公开(公告)号：US20210036201A1

公开(公告)日：2021-02-04

申请号：US17075272

申请日：2020-10-20

Applicant: NICHIA CORPORATION

Inventor： Yasuo FUJIKAWA ,  Takuya WASA ,  Yosuke NAKAYAMA

IPC: H01L33/62 ,  H05K1/14 ,  H01L27/15 ,  F21K9/00 ,  H01L25/075 ,  H05K3/36

Abstract: A light emitting device includes: a substrate including: a flexible base member, a first wiring pattern located on the upper surface of the base member, the first wiring pattern including: a first component-side conductive portion, and a second component-side conductive portion, and a plurality of reinforcing lands located on the upper surface of the base member, the plurality of reinforcing lands including: a first reinforcing land, and a second reinforcing land; and a plurality of light emitting elements mounted on the substrate, each light emitting element being electrically connected to the first component-side conductive portion and the second component-side conductive portion.

公开(公告)号：US20180090654A1

公开(公告)日：2018-03-29

申请号：US15699289

申请日：2017-09-08

Applicant: NICHIA CORPORATION

Inventor： Tomohiro IKEDA ,  Masaaki KATSUMATA ,  Yohei INAYOSHI ,  Yosuke NAKAYAMA ,  Yumiko KAMESHIMA

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0075 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.

公开(公告)号：US20160254429A1

公开(公告)日：2016-09-01

申请号：US15054697

申请日：2016-02-26

Applicant: NICHIA CORPORATION

Inventor： Yasuo FUJIKAWA ,  Takuya WASA ,  Yosuke NAKAYAMA

IPC: H01L33/62 ,  H01L33/10 ,  H01L33/08

CPC classification number: H01L33/62 ,  F21K9/00 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2105/16 ,  F21Y2107/70 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/156 ,  H05K1/118 ,  H05K1/141 ,  H05K3/363 ,  H05K2201/09172 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: A light emitting device includes a first substrate including a flexible first base member and a first wiring pattern provided on the first base member; a second substrate including a second base member and a second wiring pattern provided on the second base member; and a plurality of light emitting elements mounted on the first wiring pattern. The first substrate includes: a joining end portion that is located at a first, joining end of the first substrate, and that overlaps a portion of the second substrate, and a second end, other than the joining end, that does not overlap the second substrate. The first wiring pattern and the second wiring pattern do not face each other. An electrically conductive joining member is disposed across the first wiring pattern and the second wiring pattern, while partially covering the joining end portion of the first substrate.

Abstract translation: 发光器件包括：第一基板，包括柔性第一基底部件和设置在第一基底部件上的第一布线图案; 第二基板，包括设置在所述第二基底构件上的第二基底构件和第二布线图案; 以及安装在第一布线图案上的多个发光元件。 所述第一基板包括：接合端部，其位于所述第一基板的第一接合端，并且与所述第二基板的一部分重叠，以及与所述接合端不同的第二端， 基质。 第一布线图案和第二布线图案不相对。 在第一布线图案和第二布线图案的两侧设置导电性接合构件，同时部分地覆盖第一基板的接合端部。

公开(公告)号：US20200013937A1

公开(公告)日：2020-01-09

申请号：US16573402

申请日：2019-09-17

Applicant: NICHIA CORPORATION

Inventor： Tomohiro IKEDA ,  Masaaki KATSUMATA ,  Yohei INAYOSHI ,  Yosuke NAKAYAMA ,  Yumiko KAMESHIMA

IPC: H01L33/64

Abstract: A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.

公开(公告)号：US20190074419A1

公开(公告)日：2019-03-07

申请号：US16172478

申请日：2018-10-26

Applicant: NICHIA CORPORATION

Inventor： Yasuo FUJIKAWA ,  Takuya WASA ,  Yosuke NAKAYAMA

IPC: H01L33/62 ,  F21K9/00 ,  H05K1/14

Abstract: A light emitting device includes a first substrate including a flexible first base member and a first wiring pattern provided on the first base member; a second substrate including a second base member and a second wiring pattern provided on the second base member; and a plurality of light emitting elements mounted on the first wiring pattern. The first substrate includes: a joining end portion that is located at a first, joining end of the first substrate, and that overlaps a portion of the second substrate, and a second end, other than the joining end, that does not overlap the second substrate. The first wiring pattern and the second wiring pattern do not face each other. An electrically conductive joining member is disposed across the first wiring pattern and the second wiring pattern, while partially covering the joining end portion of the first substrate.