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公开(公告)号:US12182397B2
公开(公告)日:2024-12-31
申请号:US18326303
申请日:2023-05-31
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Dean D. Gans , Shunichi Saito
Abstract: Apparatuses and methods for configurable memory array bank architectures are described. An example apparatus includes a mode register configured to store information related to bank architecture and a memory array including a plurality of memory banks. The plurality of memory banks are configured to be arranged in a bank architecture based at least in part on the information related to bank architecture stored in the mode register.
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公开(公告)号:US11682447B2
公开(公告)日:2023-06-20
申请号:US17161204
申请日:2021-01-28
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Dean D. Gans , John D. Porter
IPC: G06F3/06 , G11C11/40 , G11C11/4076 , G11C11/4074 , G06F13/16
CPC classification number: G11C11/4076 , G06F3/0604 , G06F3/0659 , G06F3/0673 , G06F13/1689 , G11C11/4074
Abstract: Apparatuses and methods for input receiver circuits and receiver masks for electronic memory are disclosed. Embodiments of the disclosure include memory receiver masks having shapes other than rectangular shapes. For example, a receiver mask according to some embodiments of the disclosure may have a hexagonal shape. Other shapes of receiver masks may also be included in other embodiments of the disclosure. Circuits, timing, and operating parameters for achieving non-rectangular and various shapes of receiver mask are described.
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公开(公告)号:US20230004507A1
公开(公告)日:2023-01-05
申请号:US17864023
申请日:2022-07-13
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Timothy M. Hollis , Jeffrey P. Wright , Dean D. Gans
IPC: G06F13/16 , G06F13/40 , G11C5/06 , G11C5/02 , G06F13/42 , G11C11/4093 , G11C7/10 , G11C11/4096 , G11C5/04
Abstract: Methods, systems, and devices for communicating data with stacked memory dies are described. A first semiconductor die may communicate with an external computing device using a binary-symbol signal including two signal levels representing one bit of data. Semiconductor dies may be stacked on one another and include internal interconnects (e.g., through-silicon vias) to relay an internal signal generated based on the binary-symbol signal. The internal signal may be a multi-symbol signal modulated using a modulation scheme that includes three or more levels to represent more than one bit of data. The multi-level symbol signal may simplify the internal interconnects. A second semiconductor die may be configured to receive and re-transmit the multi-level symbol signal to semiconductor dies positioned above the second semiconductor die.
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公开(公告)号:US20220187988A1
公开(公告)日:2022-06-16
申请号:US17645101
申请日:2021-12-20
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Dean D. Gans , Shunichi Saito
Abstract: Apparatuses and methods for configurable memory array bank architectures are described. An example apparatus includes a mode register configured to store information related to bank architecture and a memory array including a plurality of memory banks. The plurality of memory banks are configured to be arranged in a bank architecture based at least in part on the information related to bank architecture stored in the mode register.
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公开(公告)号:US20220149828A1
公开(公告)日:2022-05-12
申请号:US17501858
申请日:2021-10-14
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Dean D. Gans
Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for lookahead duty cycle adjustment of a clock signal. Clock signals may be provided to a semiconductor device, such as a memory device, to synchronize one or more operations. A duty cycle adjuster (DCA) of the device may adjust the clock signal(s) based on a duty code determined during an initialization of the device. While the device is in operation, a lookahead DCA (LA DCA) may test a number of different adjustments to the clock signal(s), the results of which may be determined by a duty cycle monitor (DCM). The results of the DCM may be used to select one of the tested adjustments, which may be used to update the duty code.
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公开(公告)号:US20210287724A1
公开(公告)日:2021-09-16
申请号:US17301531
申请日:2021-04-06
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Dean D. Gans , Daniel C. Skinner
IPC: G11C7/10
Abstract: Apparatuses and methods for writing and storing parameter codes for operating parameters, and selecting between the parameter codes to set an operating condition for a memory are disclosed. An example apparatus includes a first mode register and a second mode register. The first mode register is configured to store first and second parameter codes for a same operating parameter. The second mode register is configured to store a parameter code for a control parameter to select between the first and second parameter codes to set a current operating condition for the operating parameter. An example method includes storing in a first register a first parameter code for an operating parameter used to set a first memory operating condition, and further includes storing in a second register a second parameter code for the operating parameter used to set a second memory operating condition.
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公开(公告)号:US20210255958A1
公开(公告)日:2021-08-19
申请号:US17183225
申请日:2021-02-23
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Dean D. Gans , Sharookh Daruwalla
IPC: G06F12/0862 , G06F13/20
Abstract: Methods, systems, and devices are described for wireless communications. A request for data located in a memory page of a memory array may be received at a device, and a value of a prefetch counter associated with the memory page may be identified. A portion of the memory page that includes the requested data may then be communicated between a memory array and memory bank of the device based on the value of the prefetch counter. For instance, the portion of the memory page may be selected based on the value of the prefetch counter. A second portion of the memory page may be communicated to a buffer of the device, and the value of the prefetch counter may be modified based on a relationship between the first portion of the memory page and the second portion of the memory page.
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公开(公告)号:US11087819B2
公开(公告)日:2021-08-10
申请号:US16597694
申请日:2019-10-09
Applicant: Micron Technology, Inc.
Inventor: Timothy B. Cowles , Dean D. Gans , Jiyun Li , Nathaniel J. Meier , Randall J. Rooney
IPC: G11C7/00 , G11C11/406
Abstract: Memory devices and methods of operating memory devices in which refresh management operations can be scheduled on an as-needed basis for those memory portions where activity (e.g., activations in excess of a predetermined threshold) warrants a refresh management operation are disclosed. In one embodiment, an apparatus comprises a memory including a memory location, and circuitry configured to determine a count corresponding to a number of activations at the memory location, to schedule a refresh management operation for the memory location in response to the count exceeding a first predetermined threshold, and to decrease the count by an amount corresponding to the first predetermined threshold in response to executing the scheduled refresh management operation. The circuitry may be further configured to disallow, in response to determining that the count has reached a maximum permitted value, further activations at the memory location until after the count has been decreased.
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公开(公告)号:US20210217459A1
公开(公告)日:2021-07-15
申请号:US17161204
申请日:2021-01-28
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Dean D. Gans , John D. Porter
IPC: G11C11/4076 , G11C11/4074 , G06F3/06 , G06F13/16
Abstract: Apparatuses and methods for input receiver circuits and receiver masks for electronic memory are disclosed. Embodiments of the disclosure include memory receiver masks having shapes other than rectangular shapes. For example, a receiver mask according to some embodiments of the disclosure may have a hexagonal shape. Other shapes of receiver masks may also be included in other embodiments of the disclosure. Circuits, timing, and operating parameters for achieving non-rectangular and various shapes of receiver mask are described.
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公开(公告)号:US20210105161A1
公开(公告)日:2021-04-08
申请号:US17123990
申请日:2020-12-16
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Timothy M. Hollis , Jeffrey P. Wright , Dean D. Gans
Abstract: Methods, systems, and devices for multiplexing distinct signals on a single pin of a memory device are described. Techniques are described herein to multiplex data using a modulation scheme having at least three levels. The modulated data may be communicated to multiple memory dies over a shared bus. Each of the dies may include a same or different type of memory cell and, in some examples, a multi-level signaling scheme may be pulse amplitude modulation (PAM). Each unique symbol of the modulated signal may be configured to represent a plurality of bits of data.
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