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公开(公告)号：US10819189B2
公开(公告)日：2020-10-27
申请号：US16308876
申请日：2017-03-28
发明人： Masaru Shinozaki , Yugo Asai , Yusuke Kimoto , Hiroyuki Ushifusa , Yoshiaki Kitta , Yoshiyuki Deguchi
摘要： A cooling apparatus includes: an annular internal liquid coolant flow channel that is mounted to a rotary electric machine main body, and in which an internal liquid coolant circulates around an outer circumference of the rotary electric machine main body, and an external liquid coolant passage portion through which an external liquid coolant passes, the external liquid coolant passage portion is connected to the internal liquid coolant flow channel by a connecting portion that is positioned vertically higher than the rotary electric machine main body, and the electric power converting apparatus includes a heat radiating surface that releases heat that is generated in the electric power converting apparatus, the electric power converting apparatus being mounted to the cooling apparatus such that the heat radiating surface and the internal liquid coolant can exchange heat at a position that is vertically lower than the connecting portion.
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公开(公告)号：US09853009B2
公开(公告)日：2017-12-26
申请号：US15126609
申请日：2014-04-04
发明人： Masakazu Tani , Yoshiyuki Deguchi
IPC分类号： H01L23/00 , H01L23/367
CPC分类号： H01L24/40 , H01L23/3675 , H01L24/36 , H01L24/37 , H01L24/84 , H01L2224/37028 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40139 , H01L2224/40245 , H01L2224/84205 , H01L2224/84801 , H01L2224/8482 , H01L2224/8484 , H01L2224/8485 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要： In the semiconductor module according to the present invention, a conducting member which is used to electrically connect a semiconductor element arranged on a substrate or a bus bar with another electronic component is provided with a structure having flexibility capable of, in a junction with the semiconductor element, reducing the thermal stress due to difference in a coefficient of linear expansion between the conducting member and the semiconductor element, and absorbing dimensional error in objects to be connected. Therefore, the semiconductor module achieves both increased current capacity of the semiconductor device and improved reliability of the semiconductor module.
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公开(公告)号：US11293949B2
公开(公告)日：2022-04-05
申请号：US16612461
申请日：2018-02-01
发明人： Yosuke Tsuzaki , Shuichi Ueno , Mitsuo Sone , Masaaki Taruya , Yoshiyuki Deguchi
摘要： In a current detection apparatus, one or more first plate portions, one or more second plate portions, and one or more third plate portions of one or more magnetic shields are opposed to side surfaces of the one or more protrusions. The one or more protrusions, the one or more magnetic field detection elements, and one or more conductive members are respectively surrounded by the one or more magnetic shields, respectively. Consequently, the current detection apparatus is downsized and has high current detection accuracy.
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4.发明授权公开(公告)号：US10475667B2
公开(公告)日：2019-11-12
申请号：US15518353
申请日：2014-11-06
发明人： Masakazu Tani , Yoshiyuki Deguchi , Kazuki Sakata
IPC分类号： H01L21/48 , H01L23/48 , H01L25/07 , H01L25/18 , H01L21/768 , H01L23/498 , H01L23/00
摘要： A semiconductor module is provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode. The conductive member is made up of a metal sheet, and has a bent portion at the one end and at the other end. The bent portion provided at the one end has a cut in a leading end portion, in the longitudinal direction, and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element. As a result, a semiconductor module can be realized that allows combination of increased current capacity with improved reliability.
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公开(公告)号：US10084388B2
公开(公告)日：2018-09-25
申请号：US15325949
申请日：2015-06-12
发明人： Keita Takahashi , Kazuki Sakata , Yoshiyuki Deguchi , Takuto Yano , Mamoru Takikita , Kazutoshi Awane , Koji Nakajima , Takao Mitsui , Kosuke Nakano , Masayoshi Tamura , Masashi Sakai
IPC分类号： H02M7/00 , H02M7/537 , H01L23/552 , H05K7/20 , H01L23/367 , H03H1/00 , H01L25/18
CPC分类号： H02M7/003 , H01L23/36 , H01L23/3675 , H01L23/552 , H01L25/07 , H01L25/18 , H01L2924/0002 , H02M7/48 , H02M7/537 , H03H1/00 , H03H2001/0085 , H05K7/209 , H01L2924/00
摘要： A power converter includes: a base conductor, an electrically heating member which is provided on the base conductor, a noise reduction capacitor of flat plate-shape in which via an insulator, a plurality of first electrodes and second electrodes are alternately layered, on one surface, the first electrode in an outermost layer is exposed and on another surface, the second electrode in an outermost layer is exposed, a relay conductor which is electrically connected to other members from the electrically heating member via the noise reduction capacitor, and the second electrode in an outermost layer of the noise reduction capacitor is face-joined to a face of the base conductor at a side where the electrically heating member is provided and the first electrode in an outermost layer and the relay conductor are face-joined.
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公开(公告)号：US09913404B2
公开(公告)日：2018-03-06
申请号：US15303392
申请日：2015-06-12
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H05K7/20254 , H01L23/3675 , H01L23/42 , H01L23/473
摘要： A cooling apparatus has: an opening formed in a cooling plate for cooling an electronic component; and an electronic component accommodating section formed in the opening. A cooling pipeline is disposed in a manner to surround an outer side surface section of the electronic component accommodating section, whereby the electronic component and the cooling pipeline are arranged at substantially the same height as a top of the cooling plate to realize a low profile. In addition, the electronic component accommodating section, which is joined to the cooling plate, is configured that a side surface section thereof is in contact with a side surface section of the electronic component via a potting material. In this way, an area that contributes to heat radiation is increased.
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