公开(公告)号：US11894503B2

公开(公告)日：2024-02-06

申请号：US18058765

申请日：2022-11-24

Applicant: Lextar Electronics Corporation

Inventor： Shu-Wei Chen ,  Ching-Huai Ni ,  Kuo-Wei Huang ,  Jia-Jhang Kuo

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/02 ,  H01L33/58

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2933/005

Abstract: A light emitting diode device includes a substrate, a frame, an LED die and a transparent layer. The frame is located on the substrate. The frame and the substrate collectively define a concave portion. The frame has a light reflectivity ranging from 20% to 40%. The LED die is located on the substrate and within the concave portion. The transparent layer is filled into the concave portion and covering the LED die, wherein the LED die has a side-emitting surface and a top-emitting surface, the side-emitting surface has a luminous intensity greater than that of the top-emitting surface.

公开(公告)号：US12038156B2

公开(公告)日：2024-07-16

申请号：US18203984

申请日：2023-05-31

Applicant: Lextar Electronics Corporation

Inventor： Shu-Wei Chen ,  Jia-Jhang Kuo ,  Ching-Chi Chiang

IPC: F21V19/00 ,  F21V3/02 ,  F21V7/00 ,  F21V17/10

CPC classification number: F21V19/0065 ,  F21V3/02 ,  F21V7/0058 ,  F21V17/101

Abstract: A light source module is provided. The light source module includes a lead frame, a light source, a cup part, and a reflector. The light source is disposed on the lead frame, wherein the light source provides a light. The cup part is disposed on the lead frame, wherein the cup part includes an opening, a plurality of thick-wall portions and a plurality of thin-wall portions. The thick-wall portions and the thin-wall portions surround the light source and define a space. The reflector covers the opening. At least a portion of the light is reflected by the reflector, and is emitted through the thick-wall portions and the thin-wall portions.

公开(公告)号：US11538970B2

公开(公告)日：2022-12-27

申请号：US17027731

申请日：2020-09-22

Applicant: Lextar Electronics Corporation

Inventor： Shu-Wei Chen ,  Ching-Huai Ni ,  Kuo-Wei Huang ,  Jia-Jhang Kuo

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/02 ,  H01L33/58

Abstract: A light emitting diode device includes a substrate, a frame, an LED die and a transparent layer. The frame is located on the substrate. The frame and the substrate collectively define a concave portion. The frame has a light reflectivity ranging from 20% to 40%. The LED die is located on the substrate and within the concave portion. The transparent layer is filled into the concave portion and covering the LED die, wherein the LED die has a side-emitting surface and a top-emitting surface, the side-emitting surface has a luminous intensity greater than that of the top-emitting surface.