公开(公告)号：US20040241324A1

公开(公告)日：2004-12-02

申请号：US10868683

申请日：2004-06-15

Applicant: MOLECULAR IMPRINTS, INC.

Inventor： Michael P.C. Watts ,  Byung-Jin Choi ,  Sidlgata V. Sreenivasan

IPC: B05D005/00 ,  B05D001/36

CPC classification number: B05D7/24 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: The present invention provides a system to dispense a liquid, contained in a cartridge, onto a substrate employing a dispensing system under control of a processor in data communication with a memory.

Abstract translation: 本发明提供了一种系统，其将包含在盒中的液体分配到采用在与存储器进行数据通信的处理器的控制下的分配系统的基板上。

公开(公告)号：US20040223131A1

公开(公告)日：2004-11-11

申请号：US10864591

申请日：2004-06-09

Applicant: MOLECULAR IMPRINTS, INC.

Inventor： Byung J. Choi ,  Ronald D. Voisin ,  Sidlgata V. Sreenivasan ,  Michael P.C. Watts ,  Daniel Babbs ,  Mario J. Meissl ,  Hillman Bailey ,  Norman E. Schumaker

IPC: G03B027/58

CPC classification number: G03F7/70875 ,  B29C33/20 ,  B29C43/003 ,  B29C43/021 ,  B29C43/36 ,  B29C43/58 ,  B29C2043/025 ,  B29C2043/3233 ,  B29C2043/3488 ,  B29C2043/5841 ,  B29D11/00365 ,  G03B27/62 ,  G03F7/707

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.

Abstract translation: 本发明涉及一种夹持系统，用于调制基板，以便相对于其上将与基底形成图案的晶片适当地成形和定位基板。

公开(公告)号：US20040256764A1

公开(公告)日：2004-12-23

申请号：US10463396

申请日：2003-06-17

Applicant: University of Texas System Board of Regents ,  MOLECULAR IMPRINTS, INC.

Inventor： Byung Jin Choi ,  Frank Y. Xu ,  Nicholas A. Stacy ,  Van Nguyen Truskett ,  Michael P.C. Watts

IPC: B29C059/00

CPC classification number: B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable material with the surface. A conditioned layer is formed from the conformable material. The conditioned layer has first and second sub-portions, with the first sub-portion being solidified and the second sub-portion having a first affinity for the surface and a second affinity for the first sub-portion. The first affinity is greater than the second affinity. In this fashion, upon separation of the mold from the conditioned layer, a subset of the second sub-portion maintains contact with the mold, thereby reducing the probability that a pattern formed in the conditioned layer becomes compromised. These and other embodiments are described herein.

Abstract translation: 本发明提供一种降低基材上的适形区域和选择性地与适形区域接触的模具图案之间的粘附性的方法。 该方法的特征在于在基底上形成适形材料并使适形材料与表面接触。 由适形材料形成调理层。 调理层具有第一和第二子部分，其中第一子部分被固化，第二子部分对于表面具有第一亲和力，对第一子部分具有第二亲和力。 第一亲和力大于第二亲和力。 以这种方式，在模具与调理层分离时，第二子部分的子集保持与模具的接触，从而降低在调理层中形成的图案变得损害的可能性。 这些和其他实施例在本文中描述。

公开(公告)号：US20040112861A1

公开(公告)日：2004-06-17

申请号：US10316963

申请日：2002-12-11

Applicant: MOLECULAR IMPRINTS, INC.

Inventor： Byung J. Choi ,  Ronald D. Voisin ,  Sidlgata V. Sreenivasan ,  Michael P.C. Watts ,  C. Grant Willson ,  Norman E. Schumaker

IPC: C23F001/00

CPC classification number: G03F7/707 ,  G03F7/70875

Abstract: The present invention is directed to a method for modulating shapes of a substrate, having first and second opposed surfaces. This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate.

Abstract translation: 本发明涉及一种用于调制具有第一和第二相对表面的基底的形状的方法。 这是通过在第一相对表面的不同区域之间产生压差来减少第二相对表面中由轴承在基底上的外力产生的结构变形来实现的。