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公开(公告)号：US20170146790A1
公开(公告)日：2017-05-25
申请号：US15426125
申请日：2017-02-07
Inventor： YUTAKA HIROSE , KEISUKE YAZAWA , SHINZO KOYAMA , YOSHIHISA KATO , HIDETO MOTOMURA
CPC classification number: G02B21/367 , G01N21/84 , G01N2201/0627 , G02B21/06 , G02B21/086 , G02B21/26 , G02B2207/123 , G06T1/00 , H04N5/349
Abstract: An image acquisition device includes an optical system, an illumination angle adjustment mechanism, and a stage. The optical system has a lens and a light source disposed in the focal plane of the lens, and generates a collimated illumination light. The illumination angle adjustment mechanism is configured so as to be able to change the irradiation direction of the illumination light with respect to an object. A module is detachably loaded on a stage. The module includes the object and an image sensor which are integrated such that the illumination light transmitted through the object is incident on the image sensor. The stage has a circuit for receiving an output of the image sensor in a state where the module is loaded on the stage.
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Patent Agency Ranking
2.发明申请公开(公告)号：US20150377866A1
公开(公告)日：2015-12-31
申请号：US14741708
申请日：2015-06-17
Inventor： HIDETO MOTOMURA , YOSHIHISA KATO , TSUYOSHI TANAKA , TOKUHIKO TAMAKI
CPC classification number: G02B21/06 , G02B21/362
Abstract: A preparation element set including an image sensor including a sensor surface, a sensor back surface, and a board; a package including a front surface, a back surface, and terminals on the back surface, the front surface touching or facing the sensor back surface; and a transparent plate facing the sensor surface with a subject placed therebetween, wherein the board includes a board surface and a board back surface, a distance between the board surface and the sensor surface is less than a distance between the board back surface and the sensor surface, a distance between the board surface and the sensor back surface is more than a distance between the board back surface and the sensor back surface, conductive holes pierce the board from the board surface to the board back surface, and conductors on the board surface are electrically connected to terminals by using the conductive holes.
Abstract translation: 一种包括传感器表面，传感器背面和板的图像传感器的准备元件组; 包括前表面，后表面和后表面上的端子的封装，前表面接触或面向传感器背表面; 以及面对传感器表面的透明板，其间放置有被摄体，其中所述板包括板表面和板背面，所述板表面和所述传感器表面之间的距离小于所述板背面和所述传感器之间的距离 表面之间，板表面和传感器后表面之间的距离大于板背面与传感器背面之间的距离，导电孔从板表面到板背表面刺穿板，并且板表面上的导体 通过使用导电孔与端子电连接。
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公开(公告)号：US20150281620A1
公开(公告)日：2015-10-01
申请号：US14740113
申请日：2015-06-15
Inventor： MANABU USUDA , YUTAKA HIROSE , YOSHIHISA KATO , NOBUKAZU TERANISHI
IPC: H04N5/378 , H01L31/107 , H04N5/357 , H01L27/146
CPC classification number: H04N5/378 , G01J1/44 , H01L27/14609 , H01L27/14612 , H01L27/14623 , H01L27/14634 , H01L27/14665 , H01L31/107 , H01L2924/381 , H04N5/357 , H04N5/361 , H04N5/369 , H04N5/37455
Abstract: A semiconductor photodetector has at least one unit pixel having a photoelectric conversion part, a charge storage part, and a detection circuit. The photoelectric conversion part includes a charge multiplication region in which incident light is converted into a charge, and the charge is multiplied by avalanche multiplication. The charge storage part is connected to the photoelectric conversion part and stores a signal charge from the photoelectric conversion part. The detection circuit is connected to the charge storage part, converts the signal charge stored in the charge storage part into a voltage, passes the voltage through an amplifier to amplify the voltage, and outputs the amplified voltage.
Abstract translation: 半导体光电检测器具有至少一个具有光电转换部分，电荷存储部分和检测电路的单位像素。 光电转换部包括入射光转换为电荷的电荷倍增区域，电荷乘以雪崩倍增。 电荷存储部分连接到光电转换部分并存储来自光电转换部分的信号电荷。 检测电路连接到电荷存储部分，将存储在电荷存储部分中的信号电荷转换为电压，使电压通过放大器放大，并输出放大的电压。
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公开(公告)号：US20160056577A1
公开(公告)日：2016-02-25
申请号：US14823659
申请日：2015-08-11
Inventor： YUTAKA HIROSE , YOSHIHISA KATO , HIROYUKI MORI , TAICHI SATO , YOSHIHIDE SAWADA , TSUYOSHI TANAKA
CPC classification number: H01R13/64 , B01L9/52 , B01L2300/0645 , B01L2300/0654 , B01L2300/0822 , F16M11/046 , F16M11/10 , G02B21/0008 , G02B21/34 , H01L27/14623 , H01L27/14818 , H01R13/639 , H01R13/73 , H04N1/0315 , H04N1/0318 , H04N5/2257 , H04N5/372
Abstract: A socket includes a first base member that includes a module mount unit allowing a module including an imaging device and an object to be placed thereon and an electric connector that electrically connects the imaging device to an external apparatus, a second base member having an opening, and an engagement unit that causes the first base member to be engaged with the second base member under a condition that the module placed on the module mount unit is sandwiched by the first and second base members. When the first base member is engaged with the second base member by the engagement unit under a condition that the module placed on the module mount unit is sandwiched by the first base member and the second base member, the electric connector is electrically connected to the imaging device, and the object receives illumination light from a light source through the opening.
