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公开(公告)号：US20240019463A1
公开(公告)日：2024-01-18
申请号：US18469046
申请日：2023-09-18
Applicant: MICROFABRICA INC.
Inventor： MIchael S. Lockard , Stefano Felici , Uri Frodis , Dennis R. Smalley
CPC classification number: G01R1/06744 , G01R1/06761 , G01R1/07357
Abstract: Forming buckling beam probe arrays having MEMS probes engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed is disclosed. Probes can be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement can occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Arrays can include probes and a substrate to which the probes are bonded with one or more guide plates. Final arrays can include probes held by guide plates with aligned or laterally shifted hole patterns.
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公开(公告)号：US20240094252A1
公开(公告)日：2024-03-21
申请号：US17493802
申请日：2021-10-04
Applicant: Microfabrica Inc.
Inventor： Jia Li , Arun S. Veeramani , Stefano Felici , Dennis R. Smalley
CPC classification number: G01R1/06761 , G01R1/06716 , G01R3/00
Abstract: Dual shield probes are provided having one or more of a plurality of different features including: discontinuous dielectric spacers, fixed nodes, sliding nodes, shield nodes, bridges, stops, interlocked dielectric and conductive elements, along with methods of using and making such probes.
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公开(公告)号：US11821918B1
公开(公告)日：2023-11-21
申请号：US17240962
申请日：2021-04-26
Applicant: Microfabrica Inc.
Inventor： Michael S. Lockard , Stefano Felici , Uri Frodis , Dennis R. Smalley
CPC classification number: G01R1/06744 , G01R1/06761 , G01R1/07357
Abstract: Embodiments are directed to the formation of buckling beam probe arrays having MEMS probes that are engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed. In other embodiments, probes may be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement may occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Final arrays may include probes and a substrate to which the probes are bonded along with one or more guide plates while in other embodiments final arrays may include probes held by a plurality of guide plates (e.g. 2, 3, 4 or even more guide plates) with aligned or laterally shifted hole patterns.
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