中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

122 records (took 0.032 seconds)

    Arrangement Having Semiconductor Components that Emit Electromagnetic Radiation and Production Method Therefor
    6.
    发明申请
    Arrangement Having Semiconductor Components that Emit Electromagnetic Radiation and Production Method Therefor 有权

    公开(公告)号：US20220223570A1

    公开(公告)日：2022-07-14

    申请号：US17614249

    申请日：2020-05-27

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas Schwarz ,  Sebastian Wittmann ,  Andreas Plößl

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/46 ,  H01L33/00 ,  H01L27/14

    Abstract: In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component includes a semiconductor body having an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face, an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components, wherein the output element is arranged at the radiation outlet sides of the semiconductor components, wherein the electrical connection structure is electrically conductively connected with the contact structure, and wherein the connection structure includes an adhesive layer, a growth layer and a connection layer.

    Method of producing an optoelectronic semiconductor component, and optoelectronic semiconductor component
    7.
    发明授权
    Method of producing an optoelectronic semiconductor component, and optoelectronic semiconductor component 有权

    公开(公告)号：US11069663B2

    公开(公告)日：2021-07-20

    申请号：US16468085

    申请日：2018-01-12

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Andreas Plößl ,  Siegfried Herrmann ,  Martin Rudolf Behringer ,  Frank Singer ,  Thomas Schwarz ,  Alexander F. Pfeuffer

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

    Abstract: A method of producing an optoelectronic semiconductor component includes A) providing at least three source substrates, wherein each of the source substrates is equipped with a specific type of radiation-emitting semiconductor chips, B) providing a target substrate having a mounting plane configured to mount the semiconductor chips thereto, C) forming platforms on the target substrate, and D) transferring at least some of the semiconductor chips with a wafer-to-wafer process from the source substrates onto the target substrate so that the semiconductor chips transferred to the target substrate maintain their relative position with respect to one another, within the types of semiconductor chips, wherein on the target substrate the semiconductor chips of each type of semiconductor chips have a specific height above the mounting plane due to the platforms so that the semiconductor chips of different types of semiconductor chips have different heights.

    Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
    8.
    发明授权
    Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component 有权

    公开(公告)号：US10991845B2

    公开(公告)日：2021-04-27

    申请号：US15940929

    申请日：2018-03-29

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Andreas Plößl ,  Siegfried Herrmann ,  Martin Rudolf Behringer ,  Frank Singer ,  Thomas Schwarz

    IPC: H01L33/00 ,  H01L33/48 ,  H01L25/075

    Abstract: A method for producing an optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment the method include A) providing at least two source substrates, wherein each of the source substrates is equipped with a specific type of radiation-emitting semiconductor chip; B) providing a target substrate having a mounting plane, the mounting plane being configured for mounting the semiconductor chip; and C) transferring at least part of the semiconductor chips with a wafer-to-wafer process from the source substrates onto the target substrate so that the semiconductor chips, within one type, maintain their relative position with respect to one another, so that each type of semiconductor chips arranged on the target substrate has a different height above the mounting plane, wherein the semiconductor chips are at least one of at least partially stacked one above the other or at least partially applied to at least one casting layer.

    METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT
    9.
    发明申请
    METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT 审中-公开

    公开(公告)号：US20190333898A1

    公开(公告)日：2019-10-31

    申请号：US16468085

    申请日：2018-01-12

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Andreas Plößl ,  Siegfried Herrmann ,  Martin Rudolf Behringer ,  Frank Singer ,  Thomas Schwarz ,  Alexander F. Pfeuffer

    IPC: H01L25/075 ,  H01L33/00 ,  H01L33/62

    Abstract: A method of producing an optoelectronic semiconductor component includes A) providing at least three source substrates, wherein each of the source substrates is equipped with a specific type of radiation-emitting semiconductor chips, B) providing a target substrate having a mounting plane configured to mount the semiconductor chips thereto, C) forming platforms on the target substrate, and D) transferring at least some of the semiconductor chips with a wafer-to-wafer process from the source substrates onto the target substrate so that the semiconductor chips transferred to the target substrate maintain their relative position with respect to one another, within the types of semiconductor chips, wherein on the target substrate the semiconductor chips of each type of semiconductor chips have a specific height above the mounting plane due to the platforms so that the semiconductor chips of different types of semiconductor chips have different heights.

Patent Agency Ranking