公开(公告)号：US20210123772A1

公开(公告)日：2021-04-29

申请号：US16662137

申请日：2019-10-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Zeljko PAJKIC ,  Markus BOSS ,  Thomas KIPPES

IPC: G01D5/14 ,  H01S5/022 ,  H05K9/00 ,  H01L25/16 ,  H01L23/552 ,  H01L31/0203 ,  H01L31/0232

Abstract: An optoelectronic device comprises a substrate, an optoelectronic element mounted on the substrate, a shielding cap providing electromagnetic shielding, at least one optical element attached to the shielding cap, and a detection element configured to detect if the shielding cap is mounted on the substrate.

公开(公告)号：US20230042041A1

公开(公告)日：2023-02-09

申请号：US17792679

申请日：2020-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karlheinz ARNDT ,  Matthias GOLDBACH ,  Simon JEREBIC ,  Matthias HOFMANN ,  Markus BOSS ,  Constantin HETZER ,  Harald JAEGER ,  Jens EBERHARD ,  Sebastian STOLL

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/10 ,  H01L33/00 ,  H01L33/56

Abstract: The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.

公开(公告)号：US20220109282A1

公开(公告)日：2022-04-07

申请号：US17423209

申请日：2019-01-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus BOSS ,  Chai Liang LOKE ,  Zeljko PAJKIC ,  Wan Leng LIM

IPC: H01S5/02315 ,  H01S5/02

Abstract: The invention refers to electronic devices (D) and to a method for obtaining electronic devices (D) comprising, electronic elements, in particular optoelectronic elements (7), the method comprising the steps of:—providing (S1) a substrate from which first walls (1) protrude along a Z-axis towards an open end side forming at least one rectangle along a X-Y-plane surrounding a respective at least one space(S);—positioning (S2) a respective electronic element (7a), in particular optoelectronic element (7),within the respective space(S)and connecting it to contact pads (9);—attaching (S3) a respective functional element (11a), in particular optical element (11), in particular a lens, at the open end side of respective first wall (1) to cover the respective space (S);—forming a second wall (2) by surrounding (S4) the respective functional element (11a), in particular optical element (11), with a darn material.