H02M3/00 , H05K7/20936
Abstract: A heat sink according to one embodiment of the present invention comprises: a main heat sink; a heat pipe mounted in a groove formed on one surface of the main heat sink; a heat dissipation member which is formed above the heat pipe and transfers heat generated from a heat generation component to the heat pipe; and an elastic member which is mounted in a space formed inside the heat dissipation member and applies pressure to the main heat sink.
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公开(公告)号:US20230102931A1
公开(公告)日:2023-03-30
申请号:US17918694
申请日:2021-04-14
Applicant: LG INNOTEK CO., LTD.
Inventor: Mi Sun LEE , Yong Joo LEE
IPC: H05K7/20
Abstract: The present invention relates to a heat sink comprising a heat pipe. A heat sink, according to one embodiment of the present invention, comprises: a first heat pipe mounted in a first groove formed on a first surface of a heat sink; a second heat pipe mounted in a second groove formed on a second surface of the heat sink; and a third groove in which at least a portion of the second heat pipe mounted in the second groove is exposed in the direction of the first surface. A method for producing a heat sink comprises the steps of: forming, on a first surface of a heat sink, a first groove in which a first heat pipe is mounted; mounting the first heat pipe on the first surface by disposing and press-fitting the first heat pipe in the first groove; forming, on a second surface of the heat sink, a second groove in which a second heat pipe is mounted; mounting the second heat pipe on the second surface by disposing and press-fitting the second heat pipe in the second groove; and forming a third groove such that at least a portion of the second heat pipe is exposed in the direction of the first surface.
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公开(公告)号:US20220362100A1
公开(公告)日:2022-11-17
申请号:US17761245
申请日:2020-09-01
Applicant: LG INNOTEK CO., LTD.
Inventor: Beom Sun HONG , Hae Rok SON , Gyu Lin LEE , Min Seok OH , Mi Sun LEE
IPC: A61H23/02
Abstract: A mask according to an embodiment comprises: a body having a shape corresponding to a user's face; a first recess disposed on one surface of the body, opposite to the user's face; and a piezoelectric part disposed in the first recess, wherein the first recess has a shape recessed outward from the one surface of the body and is disposed in a region corresponding to at least one of the user's brow region and eye rim regions, and the piezoelectric unit protrudes beyond the one surface toward the user.
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公开(公告)号:US20210163266A1
公开(公告)日:2021-06-03
申请号:US16770468
申请日:2018-12-07
Applicant: LG INNOTEK CO., LTD.
Inventor: Dae Hun KIM , Sang Hoon BONG , Sang Hun AN , Mi Sun LEE
Abstract: Disclosed in an embodiment is a light source comprising: a housing; a coupling unit which fixes the housing on the target structure; a light source module for emitting light onto the target structure; and a power source module which supplies power to the light source module. The light source module comprises: a first circuit board; a second circuit board disposed on one side of the first circuit board; a third circuit board disposed on another side of the first circuit board; at least one first ultraviolet light emitting element disposed on one surface of the first circuit board; at least one second ultraviolet light emitting element disposed on one surface of the second circuit board; and at least one third ultraviolet light emitting element disposed on one surface of the third circuit board, wherein one surface of the second circuit board and one surface of the third circuit are disposed so as to face each other.
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