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    Image data compensation for optical or spatial error in an array of photosensitive chips
    1.
    发明授权
    Image data compensation for optical or spatial error in an array of photosensitive chips 有权
    感光芯片阵列中的光学或空间误差的图像数据补偿

    公开(公告)号：US08208684B2

    公开(公告)日：2012-06-26

    申请号：US12497341

    申请日：2009-07-02

    申请人： Paul A. Hosier ,  Martin Edward Banton ,  Frederick O. Hayes, III

    发明人： Paul A. Hosier ,  Martin Edward Banton ,  Frederick O. Hayes, III

    IPC分类号： G06K9/00 ,  H01L27/00 ,  H04N1/46

    CPC分类号： H04N1/047 ,  G06T3/4007 ,  H04N1/193 ,  H04N1/1934 ,  H04N2201/03162 ,  H04N2201/04787 ,  H04N2201/04789 ,  H04N2201/04791 ,  H04N2201/04793

    摘要： A method of processing image data from a multi-chip array with a plurality of photosensitive chips aligned substantially in a transverse direction, including: generating, using a processor for at least one specially programmed computer, a Δy or Δx optical error value equal to a difference in process and transverse directions, respectively, between actual and apparent locations for a first photosensor, the apparent location due to optical error; and storing, in a memory element for the specially programmed computer, respective outputs from the photosensors in the array for first and second scan lines. The actual location is included in the first scan line. The processor retrieves, for use as at least part of useful image data for the first photosensor, the stored output of: the first photosensor for the second scan line for a Δy optical error, or a second photosensor for the first line for a Δx optical error.

    摘要翻译： 一种处理来自多芯片阵列的图像数据的方法，所述多芯片阵列具有基本在横向上排列的多个感光芯片，包括：使用用于至少一个专门编程的计算机的处理器，产生＆Dgr; y或＆Dgr; x光学误差 值分别等于第一光电传感器的实际和表观位置之间的过程和横向方向的差异，由于光学误差引起的表观位置; 以及将用于特殊编程的计算机的存储元件存储在用于第一和第二扫描线的阵列中的光电传感器的相应输出。 实际位置包含在第一条扫描线中。 处理器检索用作第一光电传感器的有用图像数据的至少一部分，存储的输出：用于第一扫描线的第一光电传感器用于光学误差，或用于第一行的第二光电传感器 ＆Dgr; x光学错误。

    Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer
    2.
    发明授权
    Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer 有权
    用于切割半导体晶片的方法，从半导体晶片切割的芯片以及从半导体晶片切割的芯片阵列

    公开(公告)号：US08129258B2

    公开(公告)日：2012-03-06

    申请号：US12646590

    申请日：2009-12-23

    申请人： Paul A. Hosier ,  Nicholas J. Salatino

    发明人： Paul A. Hosier ,  Nicholas J. Salatino

    IPC分类号： H01L21/00

    CPC分类号： H01L23/544 ,  H01L21/268 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for dicing a semiconductor wafer, including: cutting a reference slot in a back main surface of the wafer; cutting a back slot in the back main surface, the back slot positioned with respect to the reference slot; determining a desired location for a chip edge with respect to the reference slot; and applying radiant energy in a path such that a series of reformed regions are formed within the wafer along the path. A crystalline structure of the wafer is modified in the series of reformed regions and an alignment of an edge of the laser is with respect to the desired location for the chip edge and in alignment with the back slot. The method includes separating the wafer along the series of reformed regions to divide portions of the wafer on either side of the series of reformed regions.

    摘要翻译： 一种用于切割半导体晶片的方法，包括：切割晶片的后主表面中的参考槽; 切割后主表面中的后槽，相对于参考槽定位的后槽; 确定芯片边缘相对于参考时隙的期望位置; 并且在路径中施加辐射能，使得沿着路径在晶片内形成一系列重整区。 在一系列重整区域中修改了晶片的晶体结构，并且激光器边缘的对准相对于芯片边缘的期望位置并与后槽对准。 该方法包括沿着一系列重整区域分离晶片以将晶片的部分划分在一系列重整区域的两侧。

    Systems and methods for streak detection in image array scanning using overdetermined scanners and column filtering
    3.
    发明授权
    Systems and methods for streak detection in image array scanning using overdetermined scanners and column filtering 失效
    使用超定义扫描仪和列过滤的图像阵列扫描中条纹检测的系统和方法

    公开(公告)号：US07359093B2

    公开(公告)日：2008-04-15

    申请号：US10845164

    申请日：2004-05-14

    申请人： Stuart A. Schweid ,  Shen-ge Wang ,  Paul A. Hosier

    发明人： Stuart A. Schweid ,  Shen-ge Wang ,  Paul A. Hosier

    IPC分类号： H04N1/409

    CPC分类号： H04N1/4097 ,  H04N1/00092 ,  H04N1/1215 ,  H04N1/193

    摘要： A streak detection method and system in a fixed imaging array digital scanning system obtains image data from each of the plurality of rows in the at least one full color spectrum channel set of rows of positionally discrete sensors and integrates this data to produce an estimate of image data recorded by at least one clear channel row of positionally discrete sensors. A clear channel error signal is generated by the comparison to alert the operator to the presence of non-image data. The clear channel error signal may be refined to through a low pass column filtering process in order to filter out potentially erroneous clear channel error resulting from thermal, mechanical or other noise sources unrelated to image scanning. Stationary obstructions in the field of view of the imaging array, or defects in one or more sensors in the imaging array, are detected through this comparison which would otherwise appear repeatedly reproduced as streaks or lines in the reproduced output image.

