公开(公告)号：US20130102154A1

公开(公告)日：2013-04-25

申请号：US13711432

申请日：2012-12-11

Applicant: Micron Technology, Inc.

Inventor： Whonchee Lee ,  Gundu M. Sabde

IPC: H01L21/306

CPC classification number: H01L21/30625 ,  B23H5/08 ,  C25F1/00 ,  C25F3/02 ,  C25F3/08

Abstract: Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.

公开(公告)号：US20150206761A1

公开(公告)日：2015-07-23

申请号：US14676338

申请日：2015-04-01

Applicant: Micron Technology, Inc.

Inventor： Janos Fucsko ,  David H. Wells ,  Patrick M. Flynn ,  Whonchee Lee

IPC: H01L21/306 ,  H01L21/302 ,  H01L21/311

CPC classification number: H01L21/30608 ,  H01L21/302 ,  H01L21/31116 ,  H01L21/76232 ,  H01L29/66818

Abstract: A single crystal silicon etching method includes providing a single crystal silicon substrate having at least one trench therein. The single crystal silicon substrate is exposed to an anisotropic etchant that undercuts the single crystal silicon. By controlling the length of the etch, single crystal silicon islands or smooth vertical walls in the single crystal silicon may be created.

Abstract translation: 单晶硅蚀刻方法包括提供其中具有至少一个沟槽的单晶硅衬底。 将单晶硅衬底暴露于底切单晶硅的各向异性蚀刻剂。 通过控制蚀刻的长度，可以产生单晶硅中的单晶硅岛或平滑的垂直壁。

公开(公告)号：US20130228458A1

公开(公告)日：2013-09-05

申请号：US13863916

申请日：2013-04-16

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Suresh Ramarajan ,  Whonchee Lee

IPC: C25D17/00 ,  C25D17/12

CPC classification number: C25D17/002 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25D17/12 ,  H01L21/2885

Abstract: Electroplating systems that include a plurality of electrodes, a power supply operably coupled to the plurality of electrodes, a platen for bearing a substrate on which metal features are to be formed, and an electrode support are disclosed. The electrode support may be configured for suspending the electrode assembly over an upper surface of the substrate disposed on the platen in spaced relation to and in alignment with the substrate or for supporting the electrode assembly in a stationary position over the substrate when the voltage is applied across the plurality of electrodes. The electrodes may be adjacent, mutually spaced and electrically isolated and connected in series so as to be oppositely polarized when the voltage is applied thereacross or may be connected so as to have alternating polarities when the voltage is applied thereacross.

公开(公告)号：US09593431B2

公开(公告)日：2017-03-14

申请号：US13863916

申请日：2013-04-16

Applicant: Micron Technology, Inc.

Inventor： Suresh Ramarajan ,  Whonchee Lee

IPC: C25D17/00 ,  C25D7/12 ,  C25D17/12 ,  H01L21/288 ,  C25D5/18 ,  C25D17/10

CPC classification number: C25D17/002 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25D17/12 ,  H01L21/2885

Abstract: Electroplating systems that include a plurality of electrodes, a power supply operably coupled to the plurality of electrodes, a platen for bearing a substrate on which metal features are to be formed, and an electrode support are disclosed. The electrode support may be configured for suspending the electrode assembly over an upper surface of the substrate disposed on the platen in spaced relation to and in alignment with the substrate or for supporting the electrode assembly in a stationary position over the substrate when the voltage is applied across the plurality of electrodes. The electrodes may be adjacent, mutually spaced and electrically isolated and connected in series so as to be oppositely polarized when the voltage is applied thereacross or may be connected so as to have alternating polarities when the voltage is applied thereacross.

Abstract translation: 公开了包括多个电极的电镀系统，可操作地耦合到多个电极的电源，用于承载要形成金属特征的基板的压板和电极支撑件。 电极支撑件可以被配置用于将电极组件悬挂在设置在压板上的衬底的上表面上，该衬底的上表面与衬底间隔开并与之对准，或者当施加电压时，将电极组件支撑在衬底上的静止位置 跨越多个电极。 电极可以相邻，相互间隔并且电隔离并且串联连接，以便当在其上施加电压时可以相反地极化，或者可以在电压施加到其上时具有交替极性。

公开(公告)号：US08603319B2

公开(公告)日：2013-12-10

申请号：US13711432

申请日：2012-12-11

Applicant: Micron Technology, Inc.

Inventor： Whonchee Lee ,  Gundu M. Sabde

IPC: C25F3/16

CPC classification number: H01L21/30625 ,  B23H5/08 ,  C25F1/00 ,  C25F3/02 ,  C25F3/08

Abstract: Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.