-
公开(公告)号：US20140144169A1
公开(公告)日：2014-05-29
申请号：US14131230
申请日：2012-07-05
IPC分类号： H05K7/20
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
-
2.发明申请SEMICONDUCTOR DEVICE HAVING POWER SUPPLY-SIDE AND GROUND-SIDE METAL REINFORCING MEMBERS INSULATED FROM EACH OTHER 失效具有电源侧和地面金属增强件的半导体器件从每个其他绝缘体公开(公告)号：US20120126432A1
公开(公告)日：2012-05-24
申请号：US13388285
申请日：2010-08-20
申请人： Kenichi Inaba , Minoru Yoshikawa
发明人： Kenichi Inaba , Minoru Yoshikawa
IPC分类号： H01L23/48
CPC分类号： H01L23/50 , H01L23/49833 , H01L2224/16225
摘要： Provided is a semiconductor device which includes a wiring substrate; a semiconductor chip fixedly attached to a first surface of the wiring substrate; a power supply pad that is provided on a second surface opposite to the first surface of the wiring substrate, and supplies electric power to the wiring substrate; a ground pad that is provided on the second surface of the wiring substrate and grounds the wiring substrate; a power supply-side reinforcing member that is connected to the power supply pad and made of metal; a ground-side reinforcing member that is connected to the ground pad and made of metal; and an insulating part that insulates the power supply-side reinforcing member and the ground-side reinforcing member from each other.
摘要翻译： 提供一种包括布线基板的半导体器件; 固定在所述布线基板的第一面上的半导体芯片; 电源焊盘，其设置在与所述布线基板的所述第一面相反的第二表面上，并且向所述布线基板供电; 接地焊盘，其设置在所述布线基板的所述第二表面上并使所述布线基板接地; 电源侧加强构件，其连接到所述电源垫并由金属制成; 接地侧加强构件，其与接地垫连接并由金属制成; 以及将供电侧加强构件和接地侧加强构件彼此绝缘的绝缘部。
-
公开(公告)号：US09288931B2
公开(公告)日：2016-03-15
申请号：US14131230
申请日：2012-07-05
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
-
公开(公告)号：US20130206368A1
公开(公告)日：2013-08-15
申请号：US13880252
申请日：2011-10-14
CPC分类号： F28D15/02 , B23P15/26 , F28D15/0266 , F28F13/187 , H01L23/427 , H01L2924/0002 , Y10T29/49359 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, the cooling performance adversely decreases if the evaporator includes projections activating the convection heat transfer and the bubble nuclei are formed on the inner wall surface, therefore, a cooling device according to an exemplary aspect of the invention includes an evaporator storing a refrigerant; a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat; and a connection connecting the evaporator and the condenser; wherein the evaporator includes a base thermally contacting with an object to be cooled, and a container; the base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant; and a bubble nucleus forming surface is included only on a part of a refrigerant contacting surface including the boiling surface and the surface of the projections.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，如果蒸发器包括启动对流热传递的凸起并且在内壁表面上形成气泡核，则冷却性能不利地降低，因此，根据本发明的示例性方面的冷却装置 包括存储制冷剂的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的蒸气状制冷剂的冷凝器; 以及连接蒸发器和冷凝器的连接件; 其中所述蒸发器包括与要冷却的物体热接触的基座和容器; 基部包括在与制冷剂接触的内壁侧的表面的沸腾面上的多个突起部; 并且气泡核形成表面仅包括在包括沸腾表面和突起的表面的制冷剂接触表面的一部分上。
-
公开(公告)号：US20130025826A1
公开(公告)日：2013-01-31
申请号：US13638474
申请日：2011-03-15
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.
摘要翻译： 本发明的相变冷却器包括：多个热接收单元，其使得制冷剂通过从发热体接收的热量将液相变成气体; 一个散热单元，其通过向周围区域辐射热量使制冷剂从气体向液体变化; 多个蒸汽管，分别将来自每个热接收单元的蒸汽状态的制冷剂输送到散热单元; 液体管，其将从液体状态的制冷剂从散热单元分别循环到各个受热单元; 以及将每个所述热接收单元彼此连接的旁通管。
-
公开(公告)号：US09605907B2
公开(公告)日：2017-03-28
申请号：US13638474
申请日：2011-03-15
IPC分类号： F28D15/02 , H01L23/427 , H01L23/467
CPC分类号： F28D15/0266 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.
-
公开(公告)号：US20150034288A1
公开(公告)日：2015-02-05
申请号：US14349034
申请日：2012-09-26
IPC分类号： F28F3/12
CPC分类号： F28F3/12 , F28D15/0233 , F28D2015/0216 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, a cooling device becomes larger when a degree of freedom of the arrangement in installing it in electronic equipment is increased, and that it is impossible to obtain a sufficient degree of freedom of the arrangement, therefore, a flat plate cooling device according to an exemplary aspect of the invention includes a plate-like container including a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container includes a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit includes a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，当安装在电子设备中的布置的自由度增加时，冷却装置变大，并且不可能获得足够的布置自由度， 根据本发明的示例性方面的平板冷却装置包括：板状容器，包括第一平板和与第一平板相对的第二平板; 封闭在板状容器中的制冷剂; 以及引导壁单元，其将所述第一平板连接到所述第二平板并控制所述板状容器中的制冷剂的流动; 其特征在于，所述板状容器具有与设置在所述第一平板和所述第二平板中的至少一个上的加热元件热连接的热接收区域， 并且导向壁单元包括一对导向壁，并且引导壁设置在受热区域的相对侧上。
-
公开(公告)号：US20140165638A1
公开(公告)日：2014-06-19
申请号：US14235951
申请日：2012-07-20
IPC分类号： H05K7/20
CPC分类号： H05K7/20309 , F28D15/0266 , F28D2021/0028 , H01L23/427 , H01L2224/16 , H05K7/20318
摘要： A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device.A cooling device of the present invention comprises an evaporation unit which contains a refrigerant, a condensation unit which performs heat radiation by condensing and liquefying vapor-phase refrigerant which was vaporized at the evaporation unit, and piping which connects the evaporation unit with the condensation unit; wherein the evaporation unit comprises an evaporation container and a partition wall section which is arranged within the evaporation container and constitutes a flow path of the refrigerant, and the height of the partition wall section is equal to or larger than the height of the vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container.
