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公开(公告)号:US20180090654A1
公开(公告)日:2018-03-29
申请号:US15699289
申请日:2017-09-08
Applicant: NICHIA CORPORATION
Inventor: Tomohiro IKEDA , Masaaki KATSUMATA , Yohei INAYOSHI , Yosuke NAKAYAMA , Yumiko KAMESHIMA
CPC classification number: H01L33/647 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L2224/16225 , H01L2224/48091 , H01L2224/48137 , H01L2933/0075 , H05K1/189 , H05K3/0061 , H05K2201/10106 , H01L2924/00014
Abstract: A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.
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公开(公告)号:US20170092817A1
公开(公告)日:2017-03-30
申请号:US15277662
申请日:2016-09-27
Applicant: NICHIA CORPORATION
Inventor: Tomohiro IKEDA , Masaaki KATSUMATA , Yohei INAYOSHI , Kazuhito FUKUI
CPC classification number: H01L33/483 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16225
Abstract: A light emitting device is provided that can restrain deterioration of a mount substrate made of resin, the light emitting device including: a support member that is made of resin; a pair of wirings that are arranged on the support member; a light emitting element that is arranged to cross the pair of wirings and that has a pair of electrodes on one side running in parallel to the pair of wirings so as to be electrically connected; and a vaporproof member in a film shape that seamlessly covers an upper face of the support member, at least, in a region where the light emitting element is arranged between the pair of wirings in a plan view, wherein the vaporproof member has a higher vaporproof property than that of the support member.
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公开(公告)号:US20160252218A1
公开(公告)日:2016-09-01
申请号:US15054588
申请日:2016-02-26
Applicant: NICHIA CORPORATION
Inventor: Yasuo FUJIKAWA , Takuya WASA , Tomohiro IKEDA , Yohei INAYOSHI , Motokazu YAMADA
CPC classification number: F21V19/005 , F21Y2103/10 , F21Y2105/16 , F21Y2113/00 , F21Y2115/10 , G02F1/1336 , G02F1/133603 , G02F1/133605 , H01L25/0753 , H05K1/189 , H05K2201/10106
Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.
Abstract translation: 发光器件包括多个长方形柔性基板,每个柔性基板包括片状基体和形成在基体的一个面上的布线图案,并且每个柔性基板具有设置在其上的多个发光部分; 多个反射层,每个反射层设置在相应柔性基板上方的相应发光部分的周边; 由光反射树脂制成的绝缘反射片,所述反射片具有多个通孔,所述多个通孔使得所述发光部分和所述反射层的至少一部分经由所述通孔露出; 以及多个粘合部件,在不形成反射层的区域中,各粘接部件将各柔性基板粘贴在反射片上。
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公开(公告)号:US20190101269A1
公开(公告)日:2019-04-04
申请号:US16145689
申请日:2018-09-28
Applicant: NICHIA CORPORATION
Inventor: Yohei INAYOSHI , Masaaki KATSUMATA , Tomohiro IKEDA
IPC: F21V19/00
Abstract: A light-emitting device includes a support board including a first base with flexibility and having a region where a first metal film is formed, a connection board disposed on an upper surface of the support board and including a second base on which a second metal film is formed, a light-emitting element mounted on the connection board, and a conductive member in contact with the first metal film and with the second metal film.
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公开(公告)号:US20180180263A1
公开(公告)日:2018-06-28
申请号:US15901765
申请日:2018-02-21
Applicant: NICHIA CORPORATION
Inventor: Yasuo FUJIKAWA , Takuya WASA , Tomohiro IKEDA , Yohei INAYOSHI , Motokazu YAMADA
IPC: F21V19/00 , G02F1/1335 , H01L25/075 , F21Y103/10 , F21Y105/16 , F21Y113/00 , F21Y115/10 , H05K1/18
CPC classification number: F21V19/005 , F21Y2103/10 , F21Y2105/16 , F21Y2113/00 , F21Y2115/10 , G02F1/1336 , G02F1/133603 , G02F1/133605 , H01L25/0753 , H05K1/189 , H05K2201/10106
Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.
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公开(公告)号:US20210041089A1
公开(公告)日:2021-02-11
申请号:US17079519
申请日:2020-10-26
Applicant: NICHIA CORPORATION
Inventor: Yohei INAYOSHI , Masaaki KATSUMATA , Tomohiro IKEDA
IPC: F21V19/00 , G02F1/13357 , H05K1/00 , H01L33/62
Abstract: A method of manufacturing a light-emitting device includes: providing a second base with a plurality of light-emitting elements, the second base having an upper surface on which a pattern of second metal films is formed, the plurality of light-emitting elements being provided on the pattern of second metal films; cutting the second base to singulate the second base into a plurality of connection boards on each of which respective one of the plurality of light-emitting elements is mounted; providing a support board including a first base, the first base being flexible, the first base including a pattern of first metal films; placing the plurality of connection boards on the support board; and forming, for each of the plurality of connection boards, a conductive member so as to be in contact with the pattern of second metal films on the connection board and with the pattern of first metal films.
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公开(公告)号:US20200013937A1
公开(公告)日:2020-01-09
申请号:US16573402
申请日:2019-09-17
Applicant: NICHIA CORPORATION
Inventor: Tomohiro IKEDA , Masaaki KATSUMATA , Yohei INAYOSHI , Yosuke NAKAYAMA , Yumiko KAMESHIMA
IPC: H01L33/64
Abstract: A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.
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公开(公告)号:US20190257499A1
公开(公告)日:2019-08-22
申请号:US16402129
申请日:2019-05-02
Applicant: NICHIA CORPORATION
Inventor: Yasuo FUJIKAWA , Takuya WASA , Tomohiro IKEDA , Yohei INAYOSHI , Motokazu YAMADA
IPC: F21V19/00 , G02F1/13357 , G02F1/1335 , H01L25/075
Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.
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