公开(公告)号：US20230034147A1

公开(公告)日：2023-02-02

申请号：US17769471

申请日：2020-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yusuke YAMANARI ,  Makoto SAITO ,  Naoaki HIGUCHI ,  Hiroki IEDA

IPC: C09J7/38 ,  C09J7/29 ,  C09J7/25

Abstract: Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. and 50% RH of from −0.39 to −0.20, provided that the dimensional change ratio at 23° C. and 50% RH is calculated in accordance with a predetermined equation by: cutting the pressure-sensitive adhesive tape into a belt shape having a width of 20 mm to produce a measurement sample; and tensioning the measurement sample under an environment at 23° C. and 50% RH with a tensile tester at an initial chuck-to-chuck distance set to 20 mm and a tensile rate of 300 mm/min in a longitudinal direction of the measurement sample so that a deformation amount thereof becomes 100%.

公开(公告)号：US20200263060A1

公开(公告)日：2020-08-20

申请号：US16789594

申请日：2020-02-13

Applicant: NITTO DENKO CORPORATION

Inventor： Tatsuya SUZUKI ,  Akira HIRAO ,  Hiroki IEDA

IPC: C09J7/38 ,  C09J11/04 ,  C09J7/10

Abstract: Provided are a PSA layer having a high refractive index and high adhesive strength and a PSA sheet having the PSA layer. The PSA layer comprises a PSA obtained using a PSA composition comprising a base polymer. Here, the PSA layer has a refractive index of 1.54 or higher and the base polymer has a glass transition temperature of 5° C. or lower.

公开(公告)号：US20190127611A1

公开(公告)日：2019-05-02

申请号：US16174624

申请日：2018-10-30

Applicant: NITTO DENKO CORPORATION

Inventor： Tatsuya SUZUKI ,  Hiroki IEDA ,  Akira HIRAO ,  Kenji FURUTA

IPC: C09J7/38 ,  C09J11/04 ,  C09J133/26 ,  C09J133/06 ,  C08K3/22

CPC classification number: C09J7/385 ,  C08K3/01 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/003 ,  C09J7/10 ,  C09J7/38 ,  C09J9/00 ,  C09J11/04 ,  C09J133/066 ,  C09J133/26 ,  C09J2205/102 ,  C09J2400/10 ,  C09J2433/00 ,  C09J2483/00

Abstract: Provided is a thermally conductive PSA sheet that comprises a PSA layer comprising a thermally conductive filler. The PSA sheet has a thermal resistance less than 6.0 cm2·K/W, and also has an adhesive strength N1 at 30 minutes of standing at 23° C. after applied to a stainless steel plate and an adhesive strength N2 at 23° C. after subjected to 5 minutes of heating at 80° C. after applied to a stainless steel plate, satisfying N2/N1≥2.

公开(公告)号：US20190071589A1

公开(公告)日：2019-03-07

申请号：US15766896

申请日：2017-11-20

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroki IEDA ,  Tatsuya SUZUKI ,  Kenji FURUTA ,  Minami WATANABE ,  Takeshi NAKANO ,  Shogo SASAKI

IPC: C09J7/38 ,  B32B27/30 ,  B32B27/16 ,  C09J7/20 ,  C09J201/02 ,  C09J11/08 ,  C09J133/08

Abstract: The present invention provides a pressure-sensitive adhesive (PSA) sheet that achieves, in the form having a support substrate, both low initial adhesiveness and strong adhesiveness during use. The PSA sheet provided in this application includes a support substrate and a PSA layer laminated on at least one side of the support substrate. The PSA layer has a thickness of 3 μm or more but less than 100 μm. The support substrate has a thickness of 30 μm or more. The PSA sheet is configured so that a relationship between an elastic modulus Et′ [MPa] of the PSA sheet and a thickness Ts [mm] of the support substrate fulfils the following formula: 0.1 [N·mm]

公开(公告)号：US20190284447A1

公开(公告)日：2019-09-19

申请号：US16355898

申请日：2019-03-18

Applicant: Nitto Denko Corporation

Inventor： Kenji FURUTA ,  Akira HIRAO ,  Tatsuya SUZUKI ,  Hiroki IEDA

IPC: C09J7/38 ,  G11B25/04 ,  C09J7/40 ,  C09J109/00 ,  C09J133/10

Abstract: Provided is a PSA sheet for use in electronic devices suitable for their downsizing and densification. The PSA sheet for electronic devices provided by this invention comprises a substrate and a PSA layer provided to at least one face of the substrate. The PSA sheet has a laser absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm; has a thermal shrinkage SMD in its machine direction and a thermal shrinkage STD in its transverse direction (direction perpendicular to the machine direction) of both −2 % or greater and 2% or less; and has an amount of thermally released gas of 1300 ng/cm2 or less when determined at 80° C. for 3 hours by GC/MS.

公开(公告)号：US20190127610A1

公开(公告)日：2019-05-02

申请号：US16174613

申请日：2018-10-30

Applicant: NITTO DENKO CORPORATION

Inventor： Tatsuya SUZUKI ,  Hiroki IEDA ,  Akira HIRAO ,  Kenji FURUTA

IPC: C09J7/38 ,  C09J7/10 ,  C09J11/04

Abstract: Provided is a PSA sheet having first and second faces. The first face is an adhesive face formed of one surface of a PSA layer. The first face has a maximum static friction force of 4.0 N/cm2 or less and an adhesive strength N2 of 8 N/20mm or greater at 23° C. after subjected to 5 minutes of heating at 80 ° C. after the first face is applied to a stainless steel plate.

公开(公告)号：US20190077999A1

公开(公告)日：2019-03-14

申请号：US15771636

申请日：2017-11-20

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroki IEDA ,  Tatsuya SUZUKI ,  Kenji FURUTA ,  Minami WATANABE ,  Takeshi NAKANO ,  Shogo SASAKI

IPC: C09J7/38 ,  C09J183/04 ,  C09J201/02

Abstract: The present invention provides a pressure-sensitive adhesive (PSA) sheet that achieves both low initial adhesiveness and strong adhesiveness upon use and has excellent transparency of the PSA layer. The PSA sheet provided herein includes a PSA layer having a haze value of 1.0% or less. The PSA sheet is configured so that a pressure-sensitive adhesive strength N1, after the PSA layer is attached to a stainless steel plate and left at 23° C. for 30 minutes, is 1.5 N/20 mm or less, and a pressure-sensitive adhesive strength N2, after the PSA layer is attached to a stainless steel plate and heated at 80° C. for 5 minutes, is 10.0 N/20 mm or more.