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公开(公告)号：US09207732B1
公开(公告)日：2015-12-08
申请号：US14630682
申请日：2015-02-25
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yi-Chieh Chen
CPC classification number: G06F1/206
Abstract: Embodiments generally relate to thermal management in a computing device. The present technology discloses techniques that can enable an effective and reliable control of a fan speed using various factors such as a power loading value provided by a power supply unit. Power loading values can indicate a level of current flowing through the device, which is generally proportional to the amount of heat dissipated by such device.
Abstract translation: 实施例通常涉及计算设备中的热管理。 本技术公开了使用诸如由电源单元提供的功率负载值的各种因素能够有效和可靠地控制风扇速度的技术。 功率负载值可以指示流过设备的电流水平，其通常与由这种设备消散的热量成比例。
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公开(公告)号：US12010812B2
公开(公告)日：2024-06-11
申请号：US17701333
申请日：2022-03-22
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Ching-Yi Shih , Po-Cheng Shen
CPC classification number: H05K7/20181 , H05K5/0256 , H05K5/03 , H05K7/20145 , H05K7/20154 , F04D29/703
Abstract: A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.
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公开(公告)号：US11778787B2
公开(公告)日：2023-10-03
申请号：US17587484
申请日：2022-01-28
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Yan-Kuei Chen , Yangtzu Lee
CPC classification number: H05K7/207 , H05K7/20181
Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.
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公开(公告)号：US11755084B2
公开(公告)日：2023-09-12
申请号：US17380845
申请日：2021-07-20
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang , Tzu-Hsuan Hsu
CPC classification number: G06F1/206 , H05K7/20281 , G06F2200/201
Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.
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公开(公告)号：US11431415B2
公开(公告)日：2022-08-30
申请号：US17119430
申请日：2020-12-11
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang
Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.
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Patent Agency Ranking
公开(公告)号：US11013151B1
公开(公告)日：2021-05-18
申请号：US16732107
申请日：2019-12-31
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Ming-Hung Tsai , Yan-Kuei Chen , Yi-He Huang
IPC: H05K7/20
Abstract: A chassis includes a receiver frame for receiving a plurality of electronic components. The receiver frame includes a front end, a rear end, a top wall, and a bottom wall. The receiver frame also includes one or more apertures positioned in the bottom wall or the top wall at a location adjacent to the front end. The receiver frame also includes a plurality of air flow channels coupling openings in the front end to the one or more apertures such that air flow from the openings of the front end is first directed towards the rear end across the plurality of electronic components before being directed back towards the front end and then exiting the one or more apertures.
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公开(公告)号：US10712795B2
公开(公告)日：2020-07-14
申请号：US16047382
申请日：2018-07-27
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yi-Chieh Chen , Yueh-Chang Wu , Ching-Yi Shih
Abstract: Systems and methods are provided for controlling two or more PSUs of a server system. An exemplary method comprises first determining whether the PSUs are switched on to an AC power source. If the PSUs are found not switched on to an AC power source, the method further comprises restarting the AC power source for the PSUs and completing a software-based recovery process. If the PSUs are found to be switched on to an AC power source, the method further comprises determining whether the PSUs meet a predefined criterion. If the PSUs do meet a predefined criterion, the method further comprises disabling a cold-redundancy mode for the PSUs. If the PSUs do not meet a predefined criterion, the method further comprises starting a wake-up process for a first PSU from a cold-redundancy mode.
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8.发明授权公开(公告)号：US11974413B2
公开(公告)日：2024-04-30
申请号：US17730913
申请日：2022-04-27
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Ching-Yi Shih , Kang Hsu
CPC classification number: H05K7/20409 , G06F1/206 , H05K5/06
Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.
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公开(公告)号：US11477915B2
公开(公告)日：2022-10-18
申请号：US17149151
申请日：2021-01-14
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang , Tzu-Hsuan Hsu
IPC: H05K7/20
Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.
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公开(公告)号：US11051421B1
公开(公告)日：2021-06-29
申请号：US16818019
申请日：2020-03-13
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Ching-Yi Shih
Abstract: A cooling assembly includes a primary plate, a secondary plate, and a padding layer. The primary plate includes a body, a first arm, and a second arm. The first arm and the second arm of the primary plate extend outwardly in opposite directions from the body of the primary plate. The secondary plate also includes a body, a first arm, and a second arm. The first arm and the second arm of the secondary plate extend outwardly in opposite directions from the body of the secondary plate. The padding layer is inserted between the primary plate and the secondary plate. The padding layer directly contacts a heat-generating electrical component secured between the primary plate and the secondary plate.
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