公开(公告)号：US20230070973A1

公开(公告)日：2023-03-09

申请号：US17939799

申请日：2022-09-07

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Wei-Yuan MA ,  Hui-Ru WU ,  Min-Che TSAI ,  Shiou-Yi KUO ,  Jian-Chin LIANG

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/00

Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.

公开(公告)号：US20200067009A1

公开(公告)日：2020-02-27

申请号：US16232041

申请日：2018-12-25

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US20220271251A1

公开(公告)日：2022-08-25

申请号：US17663431

申请日：2022-05-15

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US20180106994A1

公开(公告)日：2018-04-19

申请号：US15729649

申请日：2017-10-10

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Hui-Ru WU ,  Jo-Hsiang CHEN ,  Tzong-Liang TSAI

IPC: G02B26/00 ,  G02B5/26 ,  F21V9/16

CPC classification number: G02B26/008 ,  F21V9/30 ,  F21Y2115/10 ,  G02B5/26 ,  G02B5/285

Abstract: A light-enhancement device includes a wavelength conversion member and a wavelength controlling element. The wavelength conversion member includes a light-transmissive substrate and wavelength conversion material which is disposed within the light-transmissive substrate for converting a portion of light with a first wavelength into another light with a second wavelength. The wavelength controlling element is disposed on a surface of the light-transmissive substrate for reflecting another portion of the light with the first wavelength into the light-transmissive substrate and enabling the portion of the light with the second wavelength to pass through the wavelength controlling element. A roughness of the surface of the light-transmissive substrate facing towards the wavelength controlling element is configured to be 0-1 μm.

公开(公告)号：US20230413594A1

公开(公告)日：2023-12-21

申请号：US18460673

申请日：2023-09-04

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

IPC: H10K50/125 ,  H01L33/60 ,  H10K50/856 ,  H10K50/86 ,  H10K50/80

CPC classification number: H10K50/125 ,  H01L33/60 ,  H10K50/856 ,  H10K50/865 ,  H10K50/868

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US20210367113A1

公开(公告)日：2021-11-25

申请号：US16879787

申请日：2020-05-21

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Hui-Ru WU ,  Jo-Hsiang CHEN ,  Jian-Chin LIANG ,  Ai-Sen LIU

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.