公开(公告)号：US20170218236A1

公开(公告)日：2017-08-03

申请号：US15328360

申请日：2016-03-11

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yozo MATSUKAWA ,  Akira ITO ,  Kenji KITAMURA ,  Morio NAKATANI

IPC: C09J163/00 ,  B32B37/12 ,  C09J5/06 ,  B32B7/12

CPC classification number: C09J163/00 ,  B32B3/04 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B17/06 ,  B32B27/06 ,  B32B27/28 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B37/12 ,  B32B2250/02 ,  B32B2255/00 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2307/51 ,  B32B2307/71 ,  B32B2307/712 ,  B32B2363/00 ,  B32B2405/00 ,  B32B2457/20 ,  B32B2457/202 ,  B32B2457/204 ,  B32B2457/206 ,  B32B2457/208 ,  C08G59/223 ,  C08G59/68 ,  C08L63/00 ,  C09J5/00 ,  C09J5/06 ,  C09J2205/31 ,  C09J2463/00 ,  G06F1/1637

Abstract: The cationically photopolymerizable composition according to the present disclosure includes: (A) a polyfunctional epoxy compound having two or more epoxy groups per molecule; (B) a monofunctional epoxy compound having one epoxy group per molecule; (C) a photocation generator; and (D) an oxetane compound. At least one of the component (A) and the component (B) contains an epoxy compound ((A1) or (B1)) having a polyether backbone per molecule. A mass ratio of the component (A) to the component (B) falls within a range of 90:10 to 30:70.

公开(公告)号：US20230260959A1

公开(公告)日：2023-08-17

申请号：US18140206

申请日：2023-04-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tetsushi KONDA ,  Kenji KITAMURA ,  Takahito HAGIWARA ,  Ryo MATSUBAYASHI ,  Hidekazu UMEDA

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L2224/8384 ,  H01L23/3121

Abstract: A method for manufacturing a composite structure includes: an application step including providing a bonding material on a base member by applying a metal paste onto the base member; a preheating step including heating the bonding material before an element to be bonded is stacked on the bonding material and thereby drying the bonding material until a percentage of an organic component in the bonding material becomes 3% by mass and equal to or less than 8% by mass with respect to the bonding material; a mounting step including stacking the element to be bonded onto the bonding material and heating the bonding material to form a multi-layer stack; and a sintering step including sintering the bonding material by heating the multi-layer stack in a heating furnace and thereby forming the bonding layer.