公开(公告)号：US11411321B2

公开(公告)日：2022-08-09

申请号：US16704405

申请日：2019-12-05

Applicant: QUALCOMM Incorporated

Inventor： Jon Lasiter ,  Donald William Kidwell, Jr. ,  Ravindra Vaman Shenoy ,  Mohammad Ali Tassoudji ,  Jeremy Darren Dunworth ,  Vladimir Aparin ,  Yu-Chin Ou ,  Seong Heon Jeong

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q9/28 ,  H01Q21/26 ,  H01Q1/48

Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.

公开(公告)号：US20200336159A1

公开(公告)日：2020-10-22

申请号：US16922811

申请日：2020-07-07

Applicant: QUALCOMM Incorporated

Inventor： Haim Mendel Weissman ,  Raviv Lior ,  Xiaoyin He ,  Vladimir Aparin

IPC: H04B1/00 ,  H04W72/04 ,  H04B1/40 ,  H04B7/06

Abstract: Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.

公开(公告)号：US10081879B2

公开(公告)日：2018-09-25

申请号：US15587373

申请日：2017-05-04

Applicant: QUALCOMM Incorporated

Inventor： Yong Ju Lee ,  Vladimir Aparin

IPC: C25D7/12 ,  G01N27/447 ,  C25D3/46 ,  C25D5/48 ,  G01N27/414 ,  H01L21/285 ,  G01N27/30 ,  G01N33/487

CPC classification number: C25D7/123 ,  C25D3/46 ,  C25D5/48 ,  G01N27/301 ,  G01N27/4145 ,  G01N27/4146 ,  G01N27/44791 ,  G01N33/48721 ,  H01L21/2855

Abstract: Techniques for increasing the lifespan of a nanopore DNA sensing device are disclosed. A related method may include forming a first electrode, forming a second electrode, disposing the first electrode and second electrode within an insulator, and disposing a lipid bilayer having a nanopore between the first electrode and second electrode. The forming of the second electrode may comprise forming a silver (Ag) layer, pressing a mold into the Ag layer to form a pattern in the Ag layer, removing the mold from the Ag layer, and exposing the Ag layer to an electrolyte.

公开(公告)号：US20130335291A1

公开(公告)日：2013-12-19

申请号：US13828954

申请日：2013-03-14

Applicant: QUALCOMM INCORPORATED

Inventor： Bruce Judson ,  Cong T Nguyen ,  Peter D. Heidmann ,  Joseph Patrick Burke ,  Vladimir Aparin

IPC: H01Q1/50

CPC classification number: H01Q1/50 ,  H01Q9/16 ,  H04B1/0458 ,  H04B1/18 ,  H04B1/525 ,  H04B1/581

Abstract: A wireless device is described. The wireless device includes an antenna. The wireless device also includes a hybrid transformer. The wireless device further includes a frequency matching termination port. The frequency matching termination port provides impedance matching with the antenna at multiple frequencies. The frequency matching termination port may include multiple resistors, inductors and capacitors that can be switched in/out.

Abstract translation: 描述无线设备。 无线设备包括天线。 无线设备还包括混合变压器。 无线设备还包括频率匹配终端端口。 频率匹配终端端口以多个频率提供与天线的阻抗匹配。 频率匹配终端端口可以包括可以被切换的多个电阻器，电感器和电容器。

公开(公告)号：US12191896B2

公开(公告)日：2025-01-07

申请号：US18055339

申请日：2022-11-14

Applicant: QUALCOMM Incorporated

Inventor： Edward Wai Yeung Liu ,  Vladimir Aparin

IPC: H04B1/04 ,  H03M1/66

Abstract: Certain aspects of the present disclosure are directed to a radio frequency digital-to-analog converter (RFDAC). The RFDAC generally includes a plurality of digital-to-analog (DAC) unit cells. At least one DAC unit cell is capable of being configured in an active state or in a sleep state. For the at least one DAC unit cell, an output impedance of the DAC unit cell in the active state is equal to an output impedance of the DAC unit cell in the sleep state.

公开(公告)号：US11190224B2

公开(公告)日：2021-11-30

申请号：US16922811

申请日：2020-07-07

Applicant: QUALCOMM Incorporated

Inventor： Haim Mendel Weissman ,  Lior Raviv ,  Xiaoyin He ,  Vladimir Aparin

IPC: H04B1/00 ,  H04B15/00 ,  H04W72/04 ,  H04B1/40 ,  H04B7/06

Abstract: Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.

