公开(公告)号：US20230327394A1

公开(公告)日：2023-10-12

申请号：US18005876

申请日：2021-07-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Jörg Erich SORG ,  Roland HUETTINGER ,  Matthias HOFMANN ,  Steffen STRAUSS ,  Herbert BRUNNER ,  Ralph WAGNER

IPC: H01S5/02257 ,  H01S5/02224

CPC classification number: H01S5/02257 ,  H01S5/02224 ,  H01S5/4093

Abstract: In one embodiment, the optoelectronic semiconductor component includes at least one optoelectronic semiconductor chip for generating radiation and a housing, in which the at least one optoelectronic semiconductor chip is hermetically encapsulated. The housing includes a housing cover which is secured to a housing main part by a connection means. The housing additionally includes a gas exchange channel which is hermetically sealed by a seal.

公开(公告)号：US20230042041A1

公开(公告)日：2023-02-09

申请号：US17792679

申请日：2020-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karlheinz ARNDT ,  Matthias GOLDBACH ,  Simon JEREBIC ,  Matthias HOFMANN ,  Markus BOSS ,  Constantin HETZER ,  Harald JAEGER ,  Jens EBERHARD ,  Sebastian STOLL

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/10 ,  H01L33/00 ,  H01L33/56

Abstract: The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.