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公开(公告)号：US06568581B2
公开(公告)日：2003-05-27
申请号：US09808803
申请日：2001-03-15
IPC分类号： B23K3112
CPC分类号： H01L24/85 , B23K20/004 , H01L21/67288 , H01L24/48 , H01L24/78 , H01L2224/48091 , H01L2224/48465 , H01L2224/78301 , H01L2224/85 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01046 , H01L2924/01059 , H01L2924/01082 , H01L2924/10253 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A device for monitoring a wire bonding process measures an electric signal applied to a bond wire during the bonding process, and generates an output which discriminates between successful and unsuccessful bonding. The device employs at least one variable parameter. The value of the variable parameter is determined beforehand in a learning process by monitoring examples of actual wire bonding operations. Thus, the detection method may adapt to changing requirements automatically and operate under optimal conditions for a large variety of circuits to be processed. The electric signal is preferably oscillating, and the measurement preferably includes its peak or RMS amplitude.
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公开(公告)号：US06660956B1
公开(公告)日：2003-12-09
申请号：US10049163
申请日：2002-02-07
IPC分类号： B23K1116
CPC分类号： H01L24/78 , H01L21/67138 , H01L21/67253 , H01L24/45 , H01L2224/45015 , H01L2224/451 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01023 , H01L2924/01033 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20757 , H01L2924/00015
摘要： A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is compared with a reference value to determine whether the ball formed is satisfactory.
摘要翻译： 一种在焊线机中监测球形成工艺的方法。 监视引线接合器上的电极与安装在其上形成球的引线接合器的线的末端之间的辉光放电参数。 将监视的参数与参考值进行比较，以确定形成的球是否令人满意。
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