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    Sensor device
    1.
    发明授权
    Sensor device 有权

    公开(公告)号：US10109784B2

    公开(公告)日：2018-10-23

    申请号：US15262721

    申请日：2016-09-12

    Applicant: QUALCOMM Incorporated

    Inventor： Donald William Kidwell, Jr. ,  Ravindra Shenoy ,  Jon Lasiter

    IPC: H01L41/04 ,  B06B1/06 ,  H01L41/113 ,  H01L41/083 ,  H01L41/187 ,  H01L41/047 ,  H01L41/277 ,  H01L41/23

    Abstract: Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PMUTs and the PMUT array is flexible, one or more integrated circuits configured to process the ultrasonic signals, a battery configured to provide power to the PMUT array and the one or more integrated circuits, a coupling material configured to hold the PMUT array, the one or more integrated circuits, and the battery, and a capsule configured to seal the PMUT array, the one or more integrated circuits, the battery and the coupling material within the capsule.

    INTEGRATED DEVICE PACKAGE COMPRISING A MAGNETIC CORE INDUCTOR WITH PROTECTIVE RING EMBEDDED IN A PACKAGE SUBSTRATE
    4.
    发明申请
    INTEGRATED DEVICE PACKAGE COMPRISING A MAGNETIC CORE INDUCTOR WITH PROTECTIVE RING EMBEDDED IN A PACKAGE SUBSTRATE 有权
    包含嵌入在基片中的保护环的磁芯电感器的集成器件封装

    公开(公告)号：US20160233153A1

    公开(公告)日：2016-08-11

    申请号：US14836733

    申请日：2015-08-26

    Applicant: QUALCOMM Incorporated

    Inventor： Donald William Kidwell, JR. ,  Ravindra Shenoy ,  Mete Erturk ,  Layal Rouhana

    IPC: H01L23/498 ,  H01L49/02 ,  H01L21/48 ,  H01L23/522 ,  H01L23/58

    CPC classification number: H01L23/49838 ,  B23K26/0661 ,  H01F17/0033 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/585 ,  H01L28/10 ,  H01L2224/16227 ,  H01L2924/15311

    Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.

    Abstract translation: 集成器件封装包括管芯和封装衬底。 封装衬底包括至少一个电介质层（例如芯层，预镀层），电介质层中的磁芯，被配置为作为第一保护环工作的第一多个互连件和被构造成操作的第二多个互连件 作为第一电感器。 所述第二多个互连件定位在所述封装衬底中以至少部分地围绕所述磁芯。 来自第二多个互连的至少一个互连也是第一多个互连的一部分。 在一些实施方案中，第一保护环是不连续的保护环。 在一些实施方式中，第一电感器是螺线管电感器。 在一些实施方案中，磁芯包括载体，第一磁性层和第二磁性层。

    Release hole plus contact via for fine pitch ultrasound transducer integration
    5.
    发明授权
    Release hole plus contact via for fine pitch ultrasound transducer integration 有权

    公开(公告)号：US10722918B2

    公开(公告)日：2020-07-28

    申请号：US15254593

    申请日：2016-09-01

    Applicant: QUALCOMM Incorporated

    Inventor： Donald William Kidwell, Jr. ,  Ravindra Shenoy ,  Jon Lasiter

    IPC: B81B7/04 ,  H01L41/332 ,  B06B1/02 ,  B81C1/00 ,  B81B3/00 ,  B06B1/06

    Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

    RELEASE HOLE PLUS CONTACT VIA FOR FINE PITCH ULTRASOUND TRANSDUCER INTEGRATION
    7.
    发明申请
    RELEASE HOLE PLUS CONTACT VIA FOR FINE PITCH ULTRASOUND TRANSDUCER INTEGRATION 审中-公开
    通过超声波超声波传感器集成来释放孔加入

    公开(公告)号：US20170066014A1

    公开(公告)日：2017-03-09

    申请号：US15254593

    申请日：2016-09-01

    Applicant: QUALCOMM Incorporated

    Inventor： Donald William Kidwell, JR. ,  Ravindra Shenoy ,  Jon Lasiter

    IPC: B06B1/02 ,  H01L41/332 ,  B81B7/04 ,  B06B1/06 ,  B81C1/00 ,  B81B3/00

    CPC classification number: B06B1/0292 ,  B06B1/0622 ,  B81B3/0021 ,  B81B3/0097 ,  B81B7/04 ,  B81C1/00134 ,  B81C1/00214 ,  H01L41/332

    Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

    Abstract translation: 提出了用于高密度微机电系统（MEMS）的方法，系统，计算机可读介质和装置。 在一些实施例中，用于在基底上制造微电子机械装置的方法可以包括通过装置的层蚀刻释放通路。 该方法还可以包括使用释放通道作为导管在装置的层中产生空腔，以进入空腔的期望位置，空腔使得能够移动装置的换能器。 该方法然后可以包括将低阻抗导电材料沉积到释放通孔中以形成通过该层的导电路径。 最后，该方法可以包括将导电材料电耦合到换能器的电极。

    Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate
    8.
    发明授权
    Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate 有权
    集成器件封装，其包括具有嵌入封装衬底中的保护环的磁芯电感器

    公开(公告)号：US09496213B2

    公开(公告)日：2016-11-15

    申请号：US14836733

    申请日：2015-08-26

    Applicant: QUALCOMM Incorporated

    Inventor： Donald William Kidwell, Jr. ,  Ravindra Shenoy ,  Mete Erturk ,  Layal Rouhana

    IPC: H01L27/08 ,  H01L23/498 ,  H01F17/00 ,  H01L21/48 ,  H01L23/522 ,  H01L23/58 ,  H01L49/02 ,  B23K26/06 ,  H01L23/50

    CPC classification number: H01L23/49838 ,  B23K26/0661 ,  H01F17/0033 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/585 ,  H01L28/10 ,  H01L2224/16227 ,  H01L2924/15311

    Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.

    Abstract translation: 集成器件封装包括管芯和封装衬底。 封装衬底包括至少一个电介质层（例如芯层，预镀层），电介质层中的磁芯，被配置为作为第一保护环工作的第一多个互连件和被构造成操作的第二多个互连件 作为第一电感器。 所述第二多个互连件定位在所述封装衬底中以至少部分地围绕所述磁芯。 来自第二多个互连的至少一个互连也是第一多个互连的一部分。 在一些实施方案中，第一保护环是不连续的保护环。 在一些实施方式中，第一电感器是螺线管电感器。 在一些实施方案中，磁芯包括载体，第一磁性层和第二磁性层。

    FLEXIBLE PMUT ARRAY
    10.
    发明申请
    FLEXIBLE PMUT ARRAY 审中-公开

    公开(公告)号：US20170252777A1

    公开(公告)日：2017-09-07

    申请号：US15443330

    申请日：2017-02-27

    Applicant: QUALCOMM Incorporated

    Inventor： Donald William Kidwell, JR. ,  Ravindra Shenoy ,  Jon Lasiter

    IPC: B06B1/06 ,  H01L41/08 ,  H01L41/053 ,  A61B8/00 ,  H01L41/29 ,  H01L41/314 ,  H01L41/33 ,  H01L27/20 ,  H01L41/047

    Abstract: Embodiments of a flexible PMUT array and methods for manufacturing the same are disclosed. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.

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