摘要翻译： 采用沸腾冷却方法的冷却装置安装在薄型电子装置中时不能表现出足够的冷却性能。 本发明的冷却装置包括：蒸发单元，其包含制冷剂;冷凝单元，其通过冷凝和液化在所述蒸发单元处蒸发的气相制冷剂进行散热;以及管道，其将所述蒸发单元与所述冷凝单元连接 ; 其中所述蒸发单元包括蒸发容器和分隔壁部分，所述分隔壁部分布置在所述蒸发容器内并构成所述制冷剂的流动路径，并且所述分隔壁部分的高度等于或大于所述气液体的高度 制冷剂的界面小于蒸发容器的高度。
-
公开(公告)号：US20130333414A1
公开(公告)日：2013-12-19
申请号：US13818091
申请日：2011-07-05
申请人： Kenichi Inaba , Minoru Yoshikawa
发明人： Kenichi Inaba , Minoru Yoshikawa
IPC分类号： H05K7/20
CPC分类号： H05K7/20 , F28D15/0266 , H05K7/20681
摘要： A system for cooling an electronic device of the present invention cools air warmed by exhaust heat of an electronic device, and includes an evaporator, a condenser, a gas flow channel, and a liquid flow channel. The evaporator is provided in a direction in which air is blown out by the electronic device, and causes a liquid coolant to undergo a phase transition to a gaseous coolant by absorbing heat of the air blown out from the electronic device. The condenser causes the gaseous coolant to undergo a phase transition to a liquid coolant by releasing heat of the gaseous coolant. The gas flow channel flows the gaseous coolant undergone the phase transition by the evaporator, into the condenser. The liquid flow channel flows the liquid coolant undergone the phase transition by the condenser, into the evaporator. The condenser is arranged above the evaporator.
摘要翻译： 本发明的电子设备的冷却系统冷却由电子设备的排热加热的空气，并且包括蒸发器，冷凝器，气体流路和液体流路。 蒸发器设置在空气被电子设备吹出的方向上，并且通过吸收从电子设备吹出的空气的热量使液体冷却剂经历与气态冷却剂的相变。 冷凝器使得气态冷却剂通过释放气态冷却剂的热而经历到液体冷却剂的相变。 气流通道使经过蒸发器的相变的气态冷却剂流入冷凝器。 液体流动通道使经冷凝器相转变的液体冷却剂流入蒸发器。 冷凝器布置在蒸发器的上方。
-
公开(公告)号：US20130319639A1
公开(公告)日：2013-12-05
申请号：US14000681
申请日：2012-02-17
CPC分类号： F28D15/00 , B23P15/26 , F28D15/0266 , F28D15/0275 , F28F3/02 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, it is difficult to improve the cooling performance without increasing manufacturing costs, therefore, a cooling device according to an exemplary aspect of the invention includes a heat receiving unit storing a refrigerant and receiving the heat from an object to be cooled; a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant arising from a refrigerant vaporizing in the heat receiving unit; and a connection connecting the heat receiving unit to the heat radiating unit; wherein the heat receiving unit includes a base thermally contacting with the object to be cooled, and a container connected to the connection; the base includes a heat receiving unit outer wall composing a part of an outer wall of the heat receiving unit, and a plurality of projections disposed on a heat receiving unit undersurface of an undersurface at an inner wall side contacting with the refrigerant; the base includes a bubble nucleus forming surface on a refrigerant contacting surface composed of the heat receiving unit undersurface and the surface of the projection; and the heat receiving unit includes a vapor-state refrigerant region containing a vapor-state refrigerant between the top edge of the projection and one of inner wall surfaces of the container facing the heat receiving unit undersurface.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，难以提高冷却性能而不增加制造成本，因此，根据本发明的示例性方面的冷却装置包括：储存制冷剂的热量接收单元， 待冷却物体; 散热单元，其通过冷凝和液化在所述受热单元中蒸发的制冷剂产生的蒸气状制冷剂来散热; 以及将热接收单元连接到散热单元的连接; 其中所述热接收单元包括与待冷却物体热接触的基座和连接到所述连接件的容器; 所述基座包括构成所述受热单元的外壁的一部分的受热单元外壁和在与所述制冷剂接触的内壁侧的下表面的受热单元下表面上的多个突起; 底座包括由热接收单元下表面和突起的表面构成的制冷剂接触表面上的气泡核形成表面; 并且所述受热单元包括在所述突起的顶部边缘和所述容器的面对所述受热单元下表面的内壁表面之一中包含蒸气状态的制冷剂的蒸汽状态的制冷剂区域。
-
-
-
-
-
-
-
-
-
搜索结果
18 条记录 (耗时 0.018 秒)
