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公开(公告)号：US20200006846A1
公开(公告)日：2020-01-02
申请号：US16022851
申请日：2018-06-29
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Seong Heon JEONG , Ravindra Vaman SHENOY , Jeremy Darren DUNWORTH , Mohammad Ali TASSOUDJI
Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.
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公开(公告)号：US20190259677A1
公开(公告)日：2019-08-22
申请号：US16135906
申请日：2018-09-19
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Ravindra Vaman SHENOY , Kambiz SAMADI , Jing XIE
IPC: H01L23/29 , H01L21/768 , H01L23/48 , H01L23/538 , H01L21/56 , H01L21/02
Abstract: A device comprising a first die, a second die coupled to a first die, and a polymer planarization layer. The second die includes a side portion and a backside portion. The polymer planarization layer is coupled to the first die and the second die such that the polymer planarization layer is coupled to the side portion and the backside portion of the second die. The polymer planarization layer includes an organic polymer. The polymer planarization layer may include a self planarizing material.
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公开(公告)号：US20210400178A1
公开(公告)日：2021-12-23
申请号：US17446895
申请日：2021-09-03
Applicant: QUALCOMM Incorporated
Inventor： Russell GRUHLKE , Jon LASITER , Ravindra Vaman SHENOY , Ravishankar SIVALINGAM , Kebin LI , Khurshid Syed ALAM
Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.
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公开(公告)号：US20200344413A1
公开(公告)日：2020-10-29
申请号：US16857045
申请日：2020-04-23
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Evgeni GOUSEV , Ravindra Vaman SHENOY , Russell GRUHLKE , Khurshid Syed ALAM , Kebin LI , Edwin Chongwoo PARK
Abstract: In one example, an image sensor module comprises one or more covers having at least a first opening and a second opening, a first lens mounted in the first opening and having a first field of view (FOV) centered at a first axis having a first orientation, a second lens mounted in the second opening and having a second FOV centered at a second axis having a second orientation different from the first orientation, a first image sensor housed within the one or more covers and configured to detect light via the first lens, and a second image sensor housed within the one or more covers and configured to detect light via the second lens. The first image sensor and the second image sensor are configured to provide, based on the detected light, image data of a combined FOV larger than each of the first FOV and the second FOV.
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Patent Agency Ranking
公开(公告)号：US20170271919A1
公开(公告)日：2017-09-21
申请号：US15267639
申请日：2016-09-16
Applicant: QUALCOMM Incorporated
Inventor： William Henry VON NOVAK, III , Mei-Li CHI , Ravindra SHENOY , Rashid Ahmed Akbar ATTAR , Karim ARABI , Donald KIDWELL, JR. , Jon LASITER
CPC classification number: H02J50/05 , A61N1/3787 , H02J7/025 , H02J50/10 , H02J50/12 , H02J50/15 , H02J50/50 , H02J50/90
Abstract: A method of providing power to an implant includes: transcutaneously receiving first power wirelessly from a source transmitter by a receiver of a power relay device, the receiver of the power relay device being disposed inside a biological body and closer to a skin of the biological body than the implant is to the skin of the biological body; converting the first power into second power that has a substantially different frequency than the first power, or is of different type of power than the first power, or both; and internally coupling the second power from a transmitter of the power relay device to the implant disposed within the biological body.
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公开(公告)号：US20220279137A1
公开(公告)日：2022-09-01
申请号：US17188360
申请日：2021-03-01
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Ravindra Vaman SHENOY , Ravishankar SIVALINGAM , Russell GRUHLKE , Donald William KIDWELL , Khurshid Syed ALAM , Kebin LI
IPC: H04N5/33 , H01L27/146
Abstract: An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.
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公开(公告)号：US20220030148A1
公开(公告)日：2022-01-27
申请号：US16937397
申请日：2020-07-23
Applicant: QUALCOMM Incorporated
Inventor： Russell GRUHLKE , Ravindra Vaman SHENOY , Jon LASITER , Donald William KIDWELL , Khurshid Syed ALAM , Kebin LI
Abstract: An image sensor including a planar sensor array, a lens configured to form an optical image on the planar sensor array and characterized by a locus of focal points on a curved surface, and a cover glass with multiple thickness levels or multiple cover glasses of different sizes. The one or more cover glasses are configured to shift the locus of focal points for large field angles, such that there are multiple intersections between the planar sensor array and the locus of focal points for a large FOV, and thus multiple zones with best focus on the planar sensor array.
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公开(公告)号：US20210175636A1
公开(公告)日：2021-06-10
申请号：US16704405
申请日：2019-12-05
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Donald William KIDWELL, JR. , Ravindra Vaman SHENOY , Mohammad Ali TASSOUDJI , Jeremy Darren DUNWORTH , Vladimir Aparin , Yu-Chin OU , Seong Heon JEONG
Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.
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公开(公告)号：US20200314305A1
公开(公告)日：2020-10-01
申请号：US16521222
申请日：2019-07-24
Applicant: QUALCOMM Incorporated
Inventor： Russell GRUHLKE , Jon LASITER , Ravindra Vaman SHENOY , Ravishankar SIVALINGAM , Kebin LI , Khurshid Syed ALAM
Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.
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