    摘要翻译： 固定成像阵列数字扫描系统中的条纹检测方法和系统从至少一个位置离散传感器行的全色谱通道组中的多行中的每一行获得图像数据，并对该数据进行积分以产生图像估计 通过位置离散传感器的至少一个清晰通道行记录的数据。 通过比较产生清晰的通道错误信号，以向操作员警告非图像数据的存在。 可以通过低通列滤波处理来将清除信道误差信号细化为过滤掉与图像扫描无关的热，机械或其它噪声源引起的潜在错误的清除信道误差。 通过该比较来检测成像阵列的视场中的固定障碍物或成像阵列中的一个或多个传感器中的缺陷，否则该比较将被再现为再现的输出图像中的条纹或线条。

    Edge photosite definition by opaque filter layer
    5.
    发明授权
    Edge photosite definition by opaque filter layer 有权
    不透明滤光片边缘光斑定义

    公开(公告)号：US6157019A

    公开(公告)日：2000-12-05

    申请号：US282317

    申请日：1999-03-31

    申请人： Paul A. Hosier

    发明人： Paul A. Hosier

    IPC分类号： H01L27/14 ,  G06T1/00 ,  H01L27/146 ,  H04N1/028 ,  H01L27/00 ,  H01L31/0232 ,  H01L31/062

    CPC分类号： H01L27/14643 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14632

    摘要： The present invention relates to photosensitive chips for creating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. More specifically, the present invention provides a way of shielding the edge photosites with an opaque layer that overlaps the diced region and preserves the integrity of the filter layers while eliminating the need for a guardring to decrease the dead space and consequently reduce the undesirable effects of Moire patterns.

    摘要翻译： 本发明涉及用于从原始图像产生电信号的感光芯片，例如在数字扫描仪，复印机，传真机或其他文件生成或再现装置中可以找到。 更具体地说，本发明提供了一种通过与切割区域重叠的不透明层来屏蔽边缘光电子的方式，并且保持了滤光层的完整性，同时消除了防护装置的需要以减小死空间，并因此减少不利影响 Moir + E，acu e + EE图案。

    Photosensitive silicon chip having a ridge near an end photosite
    7.
    发明授权
    Photosensitive silicon chip having a ridge near an end photosite 失效
    感光硅芯片具有靠近端部光泽的脊

    公开(公告)号：US5696626A

    公开(公告)日：1997-12-09

    申请号：US542247

    申请日：1995-10-12

    申请人： Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Brian T. Ormond

    发明人： Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Brian T. Ormond

    IPC分类号： H01L31/0216 ,  H04N1/04

    CPC分类号： H01L31/02162

    摘要： A photosensitive chip, such as used in a scanner or facsimile, defines a linear array of photosites, each photosite being covered with a filter formed from a cured translucent liquid. At the critical ends of the chip, between the end photosite in the array and the edge of the chip, there is provided a ridge which protrudes over the thickness of the filter. This ridge maintains the physical integrity of the filter.

    摘要翻译： 诸如用于扫描仪或传真机中的感光芯片限定了一种线性阵列的光斑，每个光斑都被由固化的半透明液体形成的过滤器覆盖。 在芯片的临界端，在阵列中的端部闪光和芯片的边缘之间，设置有突出于过滤器厚度的脊。 该脊保持过滤器的物理完整性。

    Process for separating image sensor dies and the like from a wafer that minimizes silicon waste
    8.
    发明授权
    Process for separating image sensor dies and the like from a wafer that minimizes silicon waste 失效
    用于从使硅废料最小化的晶片分离图像传感器管芯等的工艺

    公开(公告)号：US5128282A

    公开(公告)日：1992-07-07

    申请号：US787445

    申请日：1991-11-04

    申请人： Brian T. Ormond ,  Kraig A. Quinn ,  Paul A. Hosier ,  Josef E. Jedlicka

    发明人： Brian T. Ormond ,  Kraig A. Quinn ,  Paul A. Hosier ,  Josef E. Jedlicka

    IPC分类号： H01L21/304 ,  H01L31/18

    CPC分类号： H01L21/304 ,  H01L31/1804 ,  Y02E10/547

    摘要： A process for separating image sensor dies and the like from a wafer in which pairs of separation grooves separating each row of dies are formed in the active side of the wafer, with the tab between each groove pair being substantially equal to the width of the dicing blade, cutting a single bottom groove in the inactive side of the wafer opposite to and spanning each pair of separation grooves, and aligning the dicing blade with the midpoint of the wall of one groove in each pair of grooves so as to cut between the rows of dies. In a second embodiment, a two-pass separation process is enabled in which the tab between separation grooves is slightly larger than the width of the dicing blade, with the dicing blade first aligned with the midpoint of one separation groove to cut one row of dies from the wafer together with part of the tab, with the blade realigned with the midpoint of the other separate groove to cut a second row of dies and the remainder of the tab.

    摘要翻译： 用于从晶片分离图像传感器管芯等的工艺，其中在晶片的有源侧形成有分隔每一列管芯的隔离槽对，每个槽对之间的突片基本上等于切割宽度 切割晶片的不活动侧的单个底槽，与每对分隔槽相对并跨越每对分隔槽，并将切割刀片与每对槽中的一个槽的壁的中点对准，以便在行之间切割 的死亡。 在第二实施例中，能够进行双路分离处理，其中分离槽之间的突片略大于切割刀片的宽度，其中切割刀片首先与一个分隔槽的中点对齐，以切割一排模具 从晶片与片的一部分一起，刀片与另一个分开的凹槽的中点重新对准，以切割第二排模具和突片的其余部分。