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公开(公告)号：US11277559B2
公开(公告)日：2022-03-15
申请号：US16857045
申请日：2020-04-23
Applicant: QUALCOMM Incorporated
Inventor： Jon Lasiter , Evgeni Gousev , Ravindra Vaman Shenoy , Russell Gruhlke , Khurshid Syed Alam , Kebin Li , Edwin Chongwoo Park
Abstract: In one example, an image sensor module comprises one or more covers having at least a first opening and a second opening, a first lens mounted in the first opening and having a first field of view (FOV) centered at a first axis having a first orientation, a second lens mounted in the second opening and having a second FOV centered at a second axis having a second orientation different from the first orientation, a first image sensor housed within the one or more covers and configured to detect light via the first lens, and a second image sensor housed within the one or more covers and configured to detect light via the second lens. The first image sensor and the second image sensor are configured to provide, based on the detected light, image data of a combined FOV larger than each of the first FOV and the second FOV.
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公开(公告)号：US10109784B2
公开(公告)日：2018-10-23
申请号：US15262721
申请日：2016-09-12
Applicant: QUALCOMM Incorporated
Inventor： Donald William Kidwell, Jr. , Ravindra Shenoy , Jon Lasiter
IPC: H01L41/04 , B06B1/06 , H01L41/113 , H01L41/083 , H01L41/187 , H01L41/047 , H01L41/277 , H01L41/23
Abstract: Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PMUTs and the PMUT array is flexible, one or more integrated circuits configured to process the ultrasonic signals, a battery configured to provide power to the PMUT array and the one or more integrated circuits, a coupling material configured to hold the PMUT array, the one or more integrated circuits, and the battery, and a capsule configured to seal the PMUT array, the one or more integrated circuits, the battery and the coupling material within the capsule.
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公开(公告)号：US11678043B2
公开(公告)日：2023-06-13
申请号：US17446895
申请日：2021-09-03
Applicant: QUALCOMM Incorporated
Inventor： Russell Gruhlke , Jon Lasiter , Ravindra Vaman Shenoy , Ravishankar Sivalingam , Kebin Li , Khurshid Syed Alam
CPC classification number: H04N23/57 , H04N23/60 , G03H2227/02 , H04M1/0202
Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.
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公开(公告)号：US10770646B2
公开(公告)日：2020-09-08
申请号：US15443330
申请日：2017-02-27
Applicant: QUALCOMM Incorporated
Inventor： Donald William Kidwell, Jr. , Ravindra Shenoy , Jon Lasiter
IPC: H01L41/22 , H01L41/047 , A61B8/00 , H01L41/09 , H01L27/20 , H01L41/053 , H01L41/08 , H01L41/29 , H01L41/314 , H01L41/33 , B06B1/06
Abstract: Techniques and structures are provided for manufacturing a flexible PMUT array. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.
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公开(公告)号：US11450964B2
公开(公告)日：2022-09-20
申请号：US17016196
申请日：2020-09-09
Applicant: Qualcomm Incorporated
Inventor： Seong Heon Jeong , Mohammad Ali Tassoudji , Jeremy Darren Dunworth , Jon Lasiter , Ravindra Vaman Shenoy
Abstract: An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.
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Patent Agency Ranking
公开(公告)号：US11411321B2
公开(公告)日：2022-08-09
申请号：US16704405
申请日：2019-12-05
Applicant: QUALCOMM Incorporated
Inventor： Jon Lasiter , Donald William Kidwell, Jr. , Ravindra Vaman Shenoy , Mohammad Ali Tassoudji , Jeremy Darren Dunworth , Vladimir Aparin , Yu-Chin Ou , Seong Heon Jeong
Abstract: An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.
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公开(公告)号：US11711594B2
公开(公告)日：2023-07-25
申请号：US17188360
申请日：2021-03-01
Applicant: QUALCOMM Incorporated
Inventor： Jon Lasiter , Ravindra Vaman Shenoy , Ravishankar Sivalingam , Russell Gruhlke , Donald William Kidwell , Khurshid Syed Alam , Kebin Li
IPC: H04N5/33 , H01L27/146 , H04N23/11
CPC classification number: H04N23/11 , H01L27/14618 , H01L27/14621 , H01L27/14627
Abstract: An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.
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公开(公告)号：US11223116B2
公开(公告)日：2022-01-11
申请号：US16022851
申请日：2018-06-29
Applicant: QUALCOMM Incorporated
Inventor： Jon Lasiter , Seong Heon Jeong , Ravindra Vaman Shenoy , Jeremy Darren Dunworth , Mohammad Ali Tassoudji
Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.
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9.发明授权公开(公告)号：US11115576B2
公开(公告)日：2021-09-07
申请号：US16521222
申请日：2019-07-24
Applicant: QUALCOMM Incorporated
Inventor： Russell Gruhlke , Jon Lasiter , Ravindra Vaman Shenoy , Ravishankar Sivalingam , Kebin Li , Khurshid Syed Alam
Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.
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公开(公告)号：US20170252777A1
公开(公告)日：2017-09-07
申请号：US15443330
申请日：2017-02-27
Applicant: QUALCOMM Incorporated
Inventor： Donald William Kidwell, JR. , Ravindra Shenoy , Jon Lasiter
IPC: B06B1/06 , H01L41/08 , H01L41/053 , A61B8/00 , H01L41/29 , H01L41/314 , H01L41/33 , H01L27/20 , H01L41/047
Abstract: Embodiments of a flexible PMUT array and methods for manufacturing the same are disclosed. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.
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