Cuprous oxide particle dispersion liquid, coating agent composition, and antibacterial/antiviral member
    2.
    发明授权
    Cuprous oxide particle dispersion liquid, coating agent composition, and antibacterial/antiviral member 有权
    氧化亚铜颗粒分散液,涂层剂组合物和抗菌/抗病毒成分

    公开(公告)号:US09414585B2

    公开(公告)日:2016-08-16

    申请号:US14761190

    申请日:2014-02-24

    Abstract: A cuprous oxide particle dispersion liquid includes: cuprous oxide particles; 20 to 100 parts by mass of a phosphate ester-based anionic surfactant per 100 parts by mass of the cuprous oxide particles; and 500 to 10000 parts by mass of an organic solvent per 100 parts by mass of the cuprous oxide particles. The cuprous oxide particles have an average primary particle diameter of 2 nm to 80 nm and have an average secondary particle diameter of 50 nm to 150 nm, the average secondary particle diameter being measured by dynamic light scattering using cumulant analysis. A coating agent composition includes the cuprous oxide particle dispersion liquid and a binder resin, wherein the cuprous oxide particles are contained in a range from 0.1 to 50 parts by mass in 100 parts by mass of a non-volatile matter content of the coating agent composition. An antibacterial/antiviral member includes a substrate and a coating film formed on the substrate and containing the coating agent composition.

    Abstract translation: 氧化亚铜颗粒分散液包括:氧化亚铜颗粒; 相对于100质量份氧化亚铜粒子为20〜100质量份磷酸酯系阴离子表面活性剂; 相对于100质量份氧化亚铜粒子,为有机溶剂500〜10000质量份。 氧化亚铜粒子的平均一次粒径为2nm〜80nm,平均二次粒径为50nm〜150nm,平均二次粒径通过使用累积分析的动态光散射进行测定。 涂料组合物包括氧化亚铜颗粒分散液和粘合剂树脂,其中氧化亚铜颗粒的含量为0.1〜50质量份,100质量份涂料组合物的不挥发物含量 。 抗菌/抗病毒构件包括基材和形成在基材上并含有涂层剂组合物的涂膜。

    OPTICAL SEMICONDUCTOR-DISPERSED RESIN COMPOSITION, METHOD OF PRODUCING SAME, AND ANTIBACTERIAL MEMBER
    5.
    发明申请
    OPTICAL SEMICONDUCTOR-DISPERSED RESIN COMPOSITION, METHOD OF PRODUCING SAME, AND ANTIBACTERIAL MEMBER 审中-公开
    光学半导体分散树脂组合物,其生产方法和抗菌成员

    公开(公告)号:US20150223467A1

    公开(公告)日:2015-08-13

    申请号:US14425489

    申请日:2013-11-18

    Abstract: An optical semiconductor-dispersed resin composition of the present invention includes: an optical semiconductor; 0.1 to 5 parts by mass of a copper compound per 100 parts by mass of the optical semiconductor; 50 to 350 parts by mass of an active energy ray-curable resin per 100 parts by mass of the optical semiconductor; and 0.1 to 20 parts by mass of a photopolymerization initiator per 100 parts by mass of the active energy ray-curable resin. The resin composition is manufactured by performing polymerization of the active energy ray-curable resin and excitation of the optical semiconductor through exposure to active energy rays.

    Abstract translation: 本发明的光学半导体分散树脂组合物包括:光学半导体; 相对于100质量份光半导体,为0.1〜5质量份铜化合物; 相对于光半导体100质量份,活性能量射线固化性树脂50〜350质量份; 和相对于100质量份的活性能量射线固化性树脂为0.1〜20质量份的光聚合引发剂。 通过进行活性能量射线固化树脂的聚合和通过暴露于活性能量射线激发光学半导体来制造树脂组合物。

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