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1.发明公开公开(公告)号：US20230219500A1
公开(公告)日：2023-07-13
申请号：US18153440
申请日：2023-01-12
Applicant: Magna Electronics Inc.
Inventor： Garret F. Achenbach , Martin J. Reckker , Steven G. Gebauer , Jianguo Wang
Abstract: A vehicular camera module includes a housing for mounting at a vehicular windshield, a processor printed circuit board (processor PCB) disposed in the housing, and an imager assembly. The imager assembly includes (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board (imager PCB), and (iii) a flexible electrical ribbon cable that electrically connects the imager PCB to the processor PCB. An imager is disposed at a first side of the imager PCB. The imager PCB includes an imager portion at which the imager is disposed and attaching portions at respective outboard ends. At least one stress relieving portion is established at the imager PCB between the imager portion and each of the attaching portions. With the lens barrel received through an aperture of the housing, the attaching portions of the imager PCB are attached at the housing via respective fasteners.
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公开(公告)号：US11697382B2
公开(公告)日：2023-07-11
申请号：US17813050
申请日：2022-07-18
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N7/181 , H04N23/57 , H05K7/2039
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
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公开(公告)号：US09896039B2
公开(公告)日：2018-02-20
申请号：US14705076
申请日：2015-05-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N5/2257 , H04N7/181 , H05K7/2039
Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.
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公开(公告)号：US20230339412A1
公开(公告)日：2023-10-26
申请号：US18347756
申请日：2023-07-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N7/181 , H04N23/57 , H05K7/2039
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
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公开(公告)号：US20230331152A1
公开(公告)日：2023-10-19
申请号：US18337484
申请日：2023-06-20
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian J. Winden , Christopher L. Van Dan Elzen
CPC classification number: B60R1/00 , B60R1/04 , B60R1/12 , B60R11/04 , H04N23/51 , H04N23/54 , H04N23/55 , H04N23/57 , B60K2370/152 , B60K2370/173 , B60K2370/21 , B60K2370/777 , H04N23/52 , Y10T29/49169
Abstract: A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing.
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Patent Agency Ranking
公开(公告)号：US20210188191A1
公开(公告)日：2021-06-24
申请号：US17249703
申请日：2021-03-10
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB and includes an image processing chip. Image data captured by the imager is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion.
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公开(公告)号：US20210009035A1
公开(公告)日：2021-01-14
申请号：US16948654
申请日：2020-09-28
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian J. Winden , Christopher L. Van Dan Elzen
Abstract: A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing.
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公开(公告)号：US10214157B2
公开(公告)日：2019-02-26
申请号：US15899131
申请日：2018-02-19
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.
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公开(公告)号：US12109951B2
公开(公告)日：2024-10-08
申请号：US18337484
申请日：2023-06-20
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian J. Winden , Christopher L. Van Dan Elzen
IPC: H04N5/235 , B60R1/04 , B60R1/12 , B60R11/04 , H04N23/51 , H04N23/54 , H04N23/55 , H04N23/57 , B60K35/22 , B60K35/28 , B60K35/60 , B60R11/00 , H04N23/52
CPC classification number: B60R11/04 , B60R1/04 , B60R1/12 , H04N23/51 , H04N23/54 , H04N23/55 , H04N23/57 , B60K35/22 , B60K35/28 , B60K35/60 , B60K2360/173 , B60K2360/21 , B60K2360/777 , B60R2001/1215 , B60R2001/1253 , B60R2011/0026 , B60R2300/102 , B60R2300/105 , B60R2300/303 , B60R2300/607 , B60R2300/8026 , B60R2300/804 , B60R2300/806 , H04N23/52 , Y10T29/49169
Abstract: A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing.
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10.发明授权公开(公告)号：US11926268B2
公开(公告)日：2024-03-12
申请号：US17249686
申请日：2021-03-10
Applicant: Magna Electronics Inc.
Inventor： Robert A. Devota , Garret F. Achenbach , David F. Olson , Matthew C. Sesti , John R. Garcia
CPC classification number: B60R11/04 , B60R2011/0026
Abstract: An imager assembly for a vehicular camera module includes an imager circuit board and a lens holder. An imager is disposed at the imager circuit board. The lens holder includes a lens holding portion that accommodates a lens. The lens holder includes a plurality of pins extending from an attaching portion and extending in a direction away from the lens holding portion of the lens holder. With the attaching portion of the lens holder at the imager circuit board, individual pins of the plurality of pins are received at least partially through respective apertures of the imager circuit board to locate the lens holder at the imager circuit board. With the pins received at least partially through the apertures of the imager circuit board, and with the lens aligned with the imager at the imager circuit board, the pins are fixedly attached at the imager circuit board.
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