公开(公告)号：US11823902B2

公开(公告)日：2023-11-21

申请号：US16978961

申请日：2019-03-19

Applicant: Nokia Technologies Oy

Inventor： Ross Lundy ,  Ryan Enright

IPC: H01L21/027 ,  H01L21/02 ,  H01L21/67 ,  H01L21/66

CPC classification number: H01L21/0271 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/67248 ,  H01L22/26

Abstract: An apparatus and method which may be used for fabricating nanoscale devices are disclosed. The apparatus comprises measurement means configured to measure swelling of a block copolymer during solvent vapour annealing of the block copolymer. The apparatus also comprises temperature control means configured to receive a control signal indicative of the swelling of the block copolymer. The temperature control means can then control the temperature of the block copolymer as indicated by the control signal.

公开(公告)号：US12185499B2

公开(公告)日：2024-12-31

申请号：US17525012

申请日：2021-11-12

Applicant: Nokia Technologies Oy

Inventor： Ryan Enright ,  Raffaele Luca Amalfi

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/06 ,  G06F1/16 ,  G06F1/20

Abstract: Examples of the disclosure relate to an oscillating heat pipe comprising for cooling components within a bendable electronic device. The oscillating heat pipe comprises at least one condenser region to be positioned in a first portion of the bendable electronic device and at least one evaporator region to be positioned in a second portion of the bendable electronic device. The oscillating heat pipe also comprises at least one bendable region provided between the condenser region and the evaporator region and configured to extend across a hinge of a bendable electronic device wherein at least one bendable region comprises a polymer tubing supported by a flexible helical support structure.

公开(公告)号：US20240055322A1

公开(公告)日：2024-02-15

申请号：US18229700

申请日：2023-08-03

Applicant: Nokia Technologies Oy

Inventor： Yang Liu ,  Raffaele Luca Amalfi ,  Ryan Enright

IPC: H01L23/427 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/427 ,  H01L25/167 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81

Abstract: Examples of the disclosure relate to a three-dimensional chip. The three-dimensional chip includes a plurality of integrated circuit layers and one or more microfluidic channel layers. The plurality of integrated circuit layers includes one or more electronic and/or photonic components and are arranged in a stack. The one or more microfluidic channel layers are positioned between integrated circuit layers. The microfluidic channel layers include microfluidic channels and the microfluidic channels are configured to enable working fluid to flow through the microfluidic channels to provide passive heat transfer for the one or more electronic and/or photonic components in the integrated circuit layers. The microfluidic channels include one or more portions that extend along a microfluidic channel layer and one or more portions that extend through a microfluidic channel layer.

公开(公告)号：US20240053108A1

公开(公告)日：2024-02-15

申请号：US18229229

申请日：2023-08-02

Applicant: Nokia Technologies Oy

Inventor： Ryan Enright ,  Raffaele Luca AMALFI ,  Stefano GRILLANDA

IPC: F28D15/02 ,  H05K7/20

CPC classification number: F28D15/0241 ,  H05K7/20336

Abstract: Examples of the disclosure relate to an apparatus. The apparatus comprises a housing portion and a flexible portion. The housing portion comprises one or more heat sources. The flexible portion is configured to be moved between a closed configuration and an open configuration wherein in the closed configuration the flexible portion is housed in the housing portion and in the open configuration the flexible portion is positioned outside of the housing. The flexible portion comprises a flexible display and an oscillating heat pipe. The oscillating heat pipe is coupled to the one or more heat sources in the housing portion. The oscillating heat pipe is flexible and configured to move with the flexible portion between the closed configuration and the open configuration. One or more condenser regions of the oscillating heat pipe are positioned in the flexible portion.

公开(公告)号：US12256521B2

公开(公告)日：2025-03-18

申请号：US17863506

申请日：2022-07-13

Applicant: Nokia Technologies Oy

Inventor： Raffaele Luca Amalfi ,  Stefano Grillanda ,  Ryan Enright

IPC: H05K7/20 ,  H01S5/024

Abstract: An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.

公开(公告)号：US10718575B2

公开(公告)日：2020-07-21

申请号：US15851406

申请日：2017-12-21

Applicant: Nokia Technologies Oy

Inventor： Ryan Enright ,  Ross Lundy ,  Shenghui Lei ,  Shreyas Chavan

IPC: F28F13/18 ,  F28F21/08

Abstract: An apparatus and heat transfer system, the apparatus comprising: a substrate; a plurality of nucleation sites provided on the substrate; a nanostructured surface surrounding the nucleation sites arranged to enable coalescence induced droplet jumping; wherein both the plurality of nucleation sites and the nanostructured surface are hydrophobic.