公开(公告)号：US10538853B2

公开(公告)日：2020-01-21

申请号：US16141927

申请日：2018-09-25

Applicant: QUALCOMM Incorporated

Inventor： Yong Ju Lee ,  Vladimir Aparin

IPC: C25D7/12 ,  G01N33/487 ,  G01N27/30 ,  H01L21/285 ,  C25D3/46 ,  C25D5/48 ,  G01N27/414 ,  G01N27/447

Abstract: Techniques for increasing the lifespan of a nanopore DNA sensing device are disclosed. A related DNA sensing device may be formed by a process comprising forming a first electrode, forming a second electrode, disposing the first electrode and second electrode within an insulator, and disposing a lipid bilayer having a nanopore between the first electrode and second electrode. The forming of the second electrode may comprise forming a silver (Ag) layer, pressing a mold into the Ag layer to form a pattern in the Ag layer, removing the mold from the Ag layer, and exposing the Ag layer to an electrolyte.

公开(公告)号：US10024818B2

公开(公告)日：2018-07-17

申请号：US15186409

申请日：2016-06-17

Applicant: QUALCOMM Incorporated

Inventor： Vladimir Aparin ,  Bo Sun ,  Joung Won Park

IPC: G01N27/414 ,  G01N27/417

Abstract: An ionic current sensor array includes a master bias generator and a plurality of sensing cells. The master bias generator is configured to generate a bias voltage. Each sensing cell includes an ionic current sensor, an integrating capacitor, a sense transistor coupled between the integrating capacitor and the ionic current sensor, and an amplifier coupled to provide a reference voltage to bias the ionic current sensor. The amplifier includes a first transistor and a second transistor. The first transistor is coupled to receive the bias voltage, and the second transistor is coupled to the first transistor to provide the reference voltage to the ionic current sensor. The second transistor is also coupled between a source of the sense transistor and the gate of the sense transistor.

公开(公告)号：US20160248451A1

公开(公告)日：2016-08-25

申请号：US14838672

申请日：2015-08-28

Applicant: QUALCOMM Incorporated

Inventor： Haim Mendel Weissman ,  Lior Raviv ,  Xiaoyin He ,  Vladimir Aparin

IPC: H04B1/00 ,  H04W72/04

Abstract: Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.

Abstract translation: 描述了用于毫米波无线通信的收发器架构的方法，系统和设备。 设备可以包括被配置为在不同频率范围内通信的两个收发器芯片模块。 第一收发器芯片模块可以包括基带子模块，第一射频前端（RFFE）组件和相关联的天线阵列。 第二收发器芯片模块可以包括第二RFFE组件和相关联的天线阵列。 第二收发器芯片模块可以与第一收发器芯片模块分离。 第二收发器芯片模块可以电耦合到第一收发器芯片模块的基带子模块。

公开(公告)号：US09025646B2

公开(公告)日：2015-05-05

申请号：US13828496

申请日：2013-03-14

Applicant: QUALCOMM Incorporated

Inventor： Vladimir Aparin

IPC: H04B1/38 ,  H04B1/40 ,  H04B1/04

CPC classification number: H04B1/40 ,  H04B1/0475 ,  H04B1/525

Abstract: A transceiver for reducing transmit signal leakage is described. The transceiver includes a downconverter that downconverts a receive signal to produce a feedback signal. The transceiver also includes a weight learning module that correlates the feedback signal with a transmit signal to obtain a weight. The transceiver further includes a transmit leakage estimator that obtains an estimated transmit leakage signal based on the weight and the transmit signal. The transceiver also includes a transmit leakage reducer that reduces the transmit leakage in the receive signal based on the estimated transmit leakage signal.

Abstract translation: 描述了一种用于减少发射信号泄漏的收发器。 收发器包括下变频器，其下变频接收信号以产生反馈信号。 收发机还包括权重学习模块，其将反馈信号与发送信号相关以获得权重。 收发器还包括发射泄漏估计器，其基于权重和发射信号获得估计的发射泄漏信号。 收发器还包括发射泄漏减少器，其基于估计的发射泄漏信号减少接收信号中的发射泄漏。