Abstract translation: 插座包括：第一基座构件，其包括模块安装单元，其允许包括成像装置和物体的模块放置在其上;以及电连接器，其将所述成像装置电连接到外部装置;第二基座构件， 以及接合单元，其使得所述第一基底构件在被放置在所述模块安装单元上的所述模块被所述第一和第二基底构件夹持的状态下与所述第二基底构件接合。 当第一基座部件通过接合单元与位于模块安装单元上的模块夹在第一基座部件和第二基部部件之间的条件下与第二基部部件接合时，电连接器电连接到成像部件 装置，物体通过开口接收来自光源的照明光。
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公开(公告)号：US20150021731A1
公开(公告)日：2015-01-22
申请号：US14511737
申请日：2014-10-10
Inventor： KEISUKE YAZAWA , YUTAKA HIROSE , YOSHIHISA KATO
IPC: H01L27/146 , H01L31/0224 , H01L31/109 , H01L31/108
CPC classification number: H01L27/14649 , B82Y20/00 , H01L27/14636 , H01L27/1464 , H01L27/14687 , H01L29/78 , H01L31/022408 , H01L31/035236 , H01L31/108 , H01L31/109
Abstract: The solid-state imaging device according to the present invention includes a semiconductor substrate including an imaging region and a peripheral circuit region, a wiring layer formed on the semiconductor substrate, a plurality of pixel electrodes arranged in a matrix on the wiring layer above the imaging region, a photoelectric conversion film formed on the wiring layer and the plurality of pixel electrodes above the imaging region, and an upper electrode formed on the photoelectric conversion film. The photoelectric conversion film has a laminated structure in which a plurality of well layers and a plurality of barrier layers are alternately laminated, the well layers made of a first semiconductor having a fundamental absorption edge in a wavelength region longer than a near-infrared light wavelength, and the barrier layers made of an insulator or a second semiconductor having a band gap wider than that of the first semiconductor.
Abstract translation: 根据本发明的固态成像装置包括：半导体衬底，其包括成像区域和外围电路区域;形成在半导体衬底上的布线层;多个像素电极，其布置在阵列上方的矩阵中，高于成像 形成在配线层上的光电转换膜和成像区域上方的多个像素电极以及形成在光电转换膜上的上电极。 光电转换膜具有交替层叠多个阱层和多个势垒层的层叠结构，由具有比近红外光波长长的波长区域的基本吸收边缘的第一半导体构成的阱层 并且由具有比第一半导体宽的带隙的绝缘体或第二半导体制成的阻挡层。
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6.发明申请IMAGE FORMING APPARATUS, IMAGE FORMING METHOD, IMAGE FORMING SYSTEM, AND RECORDING MEDIUM 审中-公开图像形成装置，图像形成方法，图像形成系统和记录介质公开(公告)号：US20150309301A1
公开(公告)日：2015-10-29
申请号：US14682099
申请日：2015-04-09
Inventor： HIDETO MOTOMURA , YASUHIKO ADACHI , YOSHIHISA KATO
CPC classification number: G02B21/06 , G02B21/0008 , G02B21/361
Abstract: An image forming apparatus includes an imager that is electrically connected to an image sensor disposed at a position where light that has passed through a sample slice is incident on the image sensor, and an illumination system that emits illumination light successively in different illumination directions relative to a sample slice to illuminate the sample slice with the illumination light and that emits a first light having a peak in a first wavelength range and a second light having a peak in a second wavelength range. The image forming apparatus obtains a plurality of first-color images with the image sensor while the sample slice is being illuminated with the first light serving as the illumination light successively in the different illumination directions. The image forming apparatus obtains at least one second-color image with the image sensor while the sample slice is being illuminated with the second light in at least one of the different illumination directions. The image forming apparatus generates a high-resolution image on the basis of the plurality of first-color images and the at least one second-color image.
Abstract translation: 图像形成装置包括：成像器，电连接到设置在通过样本片的光入射到图像传感器上的位置处的图像传感器;以及照明系统，其相对于 样品切片，用照明光照射样品切片，并且发射具有第一波长范围的峰值的第一光和在第二波长范围内具有峰值的第二光。 图像形成装置利用图像传感器获取多个第一彩色图像，同时在不同照明方向上连续照射用作照明光的第一光照亮样本片。 图像形成装置在至少一个不同的照明方向上用第二光照射样品片时，利用图像传感器获得至少一个第二彩色图像。 图像形成装置基于多个第一彩色图像和至少一个第二彩色图像生成高分辨率图像。
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