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公开(公告)号：US20240030957A1
公开(公告)日：2024-01-25
申请号：US18477561
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Takanori UEJIMA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON
CPC classification number: H04B1/38 , H03F3/245 , H03F2200/294 , H03F2200/451 , H03F2200/171
Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a plurality of external connection terminals disposed on the major surface; a plurality of inter-substrate connection terminals disposed between the major surfaces to couple the module substrate to the module substrate; a first electronic component (integrated circuit) including a switch; a second electronic component including a filter coupled to a power amplifier via the switch; and a third electronic component including a filter coupled to the power amplifier via the switch. The first electronic component, the second electronic component, and the third electronic component are disposed in the same module substrate.
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公开(公告)号：US20240030954A1
公开(公告)日：2024-01-25
申请号：US18473310
申请日：2023-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Yoshihiro DAIMON , Takashi YAMADA
CPC classification number: H04B1/38 , H03H9/25 , H01Q1/38 , H01Q1/2283 , H01Q15/24 , H01Q1/2208
Abstract: A radio frequency module includes a module substrate that has main surfaces that face each other, a module substrate that has main surfaces that face each other. A first main surface faces a second main surface. Multiple electronic components are disposed between the main surfaces, on or along one main surface, and on or along another main surface. Multiple external connection terminals are disposed on or along one main surface and are joined to the module substrate and a motherboard. An absolute value of a difference between a thermal expansion coefficient of the module substrate and a thermal expansion coefficient of the motherboard is smaller than an absolute value of a difference between a thermal expansion coefficient of the module substrate and the thermal expansion coefficient of the motherboard.
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公开(公告)号：US20230079361A1
公开(公告)日：2023-03-16
申请号：US18056816
申请日：2022-11-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji TAHARA , Seikoh ONO , Kiyoshi AIKAWA , Masanari MIURA , Hiromichi KITAJIMA
Abstract: A high-frequency circuit includes: a diplexer that is composed of a filter which has a pass band including a first frequency band group and a filter which has a pass band including a second frequency band group; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a first communication band; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a second communication band; and switches that are connected with the notch filters. A band pass filter whose pass band is the first communication band and a band pass filter whose pass band is the second communication band are not connected between the filter and the switches.
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公开(公告)号：US20240030165A1
公开(公告)日：2024-01-25
申请号：US18475231
申请日：2023-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Hiromichi KITAJIMA , Takanori UEJIMA , Takashi YAMADA , Yoshihiro DAIMON
IPC: H01L23/66 , H01L23/00 , H01L25/065 , H01L23/498 , H01L23/552 , H03F3/213
CPC classification number: H01L23/66 , H01L24/16 , H01L25/0652 , H01L23/49822 , H01L23/49838 , H01L23/552 , H03F3/213 , H01L2223/6655 , H01L2223/6672 , H01L2224/16155 , H01L2224/16137 , H01L2924/1206 , H01L2924/1205 , H01L2924/14215 , H03F2200/294
Abstract: A high-frequency module includes a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component (an integrated circuit) including the low-noise amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.
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公开(公告)号：US20240022275A1
公开(公告)日：2024-01-18
申请号：US18475222
申请日：2023-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Takanori UEJIMA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON , Syuichi ONODERA , Yuudai TANOUE , Norihiro SHIMADA
CPC classification number: H04B1/38 , H01Q1/2283 , H03H9/25 , H03H7/38
Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component disposed on the major surface; a second electronic component that includes a first electrode joined to the major surface and a second electrode joined to the major surface and that is disposed between the major surfaces; and a third electronic component disposed on the major surface; and an external connection terminal disposed on the major surface. The second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor. The second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or external connection terminal.
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Patent Agency Ranking
公开(公告)号：US20230223970A1
公开(公告)日：2023-07-13
申请号：US18183331
申请日：2023-03-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Dai NAKAGAWA , Yukiya YAMAGUCHI , Yuji TAKEMATSU , Motoji TSUDA , Mayuka ONO , Hiroki FUJIWARA , Kiyoshi AIKAWA , Takashi YAMADA
Abstract: In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.
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公开(公告)号：US20220021510A1
公开(公告)日：2022-01-20
申请号：US17314043
申请日：2021-05-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji TAHARA , Seikoh ONO , Kiyoshi AIKAWA , Masanari MIURA , Hiromichi KITAJIMA
Abstract: A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.
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公开(公告)号：US20240030956A1
公开(公告)日：2024-01-25
申请号：US18474289
申请日：2023-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Kiyoshi AIKAWA , Yoshihiro DAIMON , Takashi YAMADA
CPC classification number: H04B1/38 , H03H9/25 , H01Q1/38 , H01Q1/2283 , H01Q15/24 , H01Q1/2208
Abstract: A radio-frequency module includes: plural electronic components that include plural bare SAW devices and that are disposed between a major surface of a module substrate and a major surface of a module substrate, on a major surface of the module substrate, and on a major surface of the module substrate; plural external connection terminals disposed on the major surface; and resin members. The resin member covers the plural SAW devices but does not fill between central regions of the plural bare SAW devices in which the IDT electrodes are disposed and the major surface to which plural bump electrodes are joined. The plural bare SAW devices are disposed on the major surface, and no bare SAW devices are disposed between the major surfaces and on the major surface.
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公开(公告)号：US20240030163A1
公开(公告)日：2024-01-25
申请号：US18477564
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON , Takanori UEJIMA
CPC classification number: H01L23/645 , H04B1/40 , H03F3/213 , H03F1/565 , H01L23/66 , H01L25/0652 , H01L23/642 , H03F2200/451 , H01L2223/6655 , H01L2223/6677
Abstract: A radio-frequency module includes module substrates, multiple electronic components, and multiple external connection terminals. The module substrate has major surfaces that are opposite to each other. The module substrate has major surfaces that are opposite to each other. The module substrate is disposed such that the major surface faces the major surface. The multiple electronic components are disposed between the major surfaces, at the major surface, or at the major surface. The external connection terminals are disposed at the major surface. The multiple electronic components include one or more first electronic components each including at least a transistor and one or more second electronic components each not including any transistor. At the major surface, at least one of the one or more first electronic components is disposed, and the one or more second electronic components are not disposed.
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公开(公告)号：US20240022276A1
公开(公告)日：2024-01-18
申请号：US18477579
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihiro DAIMON , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Takashi YAMADA , Takanori UEJIMA
CPC classification number: H04B1/38 , H03F3/245 , H03F1/30 , H03F2200/451
Abstract: A radio-frequency module includes a module substrate having major surfaces that are opposite to each other; a module substrate having major surfaces that are opposite to each other, the major surface being disposed facing the major surface; a plurality of electronic components disposed between the major surfaces, on the major surface, and on the major surface; and a plurality of external connection terminals disposed on the major surface. The plurality of electronic components include a power amplifier. The power amplifier includes major surfaces that are opposite to each other and a circuit section that is formed at a position closer to the major surface than the major surface, and includes an amplification transistor. The power amplifier has the major surface disposed facing the major surface, and a heat dissipation conductor extending along a direction from the major surface to the major surface is joined to the major surface.
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