公开(公告)号：US20240194848A1

公开(公告)日：2024-06-13

申请号：US18587974

申请日：2024-02-27

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The light emitting diode packaging structure includes a flexible substrate, micro light emitting elements disposed on the flexible substrate, a conductive pad, a redistribution layer, and an electrode pad. The micro light emitting elements have a first surface facing to the flexible substrate and a second surface opposite to the first surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting elements. The redistribution layer covers the micro light emitting elements and the conductive pad. The redistribution layer includes an insulating layer and a circuit layer embedded in the insulating layer. The circuit layer is electrically connected to the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer.

公开(公告)号：US20230074731A1

公开(公告)日：2023-03-09

申请号：US17929714

申请日：2022-09-05

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Hsin-Lun SU ,  Min-Che TSAI ,  Jo-Hsiang CHEN

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/62

Abstract: A pixel unit includes a substrate, a wiring layer and three light-emitting elements. The wiring layer includes first electrode wires and second electrode wires. The first electrode wires and the second electrode wires are arranged side by side and separated from each other by a spacing. A first blocking wall structure is at a first end portion of each of the first electrode wires, the first end portion is near the corresponding second electrode wires, and a second blocking wall structure is at a second end portion of each of the second electrode wires, the second end portion is near the corresponding first electrode wires. Three light-emitting elements emit red light, green light and blue light respectively. The light-emitting elements are in a flip chip configuration and are connected to one of the first electrode wires and one of the second electrode wires adjacent to each other respectively.

公开(公告)号：US20220037569A1

公开(公告)日：2022-02-03

申请号：US16944131

申请日：2020-07-30

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US20230261165A1

公开(公告)日：2023-08-17

申请号：US18303578

申请日：2023-04-20

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/0095 ,  H01L2933/0066 ,  H01L2933/0058

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

公开(公告)号：US20230131636A1

公开(公告)日：2023-04-27

申请号：US17970487

申请日：2022-10-20

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Guo-Yi SHIU ,  Chih-Hao LIN ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L25/16 ,  H01L33/54 ,  H01L33/62 ,  H01L33/60

Abstract: Embodiments provide a micro light-emitting diode package structure and a method for forming the same. The micro light-emitting diode package structure includes a redistribution layer, a control device, micro light-emitting diodes, and a flexible material layer. The control device and the micro light-emitting diodes are disposed on and electrically connected to the redistribution layer. The flexible material layer covers the control device and the micro light-emitting diodes, wherein the micro light-emitting diodes are in contact with the flexible material layer.

公开(公告)号：US20230070973A1

公开(公告)日：2023-03-09

申请号：US17939799

申请日：2022-09-07

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Wei-Yuan MA ,  Hui-Ru WU ,  Min-Che TSAI ,  Shiou-Yi KUO ,  Jian-Chin LIANG

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/00

Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.

公开(公告)号：US20220190225A1

公开(公告)日：2022-06-16

申请号：US17653462

申请日：2022-03-03

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.